Stanyl® HFX61S
- Chemical Family
- Polyamides
Stanyl® HFX61S is a high-performance polyamide that provides unmatched performance and value for demanding applications in which superior heat resistance, design stiffness, wear and friction, and process flow qualities are required. This high-performance polyamide 46 is used for applications in automotive, E&E, gears, and outdoor power equipment. Since it retains its mechanical properties at high temperatures up to 220 °C, this makes it ideal for extremely high-performance applications, where it outperforms PPA, PA6T, PA9T, and often PPS and LCP. A suitable processing technology for the product is injection molding. Special features include good or high flow and being phosphorous-free.
Product families
- Polyamides
Other characteristics
- Brand
- Stanyl
- Polymer Name
- Polyamide 46 (PA 46)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 10500.0 - 10500.0 MPa
- Processing Methods
- Injection Molding
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Flame Rating
- UL 94 V0
- Technology
- Plastics
- Packaging Type
- Bags
- Boxes
- Silos
- Super Sacks
- Labeling Claims
- Halogen-free
- Phosphorus-free
- Quality Standards
- UL Yellow Card (E47960)
- Material Features
- Flame Retardant
- Good Strength
- Heat Resistance
- High Durability
- High Flow
- UL Flame Rated
- Certifications and Compliance
- ISO 14001
- OHSAS
- REACH (Europe)
- UL 94
- Plastics and Elastomers End Uses
- Connectors
- Miniature Circuit Breakers
- Molded Case Circuit Breakers
- Robotics
- Plastics and Elastomers Functions
- Resin
- USB-C Connectors Application Data
Stanyl® is a high-performance aliphatic polyamide formulated to significantly reduce fire risk; Its high comparative tracking index (CTI) performance reduces the risk of tracking by 50%, even when molded into thin-walled parts; It provides up to 50% more wear resistance compared to other high temperature polyamides; Stanyl®'s excellent design stiffness and high flow properties lower the total cost to manufacturers by ensuring high yields while demonstrating superior cracking performance
- Application Data
ForTii® PA4T allows for reliable solutions due to its excellent stiffness and high deflection temperature under load (HDT) and its excellent low warpage behavior after reflow soldering, outperforming Liquid Crystal Polymer (LCPs) and polyphthalamides (PPAs); ForTii® enables DDR manufacturers to produce more cost effective applications with reduced weight and height, enabling easy rework at lower temperature loads, with fewer heat traps and better thermal airflow; ForTii® PA4T allows for sustainable solutions due to its good carbon footprint and due the use of halogen and red-phosphorous free flameretardants
- Reflow Connectors Application Data
Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering); ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering; Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)
Technical data
Table 1 of 6
14 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus | 11800 / 8400 | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness, 1mm) | 12000 / - | MPa | ISO 527-1/-2 |
| Stress at Break | 140 / 100 | MPa | ISO 527-1/-2 |
| Stress at Break, at low thickness | 160 / - | MPa | ISO 527-1/-2 |
| Stress at Break (Thickness tested) | 1 / - | mm | ISO 527-1/-2 |
| Strain at Break | 2.1 / 3.1 | % | ISO 527-1/-2 |
| Strain at Break, at low thickness | 2.4 / - | % | ISO 527-1/-2 |
| Strain at Break (Thickness tested) | 1 / - | mm | ISO 527-1/-2 |
| Flexural Modulus | 10500 / 8000 | MPa | ISO 178 |
| Flexural Strength | 210 / 200 | MPa | ISO 178 |
| Charpy Impact Strength (at +23°C) | 50 / 60 | kJ/m² | ISO 179/1eU |
| Charpy Notched Impact Strength (at +23°C) | 9 / 10 | kJ/m² | ISO 179/1eA |
Table 2 of 6
21 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (10°C/min) | 295 / * | °C | ISO 11357-1/-3 |
| Glass Transition Temperature (at 10°C/min) | 75 / * | °C | ISO 11357-1/-2 |
| Temperature of Deflection Under Load (1.80 MPa) | 285 / * | °C | ISO 75-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.17 / * | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.3 / * | E-4/°C | ASTM D696 |
| Coefficient of Linear Thermal Expansion (normal) | 0.7 / * | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (normal) | 0.4 / * | E-4/°C | ASTM D696 |
| Burning Behaviour (at 1.5 mm Nominal Thickness) | UL V-0 / * | class | IEC 60695-11-10 |
| Burning Behaviour (at 3.0 mm Nominal Thickness) | UL V-0 / * | class | IEC 60695-11-10 |
| Burning Behaviour (at 0.18 mm Thickness h) | UL V-0 / * | class | IEC 60695-11-10 |
| Oxygen Index | 48 / * | % | ISO 4589-1/-2 |
| Glow Wire Flammability Index (at thickness 0.8 / - mm) | 960 / - | °C | IEC 60695-2-12 |
Table 3 of 6
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Relative Permittivity (100Hz) | 4.4 / 11 | — | IEC 62631-2-1 |
| Relative Permittivity (1 MHz) | 4.1 / 5 | — | IEC 62631-2-1 |
| Relative Permittivity (1GHz) | 3.9 / 4.1 | — | IEC 60250 |
| Relative Permittivity (10GHz) | 3.8 / 4 | — | IEC 60250 |
| Dissipation Factor (100 Hz) | 72 / 2100 | E-4 | IEC 62631-2-1 |
| Dissipation Factor (1 MHz) | 165 / 1000 | E-4 | IEC 62631-2-1 |
| Dissipation Factor (1GHz) | 120 / 190 | E-4 | IEC 60250 |
| Dissipation Factor (10GHz) | 100 / 160 | E-4 | IEC 60250 |
| Volume Resistivity | >1E13 / 1E11 | Ohm*m | IEC 62631-3-1 |
| Surface Resistivity | - / 1E12 | Ohm | IEC 62631-3-2 |
| Electric Strength | 30 / 24 | kV/mm | IEC 60243-1 |
| Comparative Tracking Index | 550 / - | V | IEC 60112 |
Table 4 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Water Absorption | 6.3 / * | % | Sim. to ISO 62 |
| Water Absorption in Water (at 23°C after 24h) | 1.7 / * | % | ISO 62 |
| Humidity Absorption | 2.1 / * | % | Sim. to ISO 62 |
| Density | 1490 / - | kg/m³ | ISO 1183 |
Table 5 of 6
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Molding Shrinkage (parallel) | 0.4 / * | % | ISO 294-4 |
| Molding Shrinkage (normal) | 1.1 / * | % | ISO 294-4 |
| Spiral Flow Length 1.0 mm 1000 bar | 170 / * | mm | — |
Химическая стойкость
377 rows| Characteristic | Value | Unit |
|---|---|---|
| Other | Acetaldehyde (40% by mass) at 23°C | resistant |
| Other | Acetamide (50% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at >140°C | not resistant |
| Other | Acetic acid (10% by mass) at 100°C | not resistant |
| Other | Acetic acid (10% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetic acid (95% by mass) at 23°C | not resistant |
| Ketones | Acetone at 23°C | resistant |
| Other | Acetophenone at 23°C | resistant |
| Other | Acetyl chloride at 23°C | not resistant |
| Other | Acetylene at 23°C | resistant |
| Other | Acrylic acid at 23°C | not resistant |
| Other | Aliphatic amines at 23°C | resistant |
