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TECACOMP PA66 TC black 4022

Chemical Family
Polyamides

Properties

Physical Form
  • Granules
  • Solid

Product families

Applications

Applications
  • Electrical & Electronics — Other Electrical & Electronics Applications; Industrial — Other Industrial Applications
Automotive & Transportation — Automotive
  • Other Automotive Applications
Industrial — Chemical & Industrial Manufacturing
  • Equipment & Parts
Electrical & Electronics — Devices & Assemblies
  • Lighting
Food & Nutrition — Processing & Packaging
  • Food & Beverage Manufacturing

Product Families

Plastics — Engineering & Specialty Polymers
  • Polyamides

Other characteristics

Brand
TECACOMP
Polymer Name
Polyamide 66 (PA 66)
Fillers Included
Mineral
Processing Methods
Injection Molding
Color
Black
Markets
  • Automotive & Transportation
  • Electrical & Electronics
  • Food & Nutrition
  • Industrial
Predrying

To achieve optimum mechanical properties, it is recommended to pre-dry the material w ith the above mentioned parameters.

Technology
Plastics
Material Features
  • Electrically Insulating
  • Good Thermal Conductivity
  • Good UV Resistance
Processing Information

This material can be processed as a thermoplastic taking the normal technical provisions into account. The above mentioned information refers exclusively to the injection molding process.. Back pressure and injection rate should be adjusted to the component geometry accordingly. The optimum processing temperature depends upon the respective geometry of the molded part and can be different from machine to machine.

Plastics and Elastomers Processing Methods
Injection Molding

Technical data

Table 1 of 4

4 rows
CharacteristicValueUnitMethod
Charpy Impact Strength25kJ/m2DIN EN ISO 179-1eU
Elongation at Break (50 mm/min)1.7%DIN EN ISO 527-1
Modulus of Elasticity (Tensile test, 50 mm/min)13500MPaDIN EN ISO 527-1
Tensile Strength (50 mm/min)95MPaDIN EN ISO 527-1

Table 2 of 4

6 rows
CharacteristicValueUnitMethod
Glass Transition Temperature50°CDIN 53765
Melting Temperature255°CDIN 53765
Service Temperature (long term)110°C—
Service Temperature (short term)170°C—
Thermal Conductivity (in-plane)2.5W/(K*m)DIN EN 821
Thermal Conductivity (through-plane)1.8W/(K*m)DIN EN 821

Table 3 of 4

2 rows
CharacteristicValueUnitMethod
Surface Resistivity5.7 x 10^12ΩDIN EN 61340-2-3
Volume Resistivity5.3 x 10^12Ω*mDIN EN 61340-2-3

Table 4 of 4

5 rows
CharacteristicValueUnitMethod
Flammability (UL94 at 1.6mm)HB—DIN IEC 60695-11-10
Melt Flow Index (280°C / 10 kg)22g/10 minDIN EN ISO 1133
Molding Shrinkage (longitudinal)1.26%DIN EN ISO 294-4
Molding Shrinkage (transverse)1.5%DIN EN ISO 294-4
Water Absorption (23°C / 50% relative humidity up to saturation)max. 0.1%DIN EN ISO 62

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