To catalogue

EcoPaXX® Q-HG6

Chemical Family
Polyamides

EcoPaXX® Q-HG6 is a long aliphatic polyamide with excellent chemical and hydrolysis resistance. It is suitable for thermal management applications and other structural parts. It offers exceptional chemical resistance, low moisture absorption, a very high melting point, and a high crystallization rate. The material can be processed using injection molding technology. It is heat stabilized and contains 30% glass reinforcement.

Other characteristics

Brand
EcoPaXX
Polymer Name
Polyamide 410 (PA 410)
Fillers Included
Glass Fiber
Additives Included
Heat Stabilizer
Processing Methods
Injection Molding, Injection Molding
Reinforcement Material
Glass Fibers
Markets
  • Automotive & Transportation
  • Building & Construction
  • Consumer Goods
  • Electrical & Electronics
  • Industrial
Technology
  • Composite Materials
  • Plastics
Packaging Type
  • Bags
  • Boxes
  • Silos
  • Super Sacks
Labeling Claims
  • Bio-based
  • Sustainable

Technical data

Table 1 of 6

25 rows
CharacteristicValueUnitMethod
Tensile Modulus9200 / 7000MPaISO 527-1/-2
Tensile Modulus (120°C)4600 / -MPaISO 527-1/-2
Tensile Modulus (160°C)3700 / *MPaISO 527-1/-2
Tensile Modulus (180°C)3200 / *MPaISO 527-1/-2
Tensile Modulus (200°C)3000 / *MPaISO 527-1/-2
Stress at Break170 / 115MPaISO 527-1/-2
Stress at Break (120°C)85 / -MPaISO 527-1/-2
Stress at Break (160°C)70 / *MPaISO 527-1/-2
Stress at Break (180°C)65 / *MPaISO 527-1/-2
Stress at Break (200°C)60 / *MPaISO 527-1/-2
Strain at Break3.8 / 5.8%ISO 527-1/-2
Strain at Break (at 120°C)8.2 / -%ISO 527-1/-2

Table 2 of 6

9 rows
CharacteristicValueUnitMethod
Melting Temperature (10°C/min)250 / *°CISO 11357-1/-3
Temperature of Deflection Under Load (1.80 MPa)215 / *°CISO 75-1/-2
Temperature of Deflection Under Load (0.45 MPa)243 / *°CISO 75-1/-2
Coefficient of Linear Thermal Expansion (parallel)0.32 / *E-4/°CISO 11359-1/-2
Coefficient of Linear Thermal Expansion (normal)0.66 / *E-4/°CISO 11359-1/-2
Thermal Index (2500 hrs)192 / *°CIEC 60216/ISO 527-1/-2
Thermal Index (5000 hrs)177 / *°CIEC 60216/ISO 527-1/-2
Thermal Index (10000 hrs)165 / *°CIEC 60216/ISO 527-1/-2
Thermal Index (20000 hrs)150 / *°CIEC 60216/ISO 527-1/-2

Table 3 of 6

2 rows
CharacteristicValueUnitMethod
Volume Resistivity1E12 / 1E11Ohm*mIEC 62631-3-1
Surface Resistivity- / 1E13OhmIEC 62631-3-2

Table 4 of 6

3 rows
CharacteristicValueUnitMethod
Humidity Absorption1.5 / *%Sim. to ISO 62
Density1340 / -kg/m³ISO 1183
Biobased Content70 / *% (Bio C/Total C)ASTM D6866-12 Method B

Table 5 of 6

4 rows
CharacteristicValueUnitMethod
Melt Volume-Flow Rate (at 290 / * °C, 5 / * kg)36 / *cm³/10minISO 1133
Melt Flow Index (at 290 / * °C, 5 / * kg)42 / *g/10minISO 1133
Molding Shrinkage (parallel)0.5 / *%ISO 294-4
Molding Shrinkage (normal)1 / *%ISO 294-4

Химическая стойкость

377 rows
CharacteristicValueUnit
OtherAcetaldehyde (40% by mass) at 23°Cresistant
OtherAcetamide (50% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetamide (50% by mass) at >140°Cnot resistant
OtherAcetic acid (10% by mass) at 100°Climited resistant, tests necessary to verify
OtherAcetic acid (10% by mass) at 23°Cresistant
OtherAcetic acid (95% by mass) at 23°Climited resistant, tests necessary to verify
KetonesAcetone at 23°Cresistant
OtherAcetophenone at 23°Cresistant
OtherAcetyl chloride at 23°Climited resistant, tests necessary to verify
OtherAcetylene at 23°Cresistant
OtherAcrylic acid at 23°Climited resistant, tests necessary to verify
OtherAliphatic amines at 23°Cresistant

The Omnichem website uses cookies. By continuing to use the site, you consent to their use in accordance with our Privacy Policy and to the collection of analytics.