ForTii® XS81B
ForTii® XS81B is a breakthrough high-temperature polyamide with halogen-free and halogen-containing flame retardant grades and a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties. It is mainly used for demanding applications in the electronics, lighting, automotive, white goods, industrial, and aerospace industries. It has excellent impact resistance and high stiffness. Its good processing ability allows for high cosmetic requirements and good bonding in various painting processes. It is very suitable for mobile phone middle frame applications due to its low warpage and excellent performance in tumbling tests. It is 50% glass-reinforced, PA4T, and is best suited for injection molding.
Product families
- Polyamides
Other characteristics
- Brand
- ForTii®
- Polymer Name
- Polyphthalamide (PPA)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 16500.0 - 16500.0 MPa
- Processing Methods
- Injection Molding
- Markets
- Consumer Goods
- Electrical & Electronics
- Flame Rating
- UL 94 HB
- Technology
- Plastics
- Packaging Type
- Bags
- Boxes
- Silos
- Super Sacks
- Quality Standards
- UL Yellow Card (E47960)
- Material Features
- Easier Processing
- Heat Resistance
- UL Flame Rated
- Certifications and Compliance
- ISO 14001
- OHSAS
- REACH (Europe)
- UL 94
- Camera Holder Application Data
ForTii® PA4T allows for reliable solutions due to its excellent high heat resistance (to endure the PVD process, even under 180°C & 60min) and due to its high bonding force of 120N with metal (PBT only 80N); ForTii® PA4T allows for appealing solutions due to its good cosmetic performance (no fibers floating on surface); ForTii® PA4T allow for cost effective solutions due to its good processability and high flowability enabling thin walled designs
- Plastics and Elastomers End Uses
- Antenna Splitters
- Camera Applications
- Camera Holder
- Medium Voltage Circuit Breakers
- Medium Voltage Circuit Breakers Embedded Pole
- Robotics
- Plastics and Elastomers Functions
- Resin
- Antenna Splitters Application Data
ForTii® XS81B allows for reliable solutions due to its excellent performance under high-temperature and chemical processing and due to its high strength and tenacity implying high resistance to constant pulling and falling of the phones. ForTii® XS81B allows for cost effective solutions due to its high flowability facilitating thus the insert molding process
- Plastics and Elastomers Processing Methods
- Injection Molding
- Medium Voltage Circuit Breakers Application Data
ForTii® PA4T allows for more sustainable solutions in end-products due to lower CO₂ footprint as compared to solutions with epoxy Xlink agent. ForTii® PA4T allows for potential system cost reduction opportunities due to part integration possibilities , possible thinner wall design withlower profiles possibilities, reduced cycle times with lower production losses
Technical data
Table 1 of 5
16 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus | 17500 / 18500 | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness, 1mm) | 17500 / - | MPa | ISO 527-1/-2 |
| Stress at Break | 280 / 230 | MPa | ISO 527-1/-2 |
| Stress at Break, at low thickness | 270 / - | MPa | ISO 527-1/-2 |
| Stress at Break (Thickness tested) | 1 / - | mm | ISO 527-1/-2 |
| Strain at Break | 2.5 / 2.3 | % | ISO 527-1/-2 |
| Strain at Break, at low thickness | 2.6 / - | % | ISO 527-1/-2 |
| Strain at Break (Thickness tested) | 1 / - | mm | ISO 527-1/-2 |
| Flexural Modulus | 16500 / 17500 | MPa | ISO 178 |
| Flexural Strength | 400 / 350 | MPa | ISO 178 |
| Charpy Impact Strength (at +23°C) | 90 / 75 | kJ/m² | ISO 179/1eU |
| Charpy Notched Impact Strength (at +23°C) | 14.5 / 12.5 | kJ/m² | ISO 179/1eA |
Table 2 of 5
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (10°C/min) | 315 / * | °C | ISO 11357-1/-3 |
| Temperature of Deflection Under Load (1.80 MPa) | 245 / * | °C | ISO 75-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.16 / * | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (normal) | 0.48 / * | E-4/°C | ISO 11359-1/-2 |
| Burning Behaviour (at 3 / * mm Nominal Thickness) | UL HB / * | class | IEC 60695-11-10 |
Table 3 of 5
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Water Absorption | 4.2 / * | % | Sim. to ISO 62 |
| Humidity Absorption | 1.6 / * | % | Sim. to ISO 62 |
| Density | 1630 / - | kg/m³ | ISO 1183 |
Table 4 of 5
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Molding Shrinkage (parallel) | 0.2 / * | % | ISO 294-4 |
| Molding Shrinkage (normal) | 0.7 / * | % | ISO 294-4 |
| Spiral Flow Length 1.0 mm 1000 bar | 70 / * | mm | — |
Химическая стойкость
384 rows| Characteristic | Value | Unit |
|---|---|---|
| Other | Acetaldehyde (40% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at >140°C | not resistant |
| Other | Acetic acid (10% by mass) at 100°C | not resistant |
| Other | Acetic acid (10% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetic acid (95% by mass) at 23°C | not resistant |
| Other | Acetic anhydride | limited resistant, tests necessary to verify |
| Ketones | Acetone at 23°C | resistant |
| Other | Acetonitrile | resistant |
| Other | Acetophenone at 23°C | resistant |
| Other | Acetyl chloride at 23°C | not resistant |
| Other | Acetylene at 23°C | resistant |
