Xytron™ G3080R
- Chemical Family
- Polyphenylene Sulfide (PPS)
Xytron™ G3080R is a high-performance plastic compound from Envalior that is based on PPS (polyphenylene sulfide). It offers extremely good chemical resistance, dimensional stability, intrinsic flame retardancy, and high stiffness. Because of its outstanding properties, it contributes to excellent performance in many different applications. A suitable processing technology for the product is injection molding.
Product families
- High Performance Thermoplastics
Other characteristics
- Brand
- Xytron
- Polymer Name
- Polyphenylene Sulfide (PPS)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 10000.0 - 10000.0 MPa
- Processing Methods
- Injection Molding
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Flame Rating
- UL 94 V0
- Technology
- Plastics
- Packaging Type
- Bags
- Boxes
- Silos
- Super Sacks
- Quality Standards
- UL Yellow Card (E467723)
- Material Features
- Chemical Resistant
- Dimensional Stability
- Excellent Mold Release
- Fatigue Resistant
- Flame Retardant
- Heat Resistance
- High Dielectric Strength
- High Temperature Strength
- Certifications and Compliance
- ISO 14001
- OHSAS
- REACH (Europe)
- UL 94
- Plastics and Elastomers End Uses
- ADAS Sensors
- Automotive Electronics
- Bushings
- Housings
- Position Sensor
- Speed Sensor
- Temperature Sensor
- Water Pumps
- Plastics and Elastomers Functions
- Resin
- Grade Coding for Injection Molding
- Xytron™ PPS reinforced injection molding grades.
- Application Data
High design flexibility for molding thin-walled parts; High continuous use temperatures (CUT) for superior thermal load management; Excellent processing capabilities supporting easy injection molding; High hydrolytic and chemical resistance to extend part lifetimes; Cost-effective low Dk and Dk radome solutions; Medium conductivity grades minimizing reflections in midframes; High electric and thermal conductivity grades for back covers; Laser-welding options for rapidly bonding radomes and back covers
Technical data
Table 1 of 6
31 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus | 12000 | MPa | ISO 527-1/-2 |
| Tensile Modulus (-40°C) | 12000 | MPa | ISO 527-1/-2 |
| Tensile Modulus (120°C) | 4700 | MPa | ISO 527-1/-2 |
| Tensile Modulus (160°C) | 3500 | MPa | ISO 527-1/-2 |
| Tensile Modulus (200°C) | 2950 | MPa | ISO 527-1/-2 |
| Stress at Break | 170 | MPa | ISO 527-1/-2 |
| Stress at Break (-40°C) | 185 | MPa | ISO 527-1/-2 |
| Stress at Break (120°C) | 70 | MPa | ISO 527-1/-2 |
| Stress at Break (160°C) | 55 | MPa | ISO 527-1/-2 |
| Stress at Break (200°C) | 45 | MPa | ISO 527-1/-2 |
| Strain at Break | 2 | % | ISO 527-1/-2 |
| Strain at Break (at -40°C) | 2 | % | ISO 527-1/-2 |
Table 2 of 6
16 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (10°C/min) | 280 | °C | ISO 11357-1/-3 |
| Glass Transition Temperature (at 10°C/min) | 90 | °C | ISO 11357-1/-2 |
| Temperature of Deflection Under Load (1.80 MPa) | 265 | °C | ISO 75-1/-2 |
| Temperature of Deflection Under Load (0.45 MPa) | 280 | °C | ISO 75-1/-2 |
| Temperature of Deflection Under Load (8.00 MPa) | 185 | °C | ISO 75-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.18 | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (normal) | 0.5 | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel, above Tg) | 0.18 | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (normal, above Tg) | 1.2 | E-4/°C | ISO 11359-1/-2 |
| Burning Behaviour (at 3.0 mm Nominal Thickness) | UL V-0 | class | IEC 60695-11-10 |
| Relative Temperature Index (Electrical, 0.4 mm) | 130 | °C | UL746B |
| Relative Temperature Index (Electrical, 3 mm) | 130 | °C | UL746B |
Table 3 of 6
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Relative Permittivity (1GHz) | 3.8 | — | IEC 60250 |
| Relative Permittivity (5GHz) | 3.8 | — | IEC 60250 |
| Dissipation Factor (1GHz) | 30 | E-4 | IEC 60250 |
| Dissipation Factor (5GHz) | 45 | E-4 | IEC 60250 |
| Volume Resistivity | >1E13 | Ohm*m | IEC 62631-3-1 |
| Surface Resistivity | >1E15 | Ohm | IEC 62631-3-2 |
| Electric Strength | 34 | kV/mm | IEC 60243-1 |
| Comparative Tracking Index | 175 | V | IEC 60112 |
Table 4 of 6
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Water Absorption in Water (at 23°C after 24h) | 0.05 | % | ISO 62 |
| Humidity Absorption | 0.05 | % | Sim. to ISO 62 |
| Density | 1550 | kg/m³ | ISO 1183 |
Table 5 of 6
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Molding Shrinkage (parallel) | 0.21 | % | ISO 294-4 |
| Molding Shrinkage (normal) | 0.65 | % | ISO 294-4 |
Химическая стойкость
416 rows| Characteristic | Value | Unit |
|---|---|---|
| Other | 1% nonylphenoxy-polyethyleneoxy ethanol in water at 23°C | resistant |
| Other | 50% Oleic acid + 50% Olive Oil at 23°C | resistant |
| Other | Acetaldehyde (40% by mass) at 23°C | resistant |
| Other | Acetamide (50% by mass) at 23°C | resistant |
| Other | Acetamide (50% by mass) at >140°C | resistant |
| Other | Acetic acid (10% by mass) at 100°C | resistant |
| Other | Acetic acid (10% by mass) at 23°C | resistant |
| Acids | Acetic Acid (5% by mass) at 23°C | resistant |
| Other | Acetic acid (95% by mass) at 23°C | resistant |
| Ketones | Acetone at 23°C | resistant |
| Other | Acetophenone at 23°C | resistant |
| Other | Acetyl chloride at 23°C | resistant |
