To catalogue
TECACOMP LCP LDS black 1049426
Properties
- Physical Form
- Granules
- Solid
Product families
Applications
Applications
- Electrical & Electronics — Other Electrical & Electronics Applications; Industrial — Other Industrial Applications
Automotive & Transportation — Automotive
- Other Automotive Applications
Industrial — Chemical & Industrial Manufacturing
- Equipment & Parts
Electrical & Electronics — Devices & Assemblies
- Consumer Electronics
- Lighting
Electrical & Electronics — Parts & Components
- Printed Circuit Boards (PCBs)
Product Families
Plastics — Engineering & Specialty Polymers
- High Performance Thermoplastics
Other characteristics
- Brand
- TECACOMP
- Polymer Name
- Liquid Crystal Polymer (LCP)
- Processing Methods
- Injection Molding
- Color
- Black
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Industrial
- Flame Rating
- UL 94 V0
- Technology
- Plastics
- Certifications and Compliance
- UL 94
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Charpy Impact Strength | 15 | kJ/m2 | DIN EN ISO 179-1eU |
| Elongation at Break | 1.6 | % | DIN EN ISO 527-1 |
| Modulus of Elasticity (Tensile test) | 9700 | MPa | DIN EN ISO 527-1 |
| Tensile Strength | 85 | MPa | DIN EN ISO 527-1 |
Table 2 of 5
17 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Glass Transition Temperature | 221 | °C | ISO-R 75 Method A |
| Melting Temperature | 310 | °C | — |
| Service Temperature (long term) | 200 | °C | — |
| Service Temperature (short term) | 260 | °C | — |
| Specific Heat | 1.11 | J/(g*K) | DIN EN 821 |
| Thermal Conductivity (in-plane) | 2.14 | W/(K*m) | DIN EN 821 |
| Thermal Conductivity (through-plane) | 0.46 | W/(K*m) | DIN EN 821 |
| Thermal Diffusivity (in-plane) | 1.1 | mm2/s | DIN EN 821 |
| Thermal Diffusivity (through-plane) | 0.24 | mm2/s | DIN EN 821 |
| Thermal Expansion (CLTE) Longitudinal (at 100 - 150°C) | 11 | 10^-6 K^-1 | DIN EN ISO 11359-1;2 |
| Thermal Expansion (CLTE) Longitudinal (at 150 - 200°C) | 14 | 10^-6 K^-1 | DIN EN ISO 11359-1;2 |
| Thermal Expansion (CLTE) Longitudinal (at 200 - 250°C) | 13 | 10^-6 K^-1 | DIN EN ISO 11359-1;2 |
Table 3 of 5
1 row| Characteristic | Value | Unit |
|---|---|---|
| Density | 1.74 | g/cm3 |
Table 4 of 5
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Dielectric Constant (Test frequency: 1 GHz) | 53 .79 x 10^-3 | — | — |
| Resistance to Tracking (CTI) | 150 | V | DIN EN 60112 |
| Surface Resistivity | 1.3 x 10^15 | Ω | DIN EN 61340-2-3 |
| Volume Resistivity | 2.8 x 10^15 | Ω*m | DIN EN 61340-2-3 |
Table 5 of 5
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Bulk Density | 0.97 | g/cm3 | EN ISO 60 |
| Flammability (at 3.2 mm, UL94) | V0 | — | DIN IEC 60695-11-10 |
| Laser Marking Parameter (Forward movement) | 1.6 - 3.2 | m/s | — |
| Laser Marking Parameter (Frequency) | 100 - 200 | kHz | — |
| Laser Marking Parameter (Power) | 2 - 5 | W | — |
| Molding Shrinkage (longitudinal) | 0.03 | % | DIN EN ISO 294-4 |
| Molding Shrinkage (transverse) | 0.56 | % | DIN EN ISO 294-4 |
| Water Absorption (23°C / 50% relative humidity up to saturation) | max. 0.1 | % | DIN EN ISO 62 |
