ForTii® MX2
ForTii® MX2 is a high-Tg PPA (polyphthalamide) that excels in dimensional stability at elevated temperatures due to its high heat deflection temperature (HDT). ForTii® MX2 exhibits excellent fatigue performance and good chemical resistance. The material is 40% glass-reinforced and heat stabilized, making it suitable for automotive applications. The processing technology for this product is injection molding.
Product families
Applications
- Powertrain & UTH
Product Families
- Polyamides
Other characteristics
- Brand
- ForTii®
- Polymer Name
- Polyphthalamide (PPA)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 14000.0 - 14000.0 MPa
- Additives Included
- Heat Stabilizer
- Processing Methods
- Injection Molding
- Markets
- Automotive & Transportation
- Technology
- Plastics
- OEM Standards
- Callout
- Jaguar Land Rover
- Packaging Type
- Bags
- Boxes
- Silos
- Super Sacks
- Material Features
- Heat Resistance
- Heat Stabilized
- High Stiffness
- High Strength
- OEM Specifications
- CALLOUT ASTM D6779 PA152G40
- STJLR.51.5262
- Certifications and Compliance
- ISO 14001
- OHSAS
- REACH (Europe)
- Plastics and Elastomers End Uses
- Automotive Applications
- Crankshaft Covers
- Plastics and Elastomers Functions
- Resin
- Crankshaft Covers Application Data
ForTii® PA4T, Stanyl® PA46 and EcoPaXX® PA410 allow for light weight solutions (50% less weight compared to metal) and for cost effective solutions (up to 25% lower system/part costs compared to metal); ForTii® PA4T, Stanyl® PA46 and EcoPaXX® PA410 allow for reliable solutions due to good compatibility with FKM/LSR rubbers and to good creep&fatigue resistance in case of Stanyl® and to good temperature resistance up to 150-200°C in case of ForTii® and EcoPaXX®; Xytron™PPS can provide lots of benefits on creep, fatigue&oil resistance, even at elevated temperature.
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 6
51 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus | 14500 / 14800 | MPa | ISO 527-1/-2 |
| Tensile Modulus (-40°C) | 14800 / 15000 | MPa | ISO 527-1/-2 |
| Tensile Modulus (40°C) | 14200 / 14000 | MPa | ISO 527-1/-2 |
| Tensile Modulus (80°C) | 13500 / 8800 | MPa | ISO 527-1/-2 |
| Tensile Modulus (100°C) | 12800 / 7000 | MPa | ISO 527-1/-2 |
| Tensile Modulus (120°C) | 9500 / 6300 | MPa | ISO 527-1/-2 |
| Tensile Modulus (150°C) | 6700 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (160°C) | 6300 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (180°C) | 5500 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (200°C) | 5300 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (210°C) | 5000 / * | MPa | ISO 527-1/-2 |
| Stress at Break | 230 / 210 | MPa | ISO 527-1/-2 |
Table 2 of 6
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (10°C/min) | 325 / * | °C | ISO 11357-1/-3 |
| Glass Transition Temperature (at 10°C/min) | 125 / * | °C | ISO 11357-1/-2 |
| Glass Transition Temperature from DMTA (tan d) | 130 / * | °C | ASTM D5026/D7028 |
| Temperature of Deflection Under Load (1.80 MPa) | 305 / * | °C | ISO 75-1/-2 |
| Temperature of Deflection Under Load (0.45 MPa) | 317 / * | °C | ISO 75-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.3 / * | E-4/°C | ASTM D696 |
| Coefficient of Linear Thermal Expansion (normal) | 0.35 / * | E-4/°C | ASTM D696 |
| Glow Wire Flammability Index (at thickness 0.8 / - mm) | 725 / - | °C | IEC 60695-2-12 |
| Glow Wire Flammability Index (at thickness 1.5 / - mm) | 700 / - | °C | IEC 60695-2-12 |
| Glow Wire Ignition Temperature (at thickness 0.8 / - mm) | 725 / - | °C | IEC 60695-2-13 |
| Glow Wire Ignition Temperature (at thickness 1.5 / - mm) | 725 / - | °C | IEC 60695-2-13 |
| Thermal Index (5000 hrs) | 180 / * | °C | IEC 60216/ISO 527-1/-2 |
Table 3 of 6
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Relative Permittivity (100Hz) | 4.9 / 5.7 | — | IEC 62631-2-1 |
| Relative Permittivity (1 MHz) | 4.6 / 4.8 | — | IEC 62631-2-1 |
| Dissipation Factor (100 Hz) | 57 / 270 | E-4 | IEC 62631-2-1 |
| Dissipation Factor (1 MHz) | 180 / 290 | E-4 | IEC 62631-2-1 |
| Volume Resistivity | >1E13 / >1E13 | Ohm*m | IEC 62631-3-1 |
| Surface Resistivity | - / >1E15 | Ohm | IEC 62631-3-2 |
Table 4 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Water Absorption | 4.7 / * | % | Sim. to ISO 62 |
| Water Absorption in Water (at 23°C after 24h) | 0.35 / * | % | ISO 62 |
| Humidity Absorption | 1.8 / * | % | Sim. to ISO 62 |
| Density | 1550 / - | kg/m³ | ISO 1183 |
Table 5 of 6
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Molding Shrinkage (parallel) | 0.35 / * | % | ISO 294-4 |
| Molding Shrinkage (normal) | 1 / * | % | ISO 294-4 |
| Spiral Flow Length 1.0 mm 1000 bar | 82 / * | mm | — |
Химическая стойкость
384 rows| Characteristic | Value | Unit |
|---|---|---|
| Other | Acetaldehyde (40% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at >140°C | not resistant |
| Other | Acetic acid (10% by mass) at 100°C | not resistant |
| Other | Acetic acid (10% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetic acid (95% by mass) at 23°C | not resistant |
| Other | Acetic anhydride | limited resistant, tests necessary to verify |
| Ketones | Acetone at 23°C | resistant |
| Other | Acetonitrile | resistant |
| Other | Acetophenone at 23°C | resistant |
| Other | Acetyl chloride at 23°C | not resistant |
| Other | Acetylene at 23°C | resistant |
