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TECACOMP PA66 TC black 3989

Chemical Family
Polyamides

Properties

Physical Form
  • Granules
  • Solid

Product families

Applications

Applications
  • Electrical & Electronics — Other Electrical & Electronics Applications; Industrial — Other Industrial Applications
Automotive & Transportation — Automotive
  • Other Automotive Applications
Industrial — Chemical & Industrial Manufacturing
  • Equipment & Parts

Product Families

Plastics — Engineering & Specialty Polymers
  • Polyamides

Other characteristics

Brand
TECACOMP
Polymer Name
Polyamide 66 (PA 66)
Fillers Included
Graphite
Processing Methods
Injection Molding
Color
Black
Markets
  • Automotive & Transportation
  • Electrical & Electronics
  • Industrial
Predrying

To achieve optimum mechanical properties, it is recommended to pre-dry the material w ith the above mentioned parameters.

Technology
Plastics
Material Features
  • Electrically Conductive
  • Good Thermal Conductivity
Processing Information

This material can be processed as a thermoplastic taking the normal technical provisions into account. The above mentioned information refers exclusively to the injection molding process.. Back pressure and injection rate should be adjusted to the component geometry accordingly. The optimum processing temperature depends upon the respective geometry of the molded part and can be different from machine to machine

Plastics and Elastomers Processing Methods
Injection Molding

Technical data

Table 1 of 4

4 rows
CharacteristicValueUnitMethod
Charpy Impact Strength11kJ/m2DIN EN ISO 179-1eU
Elongation at Break (50 mm/min)1.5%DIN EN ISO 527-1
Modulus of Elasticity (Tensile test, 50 mm/min)8100MPaDIN EN ISO 527-1
Tensile Strength (50 mm/min)57MPaDIN EN ISO 527-1

Table 2 of 4

14 rows
CharacteristicValueUnitMethod
Glass Transition Temperature50°CDIN 53765
Heat Distortion Temperature (HDTA)232°CISO-R 75 Method A
Melting Temperature255°CDIN 53765
Service Temperature (long term)110°C—
Service Temperature (short term)170°C—
Specific Heat1.5J/(g*K)DIN EN 821
Thermal Conductivity (in-plane)11,2W/(K*m)DIN EN 821
Thermal Conductivity (through-plane)2.8W/(K*m)DIN EN 821
Thermal Diffusivity (in-plane)5.1mm2/sDIN EN 821
Thermal Diffusivity (through-plane)1.3mm2/sDIN EN 821
Thermal Expansion (CLTE) Longitudinal (at 100 - 150°C)7110^-6 K^-1DIN EN ISO 11359-1;2
Thermal Expansion (CLTE) Longitudinal (at 23 - 100°C)3810^-6 K^-1DIN EN ISO 11359-1;2

Table 3 of 4

3 rows
CharacteristicValueUnitMethod
Surface Resistivitymax. 10^4ΩDIN EN 61340-2-3
Volume Resistivitymax. 10^4Ω*mDIN EN 61340-2-3
Volume Resistivity3.5 x 10^3Ω*mDIN EN ISO 3915

Table 4 of 4

6 rows
CharacteristicValueUnitMethod
Bulk Density0.7g/cm3EN ISO 60
Flammability (UL94)HB—DIN IEC 60695-11-10
Melt Flow Index (280°C / 5 kg)36g/10 minDIN EN ISO 1133
Molding Shrinkage (longitudinal)0.78%DIN EN ISO 294-4
Molding Shrinkage (transverse)1.02%DIN EN ISO 294-4
Water Absorption (23°C / 50% relative humidity up to saturation)1.5%DIN EN ISO 62

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