ForTii® NMX33

ForTii® NMX33 is a breakthrough high-temperature polyamide with halogen-free and halogen-containing flame retardant grades and a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties. It is mainly used for demanding applications in the electronics, lighting, automotive, white goods, industrial, and aerospace industries. It offers excellent adhesion to NMT-treated metals and high mechanical performance in metal-plastic bonding. ForTii® NMX33 also has a high HDT, resulting in good thermal resistance and supporting high-temperature secondary processes such as high-temperature PVD. It is 50% glass-reinforced, PA4T, and suited for injection Molding.

Properties

Mobile Phone Mid-Frame Application Data: Achieves high 45 MPa adhesion with appropriate NMT treated stainless steel / titanium surface; Higher thermal stability, which supports higher temp PVD process; High PVD processing can improve throughput; Greater color selection and better durability of product

Product families

Applications

Consumer Goods — Appliances & Electronics

Electrical & Electronics — Devices & Assemblies

Consumer Electronics

Product Families

Plastics — Engineering & Specialty Polymers

Polyamides

Other characteristics

Brand: ForTii®
Polymer Name: Polyphthalamide (PPA)
Fillers Included: Glass Fiber
Flexural Modulus: 16500.0 - 16500.0 MPa
Processing Methods: Injection Molding
Markets: Consumer Goods
Electrical & Electronics
Flame Rating: UL 94 HB
Technology: Plastics
Packaging Type: Bags
Boxes
Silos
Super Sacks
Quality Standards: UL Yellow Card (E47960)
Material Features: Heat Resistance
UL Flame Rated
Certifications and Compliance: ISO 14001
OHSAS
REACH (Europe)
UL 94
Plastics and Elastomers End Uses: Mobile Phone Mid-Frame
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 6

16 rows

Characteristic	Value	Unit	Method
Tensile Modulus	17500 / 18500	MPa	ISO 527-1/-2
Tensile Modulus (Low Thickness, 1mm)	17500 / -	MPa	ISO 527-1/-2
Stress at Break	280 / 240	MPa	ISO 527-1/-2
Stress at Break, at low thickness	270 / -	MPa	ISO 527-1/-2
Stress at Break (Thickness tested)	1 / -	mm	ISO 527-1/-2
Strain at Break	2.4 / 2.3	%	ISO 527-1/-2
Strain at Break, at low thickness	2.5 / -	%	ISO 527-1/-2
Strain at Break (Thickness tested)	1 / -	mm	ISO 527-1/-2
Flexural Modulus	16500 / 17500	MPa	ISO 178
Flexural Strength	400 / 350	MPa	ISO 178
Charpy Impact Strength (at +23°C)	90 / 75	kJ/m²	ISO 179/1eU
Charpy Notched Impact Strength (at +23°C)	14.5 / 12.5	kJ/m²	ISO 179/1eA

Table 2 of 6

5 rows

Characteristic	Value	Unit	Method
Melting Temperature (10°C/min)	315 / *	°C	ISO 11357-1/-3
Temperature of Deflection Under Load (1.80 MPa)	245 / *	°C	ISO 75-1/-2
Coefficient of Linear Thermal Expansion (parallel)	0.2 / *	E-4/°C	ISO 11359-1/-2
Coefficient of Linear Thermal Expansion (normal)	0.5 / *	E-4/°C	ISO 11359-1/-2
Burning Behaviour (at 3 / * mm Nominal Thickness)	UL HB / *	class	IEC 60695-11-10

Table 3 of 6

2 rows

Characteristic	Value	Unit	Method
Relative Permittivity (1GHz)	4.3 / -	—	IEC 60250
Dissipation Factor (1GHz)	140 / -	E-4	IEC 60250

Table 4 of 6

3 rows

Characteristic	Value	Unit	Method
Water Absorption	4.2 / *	%	Sim. to ISO 62
Humidity Absorption	1.6 / *	%	Sim. to ISO 62
Density	1640 / -	kg/m³	ISO 1183

Table 5 of 6