ForTii® JTX2
ForTii® JTX2 is a breakthrough high-temperature polyamide that offers halogen-free and halogen-containing flame retardant grades, making it suitable for demanding applications in industries such as electronics, lighting, automotive, white goods, industrial, and aerospace. It provides robust mechanical performance and exhibits good reliability under thermal aging and mechanical shock. ForTii® JTX2 consistently performs well in injection molding processes and has a low risk of blistering, as it has a JEDEC MLS (Moisture Level Sensitivity) 1 rating for specified thicknesses. It is particularly suitable for reflowing headers and connectors in automotive electronics. The processing technology for this product is injection molding.
Product families
Applications
- Electrical & Electronic Systems
- Automotive Electronics
- Connectors
Product Families
- Polyamides
Other characteristics
- Brand
- ForTii®
- Polymer Name
- Polyphthalamide (PPA)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 10500.0 - 10500.0 MPa
- Processing Methods
- Injection Molding
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Flame Rating
- UL 94 HB
- Technology
- Plastics
- OEM Standards
- Volkswagen
- Packaging Type
- Bags
- Boxes
- Silos
- Super Sacks
- Quality Standards
- UL Yellow Card (E47960)
- Material Features
- Electro-Friendly
- Heat Resistance
- UL Flame Rated
- OEM Specifications
- VW/VW 50180
- Certifications and Compliance
- ISO 14001
- OHSAS
- REACH (Europe)
- UL 94
- Plastics and Elastomers End Uses
- Automotive Electronics
- Car Computer Control System
- Connectors
- Plastics and Elastomers Functions
- Resin
- Automotive Connectors Application Data
Stanyl® PA46, ForTii® PA4T, EcoPaXX® PA410, Akulon® PA66, Akulon® PA6, Arnite® PBT allow for reliable solutions due to high temperature resistance, high mechanical property levels and good electrical insulation properties; Stanyl® PA46 allows for cost effective solutions due to a better flowability and processability than PPS and PPA enabling therefore thin wall designs; ForTii® PA4T allows for reliable solutions exposed to very high peak temperatures due to its melting point of 325 C; ForTii® PA4T allows for reliable solutions due to high temperature resistance (melting temp 325ºC enables high reflow temperatures), high mechanical performance also after reflow soldering, high dimensional stability, a low isotropic CTE leading to a high co-planarity and low warpage after soldering; ForTii® PA4T allows for cost effective solutions due to high mechanical performance leading to reduced reject rates during pin assembly and due to high flowability enabling thin wall designs
- Plastics and Elastomers Processing Methods
- Injection Molding
- Car Computer Control System Application Data
Highest safety and reliability for interconnects of ADAS sensors and during assembly and use phase; No electro corrosion; Infinite shelf life time; All colors
Technical data
Table 1 of 6
39 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus | 11300 / 11500 | MPa | ISO 527-1/-2 |
| Tensile Modulus (80°C) | 10500 / 6200 | MPa | ISO 527-1/-2 |
| Tensile Modulus (120°C) | 8000 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (160°C) | 4500 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (200°C) | 4000 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness, 1mm) - Dry | 10800 | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness) - cond. | 11000 | MPa | ISO 527-1/-2 |
| Stress at Break | 200 / 180 | MPa | ISO 527-1/-2 |
| Stress at Break (80°C) | 180 / 95 | MPa | ISO 527-1/-2 |
| Stress at Break (120°C) | 135 / - | MPa | ISO 527-1/-2 |
| Stress at Break (160°C) | 90 / * | MPa | ISO 527-1/-2 |
| Stress at Break (200°C) | 75 / * | MPa | ISO 527-1/-2 |
Table 2 of 6
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (10°C/min) | 325 / * | °C | ISO 11357-1/-3 |
| Glass Transition Temperature (at 10°C/min) | 125 / * | °C | ISO 11357-1/-2 |
| Glass Transition Temperature from DMTA (tan d) | 130 / * | °C | ASTM D5026/D7028 |
| Temperature of Deflection Under Load (1.80 MPa) | 305 / * | °C | ISO 75-1/-2 |
| Temperature of Deflection Under Load (0.45 MPa) | 320 / * | °C | ISO 75-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.33 / * | E-4/°C | ASTM D696 |
| Coefficient of Linear Thermal Expansion (normal) | 0.4 / * | E-4/°C | ASTM D696 |
| Burning Behaviour (at 3 / * mm Nominal Thickness) | UL HB / * | class | IEC 60695-11-10 |
| Thermal Index (2500 hrs) | 180 / * | °C | IEC 60216/ISO 527-1/-2 |
| Thermal Index (5000 hrs) | 167 / * | °C | IEC 60216/ISO 527-1/-2 |
| Thermal Index (10000 hrs) | 154 / * | °C | IEC 60216/ISO 527-1/-2 |
| Thermal Index (20000 hrs) | 142 / * | °C | IEC 60216/ISO 527-1/-2 |
Table 3 of 6
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Relative Permittivity (100Hz) | 5 / 5 | — | IEC 62631-2-1 |
| Relative Permittivity (1 MHz) | 4.5 / 4.5 | — | IEC 62631-2-1 |
| Relative Permittivity (1GHz) | 3.9 / 4 | — | IEC 60250 |
| Relative Permittivity (10GHz) | 3.8 / 3.9 | — | IEC 60250 |
| Dissipation Factor (100 Hz) | 150 / 150 | E-4 | IEC 62631-2-1 |
| Dissipation Factor (1 MHz) | 280 / 280 | E-4 | IEC 62631-2-1 |
| Dissipation Factor (1GHz) | 140 / 150 | E-4 | IEC 60250 |
| Dissipation Factor (10GHz) | 120 / 150 | E-4 | IEC 60250 |
| Volume Resistivity | >1E13 / >1E13 | Ohm*m | IEC 62631-3-1 |
| Surface Resistivity | - / >1E15 | Ohm | IEC 62631-3-2 |
| Electric Strength | 43 / 40 | kV/mm | IEC 60243-1 |
| Comparative Tracking Index | 600 / - | V | IEC 60112 |
Table 4 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Water Absorption | 5.1 / * | % | Sim. to ISO 62 |
| Water Absorption in Water (at 23°C after 24h) | 0.4 / * | % | ISO 62 |
| Humidity Absorption | 2 / * | % | Sim. to ISO 62 |
| Density | 1430 / - | kg/m³ | ISO 1183 |
Table 5 of 6
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Molding Shrinkage (parallel) | 0.4 / * | % | ISO 294-4 |
| Molding Shrinkage (normal) | 1.2 / * | % | ISO 294-4 |
| Spiral Flow Length 1.0 mm 1000 bar | 90 / * | mm | — |
Химическая стойкость
384 rows| Characteristic | Value | Unit |
|---|---|---|
| Other | Acetaldehyde (40% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at >140°C | not resistant |
| Other | Acetic acid (10% by mass) at 100°C | not resistant |
| Other | Acetic acid (10% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetic acid (95% by mass) at 23°C | not resistant |
| Other | Acetic anhydride | limited resistant, tests necessary to verify |
| Ketones | Acetone at 23°C | resistant |
| Other | Acetonitrile | resistant |
| Other | Acetophenone at 23°C | resistant |
| Other | Acetyl chloride at 23°C | not resistant |
| Other | Acetylene at 23°C | resistant |
