Stanyl® 46HF5145
- Chemical Family
- Polyamides
Stanyl® 46HF5145 is a high-performance polyamide known for its exceptional heat resistance, stiffness in design, wear and friction properties, and processing qualities. It finds applications in automotive, E&E, gears, and outdoor power equipment. Withstanding temperatures up to 220°C, it surpasses PPA, PA6T, PA9T, and often PPS and LCP, making it ideal for demanding high-performance uses. It is best suited for injection molding.
Product families
Applications
- Connectors
Product Families
- Polyamides
Other characteristics
- Brand
- Stanyl
- Polymer Name
- Polyamide 46 (PA 46)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 14500.0 - 14500.0 MPa
- Processing Methods
- Injection Molding
- Markets
- Electrical & Electronics
- Flame Rating
- UL 94 V0
- Technology
- Plastics
- Packaging Type
- Bags
- Boxes
- Silos
- Super Sacks
- Quality Standards
- UL Yellow Card (E47960)
- Material Features
- Flame Retardant
- Heat Resistance
- UL Flame Rated
- Certifications and Compliance
- ISO 14001
- OHSAS
- REACH (Europe)
- UL 94
- Plastics and Elastomers End Uses
- Connectors
- Electrical/Electronic Applications
- Plastics and Elastomers Functions
- Resin
- Application Data
ForTii® PA4T allows for reliable solutions due to its excellent stiffness and high deflection temperature under load (HDT) and its excellent low warpage behavior after reflow soldering, outperforming Liquid Crystal Polymer (LCPs) and polyphthalamides (PPAs); ForTii® enables DDR manufacturers to produce more cost effective applications with reduced weight and height, enabling easy rework at lower temperature loads, with fewer heat traps and better thermal airflow; ForTii® PA4T allows for sustainable solutions due to its good carbon footprint and due the use of halogen and red-phosphorous free flameretardants
- Reflow Connectors Application Data
Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering); ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering; Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
28 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus | 16000 / 11500 | MPa | ISO 527-1/-2 |
| Tensile Modulus (120°C) | 10000 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (160°C) | 7300 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness, 1mm) - Dry | 16000 | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness) - cond. | 11000 | MPa | ISO 527-1/-2 |
| Stress at Break | 210 / 160 | MPa | ISO 527-1/-2 |
| Stress at Break (120°C) | 120 / - | MPa | ISO 527-1/-2 |
| Stress at Break (160°C) | 100 / * | MPa | ISO 527-1/-2 |
| Stress at Break, at low thickness | 220 / 160 | MPa | ISO 527-1/-2 |
| Stress at Break (Thickness tested) | 1 / - | mm | ISO 527-1/-2 |
| Strain at Break | 1.8 / 3 | % | ISO 527-1/-2 |
| Strain at Break (at 120°C) | 3.3 / - | % | ISO 527-1/-2 |
Table 2 of 5
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (10°C/min) | 295 / * | °C | ISO 11357-1/-3 |
| Glass Transition Temperature (at 10°C/min) | 75 / * | °C | ISO 11357-1/-2 |
| Temperature of Deflection Under Load (1.80 MPa) | 280 / * | °C | ISO 75-1/-2 |
| Burning Behaviour (at 3 / * mm Nominal Thickness) | UL V-0 / * | class | IEC 60695-11-10 |
| Relative Temperature Index (Electrical, 3 / * mm) | 65 / * | °C | UL746B |
| Relative Temperature Index (with impact, 3 / * mm) | 65 / * | °C | UL746B |
| Relative Temperature Index (without impact, 3 / * mm) | 65 / * | °C | UL746B |
Table 3 of 5
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Humidity Absorption | 1.4 / * | % | Sim. to ISO 62 |
| Density | 1730 / - | kg/m³ | ISO 1183 |
Table 4 of 5
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Molding Shrinkage (parallel) | 0.3 / * | % | Sim. to ISO 294-4 |
| Molding Shrinkage (normal) | 0.85 / * | % | Sim. to ISO 294-4 |
Химическая стойкость
377 rows| Characteristic | Value | Unit |
|---|---|---|
| Other | Acetaldehyde (40% by mass) at 23°C | resistant |
| Other | Acetamide (50% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at >140°C | not resistant |
| Other | Acetic acid (10% by mass) at 100°C | not resistant |
| Other | Acetic acid (10% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetic acid (95% by mass) at 23°C | not resistant |
| Ketones | Acetone at 23°C | resistant |
| Other | Acetophenone at 23°C | resistant |
| Other | Acetyl chloride at 23°C | not resistant |
| Other | Acetylene at 23°C | resistant |
| Other | Acrylic acid at 23°C | not resistant |
| Other | Aliphatic amines at 23°C | resistant |
