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TECACOMP LCP LDS black 4107

Properties

Physical Form
  • Granules
  • Solid

Product families

Applications

Applications
  • Electrical & Electronics — Other Electrical & Electronics Applications; Industrial — Other Industrial Applications
Automotive & Transportation — Automotive
  • Other Automotive Applications
Industrial — Chemical & Industrial Manufacturing
  • Equipment & Parts
Electrical & Electronics — Devices & Assemblies
  • Consumer Electronics
  • Lighting
Electrical & Electronics — Parts & Components
  • Printed Circuit Boards (PCBs)

Product Families

Plastics — Engineering & Specialty Polymers
  • High Performance Thermoplastics

Other characteristics

Brand
TECACOMP
Polymer Name
Liquid Crystal Polymer (LCP)
Processing Methods
Injection Molding
Color
Black
Markets
  • Automotive & Transportation
  • Electrical & Electronics
  • Industrial
Predrying

To achieve optimum mechanical properties, it is recommended to pre-dry the material w ith the above mentioned parameters.

Flame Rating
UL 94 V0
Technology
Plastics
Processing Information

This material can be processed as a thermoplastic taking the normal technical provisions into account. The above mentioned information refers exclusively to the injection molding process.. Back pressure and injection rate should be adjusted to the component geometry accordingly. The optimum processing temperature depends upon the respective geometry of the molded part and can be different from machine to machine

Certifications and Compliance
UL 94
Plastics and Elastomers Processing Methods
Injection Molding

Technical data

Table 1 of 5

4 rows
CharacteristicValueUnitMethod
Charpy Impact Strength10kJ/m2DIN EN ISO 179-1eU
Elongation at Break (50 mm/min)1.3%DIN EN ISO 527-1
Modulus of Elasticity (Tensile test, 50 mm/min)11500MPaDIN EN ISO 527-1
Tensile Strength (50 mm/min)95MPaDIN EN ISO 527-1

Table 2 of 5

1 row
CharacteristicValueUnit
Density1.23g/cm3

Table 3 of 5

17 rows
CharacteristicValueUnitMethod
Heat Distortion Temperature (HDTA)274°CISO-R 75 Method A
Melting Temperature320°CDIN 53765
Service Temperature (long term)200°C—
Service Temperature (short term)260°C—
Specific Heat1.25J/(g*K)DIN EN 821
Thermal Conductivity (in-plane)1.61W/(K*m)DIN EN 821
Thermal Conductivity (through-plane)0.76W/(K*m)DIN EN 821
Thermal Diffusivity (in-plane)0.93mm2/sDIN EN 821
Thermal Diffusivity (through-plane)0.31mm2/sDIN EN 821
Thermal Expansion (CLTE) Longitudinal (at 100 - 150°C)2510^-6 K^-1DIN EN ISO 11359-1;2
Thermal Expansion (CLTE) Longitudinal (at 150 - 200°C)3010^-6 K^-1DIN EN ISO 11359-1;2
Thermal Expansion (CLTE) Longitudinal (at 200 - 250°C)3410^-6 K^-1DIN EN ISO 11359-1;2

Table 4 of 5

5 rows
CharacteristicValueUnitMethod
Dielectric Constant (Test frequency: 1 kHz)4.01—DIN 53483-1
Dielectric Loss Factor (Test frequency: 1 kHz)0.016—DIN 53483-1
Resistance to Tracking (CTI)275VDIN EN 60112
Surface Resistivity4.1 x 10^12ΩDIN EN 61340-2-3
Volume Resistivity3.8 x 10^11Ω*mDIN EN 61340-2-3

Table 5 of 5

8 rows
CharacteristicValueUnitMethod
Adhesive Strength (Metal path)9.1N/mm2—
Flammability (UL94 at 3 mm)V0—DIN IEC 60695-11-10
Laser Marking Parameter (Forward movement)1.6 - 3.2m/s—
Laser Marking Parameter (Frequency)100 - 200kHz—
Laser Marking Parameter (Power)2 - 5W—
Molding Shrinkage (longitudinal)0.1%DIN EN ISO 294-4
Molding Shrinkage (transverse)0.3%DIN EN ISO 294-4
Water Absorption (23°C / 50% relative humidity up to saturation)max. 0.1%DIN EN ISO 62

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