To catalogue
TECACOMP PA66 TC white 3923
- Chemical Family
- Polyamides
Properties
- Physical Form
- Granules
- Solid
Product families
Applications
Applications
- Electrical & Electronics — Other Electrical & Electronics Applications; Industrial — Other Industrial Applications
Automotive & Transportation — Automotive
- Other Automotive Applications
Industrial — Chemical & Industrial Manufacturing
- Equipment & Parts
Electrical & Electronics — Devices & Assemblies
- Lighting
Product Families
Plastics — Engineering & Specialty Polymers
- Polyamides
Other characteristics
- Brand
- TECACOMP
- Polymer Name
- Polyamide 66 (PA 66)
- Fillers Included
- Ceramic
- Processing Methods
- Injection Molding
- Color
- White
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Industrial
- Predrying
To achieve optimum mechanical properties, it is recommended to pre-dry the material w ith the above mentioned parameters.
- Technology
- Plastics
- Material Features
- Electrically Insulating
- Good Thermal Conductivity
- Processing Information
This material can be processed as a thermoplastic taking the normal technical provisions into account. The above mentioned information refers exclusively to the injection molding process.. Processing should be carried out as gently as possible, in order to maintain the maximum fiber length in the component. Back pressure and injection rate should be adjusted to the component geometry accordingly. The optimum processing temperature depends upon the respective geometry of the molded part and can be different from machine to machine.
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 4
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Charpy Impact Strength (2,0 J) | 15 | kJ/m2 | DIN EN ISO 179-1eU |
| Elongation at Break (50 mm/min) | 1.5 | % | DIN EN ISO 527-1 |
| Modulus of Elasticity (Tensile test, 50 mm/min) | 9000 | MPa | DIN EN ISO 527-1 |
| Tensile Strength (50 mm/min) | 60 | MPa | DIN EN ISO 527-1 |
Table 2 of 4
14 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Glass Transition Temperature | 50 | °C | DIN 53765 |
| Heat Distortion Temperature (HDTA) | 210 | °C | ISO-R 75 Method A |
| Melting Temperature | 255 | °C | DIN 53765 |
| Service Temperature (long term) | 110 | °C | — |
| Service Temperature (short term) | 170 | °C | — |
| Specific Heat | 1.21 | J/(g*K) | DIN EN 821 |
| Thermal Conductivity (in-plane) | 4.5 | W/(K*m) | DIN EN 821 |
| Thermal Conductivity (through-plane) | 1.5 | W/(K*m) | DIN EN 821 |
| Thermal Diffusivity (in-plane) | 2.1 | mm2/s | DIN EN 821 |
| Thermal Diffusivity (through-plane) | 0.8 | mm2/s | DIN EN 821 |
| Thermal Expansion (CLTE) Longitudinal (at 10 - 40°C) | 25 | 10^-6 K^-1 | DIN EN ISO 11359- |
| Thermal Expansion (CLTE) Longitudinal (at 60 - 100°C) | 40 | 10^-6 K^-1 | DIN EN ISO 11359- |
Table 3 of 4
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Dielectric Constant | 3.59 | — | DIN 53483-1 |
| Dielectric Constant | 3.5 | — | DIN 53483-1 |
| Dissipation Factor (Measurement frequency: 1 GHz) | 0.00608 | — | DIN 53483-1 |
| Dissipation Factor (Measurement frequency: 2 GHz) | 0.00919 | — | DIN 53483-1 |
| Surface Resistivity (Measurement frequency: 1GHz) | 5 x 10^12 | Ω | DIN EN 61340-2-3 |
| Volume Resistivity (Measurement frequency: 2 GHz) | 3.9 x 10^11 | Ω*m | DIN EN 61340-2-3 |
Table 4 of 4
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Bulk Density | 0.65 | g/cm3 | EN ISO 60 |
| Flammability (UL94) | HB | — | DIN IEC 60695-11- 10 |
| Melt Flow Index (280°C / 5 kg) | 45 | g/10 min | DIN EN ISO 1133 |
| Molding Shrinkage (longitudinal) | 0.77 | % | DIN EN ISO 294-4 |
| Molding Shrinkage (transverse) | 0.79 | % | DIN EN ISO 294-4 |
| MVR (280°C / 5 kg) | 31.5 | cm3/10 min | DIN EN ISO 1133 |
| Water Absorption (23°C / 50% relative humidity up to saturation) | 1.5 | % | DIN EN ISO 62 |
