ForTii® LDS85B

Name: ForTii® LDS85B
Brand: ForTii®

ForTii® LDS85B is a breakthrough high-temperature polyamide that offers halogen-free and halogen-containing flame retardant grades, making it suitable for demanding applications in industries such as electronics, lighting, automotive, white goods, industrial, and aerospace. It enables mechanical function integration with high impact resistance and ductility. ForTii® LDS85B exhibits very good plating performance. The processing technology for this product is injection molding, and it offers the special feature of being 30% glass-reinforced.

Product families

Applications

Automotive & Transportation — Automotive

Automotive Lighting
Electrical & Electronic Systems

Electrical & Electronics — Devices & Assemblies

Automotive Electronics
Industrial Automation

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Printed Circuit Boards (PCBs)

Product Families

Plastics — Engineering & Specialty Polymers

Polyamides

Other characteristics

Brand: ForTii®
Polymer Name: Polyphthalamide (PPA)
Fillers Included: Glass Fiber
Flexural Modulus: 9400.0 - 9400.0 MPa
Processing Methods: Injection Molding
Markets: Automotive & Transportation
Electrical & Electronics
Flame Rating: UL 94 HB
Technology: Plastics
Packaging Type: Bags
Boxes
Silos
Super Sacks
Quality Standards: UL Yellow Card (E47960)
Material Features: Good Aesthetics
Good Strength
Heat Resistance
High Durability
UL Flame Rated
Certifications and Compliance: ISO 14001
OHSAS
REACH (Europe)
UL 94
Plastics and Elastomers End Uses: Connectors
Housings
Lighting Applications
Robotics
Plastics and Elastomers Functions: Resin
T10 LDS Sockets Application Data: LDS solution for auto lighting; High design freedom; Integration of mechanical and electronics components
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 6

27 rows

Characteristic	Value	Unit	Method
Tensile Modulus	10000 / 10000	MPa	ISO 527-1/-2
Tensile Modulus (120°C)	5600 / -	MPa	ISO 527-1/-2
Tensile Modulus (160°C)	3000 / *	MPa	ISO 527-1/-2
Tensile Modulus (Low Thickness, 1mm) - Dry	10000	MPa	ISO 527-1/-2
Tensile Modulus (Low Thickness) - cond.	10000	MPa	ISO 527-1/-2
Stress at Break	125 / 105	MPa	ISO 527-1/-2
Stress at Break (120°C)	64 / -	MPa	ISO 527-1/-2
Stress at Break (160°C)	45 / *	MPa	ISO 527-1/-2
Stress at Break, at low thickness	130 / 110	MPa	ISO 527-1/-2
Stress at Break (Thickness tested)	1 / -	mm	ISO 527-1/-2
Strain at Break	2.1 / 2.1	%	ISO 527-1/-2
Strain at Break (at 120°C)	4 / -	%	ISO 527-1/-2

Table 2 of 6

7 rows

Characteristic	Value	Unit	Method
Melting Temperature (10°C/min)	325 / *	°C	ISO 11357-1/-3
Glass Transition Temperature (at 10°C/min)	125 / *	°C	ISO 11357-1/-2
Temperature of Deflection Under Load (1.80 MPa)	285 / *	°C	ISO 75-1/-2
Temperature of Deflection Under Load (0.45 MPa)	315 / *	°C	ISO 75-1/-2
Coefficient of Linear Thermal Expansion (parallel)	0.18 / *	E-4/°C	ISO 11359-1/-2
Coefficient of Linear Thermal Expansion (normal)	0.6 / *	E-4/°C	ISO 11359-1/-2
Burning Behaviour (at 3 / * mm Nominal Thickness)	UL HB / *	class	IEC 60695-11-10

Table 3 of 6

4 rows

Characteristic	Value	Unit	Method
Relative Permittivity (1GHz)	3.78 / 3.85	—	IEC 60250
Relative Permittivity (5GHz)	3.73 / 3.8	—	IEC 60250
Dissipation Factor (1GHz)	160 / 190	E-4	IEC 60250
Dissipation Factor (5GHz)	140 / 170	E-4	IEC 60250

Table 4 of 6