ForTii® Eco E11

Name: ForTii® Eco E11
Brand: ForTii®

ForTii® Eco E11 is a breakthrough high-temperature polyamide that offers halogen-free and halogen-containing flame retardant grades, making it suitable for demanding applications in industries such as electronics, lighting, automotive, white goods, industrial, and aerospace. It provides an excellent balance of flow, toughness, and stiffness, along with superior processing performance for injection molding. The material has improved toughness and is suitable for surface mount technology (SMT) processes. Additionally, it contains partly bio-based content, making it an eco-friendly choice. The processing technology for this product is injection molding, which is characterized by good or high flow and is phosphorous-free.

Product families

Applications

Electrical & Electronics — Parts & Components

Connectors

Product Families

Plastics — Engineering & Specialty Polymers

Polyamides

Other characteristics

Brand: ForTii®
Polymer Name: Polyphthalamide (PPA)
Fillers Included: Glass Fiber
Flexural Modulus: 10000.0 - 10000.0 MPa
Processing Methods: Injection Molding
Markets: Electrical & Electronics
Flame Rating: UL 94 V0
Technology: Plastics
Packaging Type: Bags
Boxes
Silos
Super Sacks
Labeling Claims: Bio-based
Halogen-free
Phosphorus-free
Sustainable
Quality Standards: UL Yellow Card (E47960)
Material Features: Good Flow
Heat Resistance
High Flow
UL Flame Rated
Certifications and Compliance: ISO 14001
OHSAS
REACH (Europe)
UL 94
Plastics and Elastomers End Uses: Connectors
Plastics and Elastomers Functions: Resin
Reflow Connectors Application Data: Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering); ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering; Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)
Application Data: ForTii® PA4T allows for reliable solutions due to its excellent stiffness and high deflection temperature under load (HDT) and its excellent low warpage behavior after reflow soldering, outperforming Liquid Crystal Polymer (LCPs) and polyphthalamides (PPAs); ForTii® enables DDR manufacturers to produce more cost effective applications with reduced weight and height, enabling easy rework at lower temperature loads, with fewer heat traps and better thermal airflow; ForTii® PA4T allows for sustainable solutions due to its good carbon footprint and due the use of halogen and red-phosphorous free flame retardants

Technical data

Table 1 of 6

25 rows

Characteristic	Value	Unit	Method
Tensile Modulus	11500 / 11000	MPa	ISO 527-1/-2
Tensile Modulus (-40°C)	12000 / -	MPa	ISO 527-1/-2
Tensile Modulus (80°C)	9000 / -	MPa	ISO 527-1/-2
Tensile Modulus (100°C)	7000 / -	MPa	ISO 527-1/-2
Tensile Modulus (120°C)	5500 / -	MPa	ISO 527-1/-2
Tensile Modulus (140°C)	4700 / *	MPa	ISO 527-1/-2
Tensile Modulus (160°C)	4200 / *	MPa	ISO 527-1/-2
Stress at Break	155 / 145	MPa	ISO 527-1/-2
Stress at Break (-40°C)	180 / -	MPa	ISO 527-1/-2
Stress at Break (80°C)	110 / -	MPa	ISO 527-1/-2
Stress at Break (100°C)	85 / -	MPa	ISO 527-1/-2
Stress at Break (120°C)	70 / -	MPa	ISO 527-1/-2

Table 2 of 6

15 rows

Characteristic	Value	Unit	Method
Melting Temperature (10°C/min)	325 / *	°C	ISO 11357-1/-3
Temperature of Deflection Under Load (1.80 MPa)	275 / *	°C	ISO 75-1/-2
Temperature of Deflection Under Load (0.45 MPa)	300 / *	°C	ISO 75-1/-2
Coefficient of Linear Thermal Expansion (parallel)	0.2 / *	E-4/°C	ISO 11359-1/-2
Coefficient of Linear Thermal Expansion (normal)	0.7 / *	E-4/°C	ISO 11359-1/-2
Thermal Conductivity in Plane	0.41 / *	W/(m K)	ASTM E1461
Thermal Conductivity Through Plane	0.35 / *	W/(m K)	ASTM E1461
Burning Behaviour (at 1.5 mm Nominal Thickness)	UL V-0 / *	class	IEC 60695-11-10
Burning Behaviour (at 3.0 mm Nominal Thickness)	UL V-0 / *	class	IEC 60695-11-10
Glow Wire Flammability Index (at thickness 3 / - mm)	960 / -	°C	IEC 60695-2-12
Glow Wire Flammability Index (at thickness 0.4 / - mm)	960 / -	°C	IEC 60695-2-12
Glow Wire Ignition Temperature (at thickness 1.6 / - mm)	800 / -	°C	IEC 60695-2-13

Table 3 of 6

8 rows

Characteristic	Value	Unit	Method
Relative Permittivity (1GHz)	3.7 / 3.9	—	IEC 60250
Relative Permittivity (10GHz)	3.6 / 3.75	—	IEC 60250
Dissipation Factor (1GHz)	140 / 200	E-4	IEC 60250
Dissipation Factor (10GHz)	100 / 150	E-4	IEC 60250
Volume Resistivity	>1E13 / >1E13	Ohm*m	IEC 62631-3-1
Surface Resistivity	- / >1E15	Ohm	IEC 62631-3-2
Electric Strength	33 / -	kV/mm	IEC 60243-1
Comparative Tracking Index	600 / -	V	IEC 60112

Table 4 of 6

3 rows

Characteristic	Value	Unit	Method
Water Absorption	3.9 / *	%	Sim. to ISO 62
Humidity Absorption	1.4 / *	%	Sim. to ISO 62
Density	1450 / -	kg/m³	ISO 1183

Table 5 of 6