STIRRI HT
- Chemical Family
- Rosins
STIRRI HT™ is a high-performance solder paste and tacky flux designed for demanding applications. Crafted with rosin-based chemistry, STIRRI HT™ ensures exceptional results in various tasks, including semiconductors, stencil work, and printed circuit boards. With its reliable performance and versatility, STIRRI HT™ is your go-to solution for precise soldering needs.
Product families
- Printed Circuit Boards (PCBs)
Other characteristics
- Brand
- STIRRI
- Product Type
- Solder Paste
- Application Area
- Printed Circuit Boards, Semiconductors, Stencil
- Printed Circuit Boards
- Semiconductors
- Stencil
- Markets
- Electrical & Electronics
- Keynotes
Rosin-based low-activity ROL0 (No-clean); Semiconductors, extended 350°C high- temperature reflow profiles, multi-step assemblies.; 350°C-450°C Hot Air Rework flux with high-solids content fine-tuned for clarity & minimum top-ups.; Top-class longevity and activity for leaded or lead-free alloys with wide application range.; Low voiding. Long stencil life & process window.; Exceptional printing edge definition.; Excellent wetting on most PCB finishes.; Compatible with enclosed printing heads.
- Printing
Optimal print definition for fine pitch applications. Long stencil life of this product virtually eliminates waste of solder paste. For mesh/size determination refer to the Pitch Requirements chart below:
- Viscosity
- * Malcom @ 10 RPM @ 25°C x103 g/cm/s
- Availability
STIRRI-HT™ - available in the following alloys of a low-oxide, spherical and uniformly sized powder: Sn10Pb88Ag2, Sn95Ag5, Sn95Sb5 & Sn5Pb93.5Ag1.5
- Technology
- Ready-to-Use Products
- Packaging Type
- Cartridges
- Jars
- Syringe
- Product Families
Ready-to-Use Products — Other Ready-to-Use Products
- Printer Operations
Stencil printer does not require any specific optimization, should be fully adjustable based on standard in-house process requirements, including high-speed printers; Print Speed: 20-200 mm/sec (add pressure for speed) Squeegee Pressure: 70-540 g/cm of blade (add for speed) Stencil Vac/Wipe: Every 10-25 prints or as necessary; Automated and vacuum cleaning systems for both stencil and misprinted boards. Manual cleaning using Isopropyl alcohol (IPA), co-solvents and/or ultrasonic scrubbers, vapor degreaser.
- Packaging Information
- Options with various viscosity and metal load for stencil printing and dispensing applications:
- Printing
- Jars, 1/4 NPT nozzle cartridges
- Dispensing
- Syringes, ProFlow cassettes
- Shelf LIfe
Refrigerated storage at 5-7°C will prolong the solder paste shelf life to no less than 6 months. Solder Paste should be allowed to reach ambient temperature, normalize for about 6-8 hours before use. Tacky flux has 24 months shelf life stored in room temperature. Refrigeration won't extend shelf life. Normalize for 4-6 hours if stored refrigerated. Paste/flux in syringes and cartridges should be kept vertically, dispensing tip pointing down.. Note :Never freeze solder paste / flux!
Technical data
Table 1 of 1
1 row| Characteristic | Value | Unit |
|---|---|---|
| Stencil Life (at 30 - 70% R/H & 20 - 25°C) | max. 12 | hours |
