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Akulon® HR-HG6

Chemical Family
Polyamides

Akulon® HR-HG6 is a polyamide 6 (PA 6) and polyamide copolymer that functions as a resin, carries the labeling claim of being bio-based, and offers features like being lightweight. It finds applications in the automotive and transportation markets, specifically in cooling and climate systems and exterior and interior parts.

Other characteristics

Brand
Akulon®
Polymer Name
  • Polyamide 66 (PA 66), Polyamide Copolymer
  • Polyamide 66 (PA 66)
  • Polyamide Copolymer
Fillers Included
Glass Fiber
Additives Included
Heat Stabilizer
Processing Methods
Injection Molding, Injection Molding
Reinforcement Material
Glass Fibers
Safety

For the safety properties of the material, we refer to our SDS which can be ordered at our sales offices. During practical operation we advise to wear personal safety protections for hand/eye/body.

Markets
  • Automotive & Transportation
  • Industrial
PACKAGING

Akulon® grades are supplied in airtight, moisture- proof packaging.

Technology
  • Composite Materials
  • Plastics
OEM Standards
  • General Motors
  • Mercedes
  • PSA
  • Renault
Packaging Type
  • Bags
  • Boxes
  • Silos
  • Super Sacks
Labeling Claims
Bio-based
Material Features
Light Weight
OEM Specifications
  • GM GMW16270P-PA66 GF30
  • MERCEDES DBL 5406
  • PSA Peugeot-Citroen FTM 64 0110
  • RENAULT PMR
Reinforcement Form
  • Tape
  • Unidirectional Fabric
Certifications and Compliance
  • ISO 14001
  • OHSAS
  • REACH (Europe)
Composite Materials Functions
Resins Binders & Matrix Materials
Composites Processing Methods
Injection Molding
Plastics and Elastomers End Uses
  • Air Intake Manifolds
  • Door Panel
  • Flooring
  • Industrial Tanks
  • Thermal Management
  • Wheel Housing Parts

Technical data

Table 1 of 7

35 rows
CharacteristicValueUnitMethod
Tensile Modulus10000 / 6500MPaISO 527-1/-2
Tensile Modulus (-40°C)10500 / -MPaISO 527-1/-2
Tensile Modulus (100°C)4850 / -MPaISO 527-1/-2
Tensile Modulus (120°C)4550 / -MPaISO 527-1/-2
Tensile Modulus (150°C)4100 / *MPaISO 527-1/-2
Tensile Modulus (160°C)3950 / *MPaISO 527-1/-2
Tensile Modulus (180°C)3650 / *MPaISO 527-1/-2
Tensile Modulus (200°C)3350 / *MPaISO 527-1/-2
Stress at Break205 / 125MPaISO 527-1/-2
Stress at Break (-40°C)250 / -MPaISO 527-1/-2
Stress at Break (100°C)111 / -MPaISO 527-1/-2
Stress at Break (120°C)103 / -MPaISO 527-1/-2

Table 2 of 7

15 rows
CharacteristicValueUnitMethod
Melting Temperature (10°C/min)260 / *°CISO 11357-1/-3
Temperature of Deflection Under Load (1.80 MPa)250 / *°CISO 75-1/-2
Temperature of Deflection Under Load (0.45 MPa)260 / *°CISO 75-1/-2
Coefficient of Linear Thermal Expansion (parallel)0.2 / *E-4/°CISO 11359-1/-2
Coefficient of Linear Thermal Expansion (normal)0.7 / *E-4/°CISO 11359-1/-2
Relative Temperature Index (Electrical, 0.71 / * mm)140 / *°CUL746B
Relative Temperature Index (Electrical, 3 / * mm)140 / *°CUL746B
Relative Temperature Index (with impact, 0.71 / * mm)130 / *°CUL746B
Relative Temperature Index (with impact, 3 / * mm)130 / *°CUL746B
Relative Temperature Index (without impact, 0.71 / * mm)130 / *°CUL746B
Relative Temperature Index (without impact, 3 / * mm)130 / *°CUL746B
Thermal Index (2500 hrs)185 / *°CIEC 60216/ISO 527-1/-2

Table 3 of 7

8 rows
CharacteristicValueUnitMethod
Relative Permittivity (100Hz)3.8 / 10—IEC 62631-2-1
Relative Permittivity (1 MHz)3.5 / 4.1—IEC 62631-2-1
Dissipation Factor (100 Hz)90 / 2800E-4IEC 62631-2-1
Dissipation Factor (1 MHz)160 / 800E-4IEC 62631-2-1
Volume Resistivity1E12 / 1E10Ohm*mIEC 62631-3-1
Surface Resistivity- / 1E13OhmIEC 62631-3-2
Electric Strength30 / 25kV/mmIEC 60243-1
Comparative Tracking Index500 / 500VIEC 60112

Table 4 of 7

2 rows
CharacteristicValueUnit
Thermal Conductivity of Melt0.28 / *W/(m K)
Specific Heat Capacity Melt2170 / *J/(kg K)

Table 5 of 7

3 rows
CharacteristicValueUnitMethod
Water Absorption6 / *%Sim. to ISO 62
Humidity Absorption1.6 / *%Sim. to ISO 62
Density1360 / -kg/m³ISO 1183

Table 6 of 7

4 rows
CharacteristicValueUnitMethod
Melt Volume-Flow Rate (at 275 / * °C, 5 / * kg)12.7 / *cm³/10minISO 1133
Melt Flow Index (at 275 / * °C, 5 / * kg)15.3 / *g/10minISO 1133
Molding Shrinkage (parallel)0.2 / *%Sim. to ISO 294-4
Molding Shrinkage (normal)1 / *%Sim. to ISO 294-4

Химическая стойкость

384 rows
CharacteristicValueUnit
OtherAcetaldehyde (40% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetamide (50% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetamide (50% by mass) at >140°Cnot resistant
OtherAcetic acid (10% by mass) at 100°Cnot resistant
OtherAcetic acid (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetic acid (95% by mass) at 23°Cnot resistant
KetonesAcetone at 23°Cresistant
OtherAcetophenone at 23°Cresistant
OtherAcetyl chloride at 23°Cnot resistant
OtherAcetylene at 23°Cresistant
OtherAcrylic acid at 23°Cnot resistant
OtherAliphatic amines at 23°Cresistant

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