HYDRA PRO LFO
- Chemical Family
- Rosins
HYDRA PRO LFO™ is an organic solder paste and tacky paste flux primarily used as a soldering solution for stencil applications. Classified under the rosin chemical family, it meets European REACH regulations for compliance. Notably, it features water solubility, making it convenient for various soldering tasks while ensuring regulatory adherence.
Other characteristics
- Brand
- HYDRA
- Features
- Water Soluble
- Product Type
- Solder Paste
- Application Area
Ball Grid Array (BGA), Chip Scale Packaging (CSP), Land Grid Array (LGA), Quad Flat No-Lead (QFN), Stencil; Ball Grid Array (BGA); Chip Scale Packaging (CSP); Land Grid Array (LGA); Quad Flat No-Lead (QFN); Stencil
- Keynotes
Organic-based water-soluble - ORH1; World-class printing, instant response; High activity BGA, CSP, QFN, LGA; Low voiding. Clear residue. Optimal viscosity. Excellent pin transfer. REACH-complaint; Superior dispensing or stencil printing; Sharp definition at high-speeds; Low solder balling and graping. Long stencil life; Easy to clean using IPA, solvents, water-based saponifiers, vapor degreaser
- Printing
Optimal print definition for fine pitch applications. Long stencil life of this product virtually eliminates waste of solder paste. For mesh/size determination refer to the Pitch Requirements chart below:
- Viscosity
- * Malcom @ 10 RPM @ 25°C x10³ g/cm/s
- Availability
HydraPRO-LF™ - available in many alloys including high reliability solder: Sn42Bi58, Sn42Bi57.6Ag0.4, Sn42Bi57Ag1, Sn96.5Ag3.5, Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7,Sn99.3Cu0.7, Sn100c, Sn100cv, LF-C2
- Technology
- Ready-to-Use Products
- Packaging Type
- Cartridges
- Jars
- Syringe
- Product Families
Ready-to-Use Products — Other Ready-to-Use Products
- Printer Operations
Stencil printer does not require any specific optimization, should be fully adjustable based on standard in-house process requirements, including high-speed printers; Print Speed: 20-200 mm/sec (add pressure for speed) Squeegee Pressure: 70-540 g/cm of blade (add for speed) Stencil Vac/Wipe: Every 10-25 prints or as necessary; Automated and vacuum cleaning systems for both stencil and misprinted boards. Manual cleaning using Isopropyl alcohol (IPA), co-solvents and/or ultrasonic scrubbers, vapor degreaser.
- Packaging Information
- Options with various viscosity and metal load for stencil printing and dispensing applications:
- Printing
- Jars, 1/4 NPT nozzle cartridges
- Dispensing
- Syringes, ProFlow cassettes
- Certifications and Compliance
- REACH (Europe)
- Ready to Use Product Features
- Water Soluble
- Shelf LIfe
Refrigerated storage at 5-7°C will prolong the solder paste shelf life to no less than 6 months. Solder Paste should be allowed to reach ambient temperature, normalize for about 6-8 hours before use. Tacky flux has 24 months shelf life stored in room temperature. Refrigeration won't extend shelf life. Normalize for 4-6 hours if stored refrigerated. Paste/flux in syringes and cartridges should be kept vertically, dispensing tip pointing down.. Note :NEVER FREEZE SOLDER PASTE / FLUX!
Technical data
Table 1 of 1
1 row| Characteristic | Value | Unit |
|---|---|---|
| Stencil Life (at 30 - 70% R/H & 20 - 25°C) | max. 12 | hours |
