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Stanyl® HFX31S

Chemical Family
Polyamides

Stanyl® HFX31S is a high-performance polyamide that provides unmatched performance and value for demanding applications in which superior heat resistance, design stiffness, wear and friction, and process flow qualities are required. This high-performance polyamide 46 is used for applications in automotive, E&E, gears, and outdoor power equipment. Since it retains its mechanical properties at high temperatures up to 220 °C, this makes it ideal for extremely high-performance applications, where it outperforms PPA, PA6T, PA9T, and often PPS and LCP. A suitable processing technology for the product is injection molding. Special features include good or high flow and being phosphorous-free.

Product families

Applications

Automotive & Transportation — Automotive
  • Electrical & Electronic Systems
Electrical & Electronics — Devices & Assemblies
  • Automotive Electronics
  • Industrial Automation
Electrical & Electronics — Parts & Components
  • Connectors

Product Families

Plastics — Engineering & Specialty Polymers
  • Polyamides

Other characteristics

Brand
Stanyl
Polymer Name
Polyamide 46 (PA 46)
Fillers Included
Glass Fiber
Flexural Modulus
7500.0 - 7500.0 MPa
Processing Methods
Injection Molding
Markets
  • Automotive & Transportation
  • Electrical & Electronics
Flame Rating
UL 94 V0
Technology
Plastics
Packaging Type
  • Bags
  • Boxes
  • Silos
  • Super Sacks
Labeling Claims
  • Halogen-free
  • Phosphorus-free
Quality Standards
UL Yellow Card (E47960)
Material Features
  • Flame Retardant
  • Good Strength
  • Heat Resistance
  • High Durability
  • High Flow
  • UL Flame Rated
Certifications and Compliance
  • ISO 14001
  • OHSAS
  • REACH (Europe)
  • UL 94
Plastics and Elastomers End Uses
  • Connectors
  • Robotics
Plastics and Elastomers Functions
Resin
Reflow Connectors Application Data

Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering); ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering; Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)

Plastics and Elastomers Processing Methods
Injection Molding

Technical data

Table 1 of 6

14 rows
CharacteristicValueUnitMethod
Tensile Modulus7500 / 5000MPaISO 527-1/-2
Tensile Modulus (Low Thickness, 1mm)7500 / -MPaISO 527-1/-2
Stress at Break120 / 85MPaISO 527-1/-2
Stress at Break, at low thickness130 / -MPaISO 527-1/-2
Stress at Break (Thickness tested)1 / -mmISO 527-1/-2
Strain at Break2.9 / 3.4%ISO 527-1/-2
Strain at Break, at low thickness3.2 / -%ISO 527-1/-2
Strain at Break (Thickness tested)1 / -mmISO 527-1/-2
Flexural Modulus7500 / 5000MPaISO 178
Flexural Strength190 / 140MPaISO 178
Charpy Impact Strength (at +23°C)49 / 53kJ/m²ISO 179/1eU
Charpy Notched Impact Strength (at +23°C)7 / 10kJ/m²ISO 179/1eA

Table 2 of 6

12 rows
CharacteristicValueUnitMethod
Melting Temperature (10°C/min)295 / *°CISO 11357-1/-3
Glass Transition Temperature (at 10°C/min)75 / *°CISO 11357-1/-2
Temperature of Deflection Under Load (1.80 MPa)285 / *°CISO 75-1/-2
Coefficient of Linear Thermal Expansion (parallel)0.25 / *E-4/°CISO 11359-1/-2
Coefficient of Linear Thermal Expansion (normal)0.65 / *E-4/°CISO 11359-1/-2
Burning Behaviour (at 3 / * mm Nominal Thickness)UL V-0 / *classIEC 60695-11-10
Relative Temperature Index (Electrical, 0.2 / * mm)120 / *°CUL746B
Relative Temperature Index (Electrical, 3 / * mm)130 / *°CUL746B
Relative Temperature Index (with impact, 0.2 / * mm)65 / *°CUL746B
Relative Temperature Index (with impact, 3 / * mm)65 / *°CUL746B
Relative Temperature Index (without impact, 0.2 / * mm)65 / *°CUL746B
Relative Temperature Index (without impact, 3 / * mm)65 / *°CUL746B

Table 3 of 6

8 rows
CharacteristicValueUnitMethod
Relative Permittivity (1GHz)3.6 / 3.75—IEC 60250
Relative Permittivity (10GHz)3.6 / 3.7—IEC 60250
Dissipation Factor (1GHz)100 / 210E-4IEC 60250
Dissipation Factor (10GHz)100 / 180E-4IEC 60250
Volume Resistivity>1E13 / 4E10Ohm*mIEC 62631-3-1
Surface Resistivity- / 7E14OhmIEC 62631-3-2
Electric Strength33 / 30kV/mmIEC 60243-1
Comparative Tracking Index550 / -VIEC 60112

Table 4 of 6

3 rows
CharacteristicValueUnitMethod
Water Absorption in Water (at 23°C after 24h)2.2 / *%ISO 62
Humidity Absorption2.8 / *%Sim. to ISO 62
Density1360 / -kg/m³ISO 1183

Table 5 of 6

3 rows
CharacteristicValueUnitMethod
Molding Shrinkage (parallel)0.8 / *%ISO 294-4
Molding Shrinkage (normal)1.3 / *%ISO 294-4
Spiral Flow Length 1.0 mm 1000 bar180 / *mm—

Химическая стойкость

377 rows
CharacteristicValueUnit
OtherAcetaldehyde (40% by mass) at 23°Cresistant
OtherAcetamide (50% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetamide (50% by mass) at >140°Cnot resistant
OtherAcetic acid (10% by mass) at 100°Cnot resistant
OtherAcetic acid (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetic acid (95% by mass) at 23°Cnot resistant
KetonesAcetone at 23°Cresistant
OtherAcetophenone at 23°Cresistant
OtherAcetyl chloride at 23°Cnot resistant
OtherAcetylene at 23°Cresistant
OtherAcrylic acid at 23°Cnot resistant
OtherAliphatic amines at 23°Cresistant

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