To catalogue

TECACOMP PEEK LDS black 1047045

Properties

Physical Form
  • Granules
  • Solid

Product families

Applications

Industrial — Chemical & Industrial Manufacturing
  • Equipment & Parts
  • Other Industrial Applications
Electrical & Electronics — Devices & Assemblies
  • Consumer Electronics
Healthcare & Pharma — Medical
  • Medical Devices & Assemblies
Electrical & Electronics — Parts & Components
  • Housings & Enclosures
  • Printed Circuit Boards (PCBs)

Product Families

Plastics — Engineering & Specialty Polymers
  • High Performance Thermoplastics

Other characteristics

Brand
TECACOMP
Polymer Name
Polyetheretherketone (PEEK)
Fillers Included
Mineral
Processing Methods
Injection Molding
Color
Black
Markets
  • Electrical & Electronics
  • Healthcare & Pharma
  • Industrial
Predrying

To achieve optimum mechanical properties, it is recommended to pre-dry the material w ith the above mentioned parameters.

Technology
Plastics
Processing Information

This material can be processed as a thermoplastic taking the normal technical provisions into account. The above mentioned information refers exclusively to the injection molding process.. Processing should be carried out as gently as possible, in order to maintain the maximum fiber length in the component. Back pressure and injection rate should be adjusted to the component geometry accordingly. The optimum processing temperature depends upon the respective geometry of the molded part and can be different from machine to machine.

Plastics and Elastomers Processing Methods
Injection Molding

Technical data

Table 1 of 5

4 rows
CharacteristicValueUnitMethod
Charpy Impact Strength35kJ/m2DIN EN ISO 179-1eU
Elongation at Break (50 mm/min)2.5%DIN EN ISO 527-1
Modulus of Elasticity (Tensile test, 50 mm/min)10900MPaDIN EN ISO 527-1
Tensile Strength (50 mm/min)105MPaDIN EN ISO 527-1

Table 2 of 5

16 rows
CharacteristicValueUnitMethod
Glass Transition Temperature143°CDIN 53765
Glass Transition Temperature218°CISO-R 75 Method A
Melting Temperature343°CDIN 53765
Service Temperature (long term)260°C—
Service Temperature (short term)300°C—
Specific Heat0.97J/(g*K)DIN EN 821
Thermal Conductivity (in-plane)1.7W/(K*m)DIN EN 821
Thermal Conductivity (through-plane)0.5W/(K*m)DIN EN 821
Thermal Diffusivity (in-plane)1mm2/sDIN EN 821
Thermal Diffusivity (through-plane)0.28mm2/sDIN EN 821
Thermal Expansion (CLTE) Longitudinal (at 200 - 260°C)4610^-6 K^-1DIN EN ISO 11359-1;2
Thermal Expansion (CLTE) Longitudinal (at 23 - 100°C)1810^-6 K^-1DIN EN ISO 11359-1;2

Table 3 of 5

1 row
CharacteristicValueUnit
Density1.67g/cm3

Table 4 of 5

6 rows
CharacteristicValueUnitMethod
Dielectric Constant (Test frequency: 1 kHz)3.73—DIN 53483-1
Dielectric Loss Factor (Test frequency: 1 kHz)0.0066—DIN 53483-1
Dielectric Strength (70 mm x 70 mm x 3 mm)17.5kV/mmISO 60243-1
Resistance to Tracking (CTI)225VDIN EN 60112
Surface Resistivity5.8 x 10^12ΩDIN EN 61340-2-3
Volume Resistivity5.8 x 10^11Ω*mDIN EN 61340-2-3

Table 5 of 5

10 rows
CharacteristicValueUnitMethod
Adhesive Strength (Metal path)19.4N/mm2—
Bulk Density0.9g/cm3EN ISO 60
Flammability (UL94, at 0.8 mm)V0—DIN IEC 60695-11-10
Laser Marking Parameter (Forward movement)1.8 - 2.4m/s—
Laser Marking Parameter (Frequency)120 - 180kHz—
Laser Marking Parameter (Power)2 - 8W—
Melt Flow Index (380°C / 10 kg)77g/10 minDIN EN ISO 1133
Molding Shrinkage (longitudinal)0.52%DIN EN ISO 294-4
Molding Shrinkage (transverse)0.56%DIN EN ISO 294-4
Water Absorption (23°C / 50% relative humidity up to saturation)max. 0.1%DIN EN ISO 62

The Omnichem website uses cookies. By continuing to use the site, you consent to their use in accordance with our Privacy Policy and to the collection of analytics.