ForTii® TX1
ForTii® TX1 is a breakthrough high-temperature polyamide with halogen-free and halogen-containing flame retardant grades and a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties. It is mainly used for demanding applications in the electronics, lighting, automotive, white goods, industrial, and aerospace industries. It has robust mechanical and JEDEC Level 2 performance, enabling the SMT process without deformation and a low risk of blistering. TX1 has stable processing behavior and is suitable for typical consumer electronics connector manufacturing, such as I/O, FPC, and WTB connectors. It is 30% glass-reinforced, PA4T, electro-friendly, halogen-free, and free of red phosphorous. It is certified V-0 at 0.35 mm. It is best suited for injection Molding.
Product families
- Polyamides
Other characteristics
- Brand
- ForTii®
- Polymer Name
- Polyphthalamide (PPA)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 11000.0 - 11000.0 MPa
- Processing Methods
- Injection Molding
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Flame Rating
- UL 94 V0
- Technology
- Plastics
- Packaging Type
- Bags
- Boxes
- Silos
- Super Sacks
- Labeling Claims
- Halogen-free
- Phosphorus-free
- Quality Standards
- UL Yellow Card (E47960)
- Material Features
- Electro-Friendly
- Heat Resistance
- UL Flame Rated
- Certifications and Compliance
- ISO 14001
- OHSAS
- REACH (Europe)
- UL 94
- Plastics and Elastomers End Uses
- Automotive Electronics
- Connectors
- Plastics and Elastomers Functions
- Resin
- Power Connectors Application Data
ForTii® PA4T allows for reliable solutions due to its excellent mechanical strength (outperforming other high temperature polyamides or liquid crystal polymers at the wall breakage test), its high CTI (enabling smaller creep resistances and higher power ratings) and due to its flame retardant UL94-V0 classification (even down to wall thicknesses of 0.2mm); ForTii® PA4T allows for cost effective solutions to due good processability and high flowability enabling thin walled designs; ForTii® PA4T allow for even more sustainable solutions with reduced environmental impact due to its lower carbon footprint as compared to alternative materials
- Application Data
ForTii® PA4T allows for reliable solutions due to its excellent stiffness and high deflection temperature under load (HDT) and its excellent low warpage behavior after reflow soldering, outperforming Liquid Crystal Polymer (LCPs) and polyphthalamides (PPAs); ForTii® enables DDR manufacturers to produce more cost effective applications with reduced weight and height, enabling easy rework at lower temperature loads, with fewer heat traps and better thermal airflow; ForTii® PA4T allows for sustainable solutions due to its good carbon footprint and due the use of halogen and red-phosphorous free flameretardants
- Reflow Connectors Application Data
Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering); ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering; Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)
- Audio Jack Connectors Application Data
Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to its outstanding mechanical strength outperforming competitive materials for jacks by up to four times, therefore enabling 20.000-plus insertion/extraction cycles. Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions to due good processability and high flowability enabling thin walled designs
Technical data
Table 1 of 7
20 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus | 11500 / 12000 | MPa | ISO 527-1/-2 |
| Tensile Modulus (120°C) | 8000 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (160°C) | 5000 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness, 1mm) | 10700 / - | MPa | ISO 527-1/-2 |
| Stress at Break | 150 / 140 | MPa | ISO 527-1/-2 |
| Stress at Break (120°C) | 95 / - | MPa | ISO 527-1/-2 |
| Stress at Break (160°C) | 65 / * | MPa | ISO 527-1/-2 |
| Stress at Break, at low thickness | 155 / - | MPa | ISO 527-1/-2 |
| Stress at Break (Thickness tested) | 1 / - | mm | ISO 527-1/-2 |
| Strain at Break | 2 / 1.9 | % | ISO 527-1/-2 |
| Strain at Break (at 120°C) | 2.5 / - | % | ISO 527-1/-2 |
| Strain at Break (at 160°C) | 3.6 / * | % | ISO 527-1/-2 |
Table 2 of 7
22 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (10°C/min) | 325 / * | °C | ISO 11357-1/-3 |
| Glass Transition Temperature (at 10°C/min) | 125 / * | °C | ISO 11357-1/-2 |
| Temperature of Deflection Under Load (1.80 MPa) | 305 / * | °C | ISO 75-1/-2 |
| Temperature of Deflection Under Load (0.45 MPa) | 323 / * | °C | ISO 75-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.2 / * | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.3 / * | E-4/°C | ASTM D696 |
| Coefficient of Linear Thermal Expansion (normal) | 0.65 / * | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (normal) | 0.35 / * | E-4/°C | ASTM D696 |
| Burning Behaviour (at 1.5 mm Nominal Thickness) | UL V-0 / * | class | IEC 60695-11-10 |
| Burning Behaviour (at 3.0 mm Nominal Thickness) | UL V-0 / * | class | IEC 60695-11-10 |
| Oxygen Index | 39 / * | % | ISO 4589-1/-2 |
| Ball Pressure Temperature | 305 / * | °C | IEC 60695-10-2 |
Table 3 of 7
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Relative Permittivity (100Hz) | 4.2 / 4.2 | — | IEC 62631-2-1 |
| Relative Permittivity (1 MHz) | 3.9 / 3.9 | — | IEC 62631-2-1 |
| Relative Permittivity (1GHz) | 3.8 / 3.9 | — | IEC 60250 |
| Dissipation Factor (100 Hz) | 64 / 64 | E-4 | IEC 62631-2-1 |
| Dissipation Factor (1 MHz) | 176 / 176 | E-4 | IEC 62631-2-1 |
| Dissipation Factor (1GHz) | 130 / 130 | E-4 | IEC 60250 |
| Electric Strength | 33 / 33 | kV/mm | IEC 60243-1 |
| Comparative Tracking Index | 600 / - | V | IEC 60112 |
| Comparative Tracking Index (above 600V) | ≥800V / * | V | Sim. to IEC 60112 |
Table 4 of 7
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Viscosity Number | 86 / * | cm³/g | ISO 307, 1157, 1628 |
Table 5 of 7
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Water Absorption | 4.1 / * | % | Sim. to ISO 62 |
| Water Absorption in Water (at 23°C after 24h) | 0.3 / * | % | ISO 62 |
| Humidity Absorption | 1.6 / * | % | Sim. to ISO 62 |
| Density | 1460 / - | kg/m³ | ISO 1183 |
Table 6 of 7
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Molding Shrinkage (parallel) | 0.35 / * | % | ISO 294-4 |
| Molding Shrinkage (normal) | 1.2 / * | % | ISO 294-4 |
| Spiral Flow Length 1.0 mm 800 bar | 110 / * | mm | — |
| Spiral Flow Length 1.0 mm 900 bar | 120 / * | mm | — |
| Spiral Flow Length 1.0 mm 1000 bar | 130 / * | mm | — |
Химическая стойкость
384 rows| Characteristic | Value | Unit |
|---|---|---|
| Other | Acetaldehyde (40% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at >140°C | not resistant |
| Other | Acetic acid (10% by mass) at 100°C | not resistant |
| Other | Acetic acid (10% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetic acid (95% by mass) at 23°C | not resistant |
| Other | Acetic anhydride | limited resistant, tests necessary to verify |
| Ketones | Acetone at 23°C | resistant |
| Other | Acetonitrile | resistant |
| Other | Acetophenone at 23°C | resistant |
| Other | Acetyl chloride at 23°C | not resistant |
| Other | Acetylene at 23°C | resistant |
