ForTii® T11
ForTii® T11 is a breakthrough high-temperature polyamide with halogen-free and halogen-containing flame retardant grades and a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties. It is mainly used for demanding applications in the electronics, lighting, automotive, white goods, industrial, and aerospace industries. It has optimal toughness and is the best solution for (automotive) electrical components in harsh environments to minimize the risk of cracking and to provide design freedom and product reliability in terms of thermal shock aging and 1000 cycles.
Product families
- Polyamides
Other characteristics
- Brand
- ForTii®
- Polymer Name
- Polyphthalamide (PPA)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 11000.0 - 11000.0 MPa
- Processing Methods
- Injection Molding
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Flame Rating
- UL 94 V0
- Technology
- Plastics
- OEM Standards
- Volkswagen
- Packaging Type
- Bags
- Boxes
- Silos
- Super Sacks
- Labeling Claims
- Halogen-free
- Phosphorus-free
- Quality Standards
- UL Yellow Card (E47960)
- Material Features
- Durable
- Heat Resistance
- Low CLTE
- Low Warpage
- Thermal Shock Resistant
- UL Flame Rated
- OEM Specifications
- VW/VW 50180
- Certifications and Compliance
- ISO 14001
- OHSAS
- REACH (Europe)
- UL 94
- Plastics and Elastomers End Uses
- Alternator Parts
- Automotive E-Motor Bobbins
- Automotive Electronics
- Brush Holders
- Car Computer Control System
- Coil Insulation
- Connectors
- Endlaminates
Technical data
Table 1 of 6
40 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus | 11500 / 12000 | MPa | ISO 527-1/-2 |
| Tensile Modulus (-40°C) | 12000 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (80°C) | 10800 / 7600 | MPa | ISO 527-1/-2 |
| Tensile Modulus (100°C) | 10000 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (120°C) | 8000 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (140°C) | 5700 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (160°C) | 5000 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness, 1mm) | 10800 / - | MPa | ISO 527-1/-2 |
| Stress at Break | 160 / 150 | MPa | ISO 527-1/-2 |
| Stress at Break (-40°C) | 180 / - | MPa | ISO 527-1/-2 |
| Stress at Break (80°C) | 130 / 90 | MPa | ISO 527-1/-2 |
| Stress at Break (100°C) | 120 / - | MPa | ISO 527-1/-2 |
Table 2 of 6
26 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (10°C/min) | 325 / * | °C | ISO 11357-1/-3 |
| Glass Transition Temperature (at 10°C/min) | 125 / * | °C | ISO 11357-1/-2 |
| Temperature of Deflection Under Load (1.80 MPa) | 305 / * | °C | ISO 75-1/-2 |
| Temperature of Deflection Under Load (0.45 MPa) | 323 / * | °C | ISO 75-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.2 / * | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.3 / * | E-4/°C | ASTM D696 |
| Coefficient of Linear Thermal Expansion (normal) | 0.65 / * | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (normal) | 0.35 / * | E-4/°C | ASTM D696 |
| Thermal Conductivity in Plane | 0.4 / * | W/(m K) | ASTM E1461 |
| Burning Behaviour (at 1.5 mm Nominal Thickness) | UL V-0 / * | class | IEC 60695-11-10 |
| Burning Behaviour (at 3.0 mm Nominal Thickness) | UL V-0 / * | class | IEC 60695-11-10 |
| Ball Pressure Temperature | 305 / * | °C | IEC 60695-10-2 |
Table 3 of 6
13 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Relative Permittivity (100Hz) | 4.2 / 4.2 | — | IEC 62631-2-1 |
| Relative Permittivity (1 MHz) | 3.9 / 3.9 | — | IEC 62631-2-1 |
| Relative Permittivity (1GHz) | 3.8 / 3.9 | — | IEC 60250 |
| Relative Permittivity (10GHz) | 3.8 / 3.9 | — | IEC 60250 |
| Dissipation Factor (100 Hz) | 64 / 64 | E-4 | IEC 62631-2-1 |
| Dissipation Factor (1 MHz) | 176 / 176 | E-4 | IEC 62631-2-1 |
| Dissipation Factor (1GHz) | 130 / 130 | E-4 | IEC 60250 |
| Dissipation Factor (10GHz) | 110 / 130 | E-4 | IEC 60250 |
| Volume Resistivity | >1E13 / >1E13 | Ohm*m | IEC 62631-3-1 |
| Surface Resistivity | - / >1E15 | Ohm | IEC 62631-3-2 |
| Electric Strength | 33 / 33 | kV/mm | IEC 60243-1 |
| Comparative Tracking Index | 600 / - | V | IEC 60112 |
Table 4 of 6
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Water Absorption | 4.1 / * | % | Sim. to ISO 62 |
| Humidity Absorption | 1.6 / * | % | Sim. to ISO 62 |
| Density | 1460 / - | kg/m³ | ISO 1183 |
Table 5 of 6
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Molding Shrinkage (parallel) | 0.3 / * | % | ISO 294-4 |
| Molding Shrinkage (normal) | 1.2 / * | % | ISO 294-4 |
| Spiral Flow Length 1.0 mm 1000 bar | 115 / * | mm | — |
Химическая стойкость
384 rows| Characteristic | Value | Unit |
|---|---|---|
| Other | Acetaldehyde (40% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at >140°C | not resistant |
| Other | Acetic acid (10% by mass) at 100°C | not resistant |
| Other | Acetic acid (10% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetic acid (95% by mass) at 23°C | not resistant |
| Other | Acetic anhydride | limited resistant, tests necessary to verify |
| Ketones | Acetone at 23°C | resistant |
| Other | Acetonitrile | resistant |
| Other | Acetophenone at 23°C | resistant |
| Other | Acetyl chloride at 23°C | not resistant |
| Other | Acetylene at 23°C | resistant |
