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ForTii® Eco LDS62B
- Chemical Family
- Polyamides
ForTii® Eco LDS62B is a high-ductility laser direct structuring (LDS) material that provides good structural integrity in complex geometries. It is well-suited for applications in wearable devices and smart phone antennas in the consumer electronics industry. The material exhibits excellent dimensional stability, minimizing warpage after chemical plating. Similar to ForTii® Eco E11, ForTii® Eco LDS62B also contains partly bio-based content, contributing to its eco-friendly nature. The processing technology used for this product is injection molding, and it offers the special feature of low warpage.
Product families
Applications
Automotive & Transportation — Automotive
- Electrical & Electronic Systems
Electrical & Electronics — Devices & Assemblies
- Automotive Electronics
- Industrial Automation
Electrical & Electronics — Parts & Components
- Connectors
Product Families
Plastics — Engineering & Specialty Polymers
- Polyamides
Other characteristics
- Brand
- ForTii®
- Polymer Name
- Polyamide (unspecified)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 10000.0 - 10000.0 MPa
- Processing Methods
- Injection Molding
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Technology
- Plastics
- Packaging Type
- Bags
- Boxes
- Silos
- Super Sacks
- Labeling Claims
- Bio-based
- Sustainable
- Material Features
- Good Aesthetics
- Good Strength
- Heat Resistance
- High Durability
- Laser Weldable
- Low Warpage
- Certifications and Compliance
- ISO 14001
- OHSAS
- REACH (Europe)
- Plastics and Elastomers End Uses
- Connectors
- Mobile Phone Antenna
- Robotics
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 6
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus | 11500 / - | MPa | ISO 527-1/-2 |
| Stress at Break | 130 / - | MPa | ISO 527-1/-2 |
| Strain at Break | 1.7 / - | % | ISO 527-1/-2 |
| Flexural Modulus | 10000 / - | MPa | ISO 178 |
| Flexural Strength | 190 / - | MPa | ISO 178 |
| Charpy Notched Impact Strength (at +23°C) | 4.6 / - | kJ/m² | ISO 179/1eA |
Table 2 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (10°C/min) | 319 / * | °C | ISO 11357-1/-3 |
| Temperature of Deflection Under Load (1.80 MPa) | 235 / * | °C | ISO 75-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.17 / * | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (normal) | 0.66 / * | E-4/°C | ISO 11359-1/-2 |
Table 3 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Relative Permittivity (1GHz) | 3.74 / 3.8 | — | IEC 60250 |
| Relative Permittivity (5GHz) | 3.7 / 3.75 | — | IEC 60250 |
| Dissipation Factor (1GHz) | 137 / 170 | E-4 | IEC 60250 |
| Dissipation Factor (5GHz) | 109 / 140 | E-4 | IEC 60250 |
Table 4 of 6
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density | 1500 / - | kg/m³ | ISO 1183 |
Table 5 of 6
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Molding Shrinkage (parallel) | 0.21 / * | % | ISO 294-4 |
| Molding Shrinkage (normal) | 0.7 / * | % | ISO 294-4 |
Химическая стойкость
384 rows| Characteristic | Value | Unit |
|---|---|---|
| Other | Acetaldehyde (40% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at >140°C | not resistant |
| Other | Acetic acid (10% by mass) at 100°C | not resistant |
| Other | Acetic acid (10% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetic acid (95% by mass) at 23°C | not resistant |
| Other | Acetic anhydride | limited resistant, tests necessary to verify |
| Ketones | Acetone at 23°C | resistant |
| Other | Acetonitrile | resistant |
| Other | Acetophenone at 23°C | resistant |
| Other | Acetyl chloride at 23°C | not resistant |
| Other | Acetylene at 23°C | resistant |
