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TECACOMP PPA LDS black 4109

Chemical Family
Polyamides

Properties

Physical Form
  • Granules
  • Solid

Product families

Applications

Applications
  • Electrical & Electronics — Other Electrical & Electronics Applications; Industrial — Other Industrial Applications
Automotive & Transportation — Automotive
  • Other Automotive Applications
Industrial — Chemical & Industrial Manufacturing
  • Equipment & Parts
Electrical & Electronics — Devices & Assemblies
  • Consumer Electronics
  • Lighting
Electrical & Electronics — Parts & Components
  • Printed Circuit Boards (PCBs)

Product Families

Plastics — Engineering & Specialty Polymers
  • Polyamides

Other characteristics

Brand
TECACOMP
Polymer Name
Polyphthalamide (PPA)
Processing Methods
Injection Molding
Color
Black
Markets
  • Automotive & Transportation
  • Electrical & Electronics
  • Industrial
Predrying

To achieve optimum mechanical properties, it is recommended to pre-dry the material w ith the above mentioned parameters.

Flame Rating
UL 94 HB
Technology
Plastics
Material Features
Good Thermal Conductivity
Processing Information

This material can be processed as a thermoplastic taking the normal technical provisions into account. The above mentioned information refers exclusively to the injection molding process.. Back pressure and injection rate should be adjusted to the component geometry accordingly. The optimum processing temperature depends upon the respective geometry of the molded part and can be different from machine to machine.

Certifications and Compliance
UL 94
Plastics and Elastomers Processing Methods
Injection Molding

Technical data

Table 1 of 5

4 rows
CharacteristicValueUnitMethod
Charpy Impact Strength5kJ/m2DIN EN ISO 179-1eU
Elongation at Break (50 mm/min)0.5%DIN EN ISO 527-1
Modulus of Elasticity (Tensile test, 50 mm/min)9000MPaDIN EN ISO 527-1
Tensile Strength (50 mm/min)43MPaDIN EN ISO 527-1

Table 2 of 5

1 row
CharacteristicValueUnit
Density1.54g/cm3

Table 3 of 5

16 rows
CharacteristicValueUnitMethod
Glass Transition Temperature100 - 140°CDIN 53765
Heat Distortion Temperature (HDTA)222°CISO-R 75 Method A
Melting Temperature285 - 315°CDIN 53765
Service Temperature (long term)150°C—
Service Temperature (short term)250°C—
Specific Heat1.09J/(g*K)DIN EN 821
Thermal Conductivity (in-plane)4.3W/(K*m)DIN EN 821
Thermal Conductivity (through-plane)1.3W/(K*m)DIN EN 821
Thermal Diffusivity (in-plane)2.53mm2/sDIN EN 821
Thermal Diffusivity (through-plane)0.77mm2/sDIN EN 821
Thermal Expansion (CLTE) Longitudinal (at 100 - 150°C)5310^-6 K^-1DIN EN ISO 11359-1;2
Thermal Expansion (CLTE) Longitudinal (at 150 - 200°C)7710^-6 K^-1DIN EN ISO 11359-1;2

Table 4 of 5

3 rows
CharacteristicValueUnitMethod
Resistance to Tracking (CTI)600VDIN EN 60112
Surface Resistivity4.7 x 10^12Ω—
Volume Resistivity5.2 x 10^11Ω*mDIN EN 61340-2-3

Table 5 of 5

10 rows
CharacteristicValueUnitMethod
Adhesive Strength (Metal path)20.2N/mm2—
Flammability (UL94, at 3 mm)HB—DIN IEC 60695-11-10
Laser Marking Parameter (Forward movement)2 - 3m/s—
Laser Marking Parameter (Frequency)100 - 200kHz—
Laser Marking Parameter (Power)2 - 6W—
Melt Flow Index (300°C/5 kg)31.7g/10 minDIN EN ISO 1133
Molding Shrinkage (longitudinal)0.6%DIN EN ISO 294-4
Molding Shrinkage (transverse)0.6%DIN EN ISO 294-4
MVR (300°C/5 kg)20.6cm3/10 minDIN EN ISO 1133
Water Absorption (23°C / 50% relative humidity up to saturation)max. 0.1%DIN EN ISO 62

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