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SOLLAFORM 2009 LF

Chemical Family
Polyamides

SOLLAFORM 2009 LF features a Polyacetal Copolymer Compound, Low Coefficient of Friction. Intended for injection molding. Fluidity Index 9 g/10 "

Product families

Applications

Applications
  • Consumer Goods — Housewares
Automotive & Transportation — Automotive
  • Exterior & Body
  • Interior
  • Other Automotive Applications
  • Seating
Building & Construction — Building Materials
  • Structural Components
Industrial — Chemical & Industrial Manufacturing
  • Other Industrial Applications
Electrical & Electronics — Parts & Components
  • Other Parts & Components

Product Families

Plastics — Engineering & Specialty Polymers
  • Polyamides

Other characteristics

Brand
SOLLAFORM
Polymer Name
Polyacetal Copolymer (POM)
Processing Methods
Injection Molding
Markets
  • Automotive & Transportation
  • Building & Construction
  • Consumer Goods
  • Electrical & Electronics
  • Industrial
Technology
Plastics
Main Properties

SOLLAFORM 2009 LF presents properties typical of Poly Acetal Copolymers • Excellent Dimensional Stability • Good Mechanical Properties • Good Thermal Resistance up to 100 OC continuous • Low Coefficient of Friction • High Stiffness

Material Features
  • Dimensional Stability
  • Good Mechanical Properties
  • Good Thermal Stability
  • High Impact Resistance
  • High Rigidity
  • High Stiffness
  • Low Friction
Plastics and Elastomers End Uses
  • Bearings
  • Fasteners
  • Kitchenware
Plastics and Elastomers Functions
Resin
Plastics and Elastomers Processing Methods
Injection Molding

Technical data

Table 1 of 4

1 row
CharacteristicValueUnitMethod
Specific Weight1.41g/cm³ISO D792

Table 2 of 4

7 rows
CharacteristicValueUnitMethod
Tensile Strength64MPaISO D638
Traction Module2800MPaISO D638
Elongation At Break3%ISO D638
Bending Strength80MPaISO D790
Reflection Module2500MPaISO D790
Rockwell Hardness75ClimbISO D785
Izod Cp Notched Impact Resistance58J/MISO D256

Table 3 of 4

4 rows
CharacteristicValueUnitMethod
Melting Temperature166ºC—
Continuous Heat Resistance80ºC—
Deformation Temperature Under Load 1.82 Mpa95ºCISO D648
Deformation Temperature Under Load 0.46 Mpa115ºCISO D648

Table 4 of 4

1 row
CharacteristicValueUnit
Shrinkage In Molding2.2-2.5%

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