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Xytron™ TC6022I

Xytron™ TC6022I is a high-performance plastic compound from is based on PPS (polyphenylene sulfide). It offers extremely good chemical resistance, dimensional stability, intrinsic flame retardancy, and high stiffness. Because of its outstanding properties, it contributes to excellent performance in many different applications. A suitable processing technology for the product is injection molding, which is thermally conductive.

Product families

Applications

Automotive & Transportation — Automotive
  • Powertrain & UTH

Product Families

Plastics — Engineering & Specialty Polymers
  • High Performance Thermoplastics

Other characteristics

Brand
Xytron
Polymer Name
Polyphenylene Sulfide (PPS)
Fillers Included
  • Glass Fiber, Mineral
  • Glass Fiber
  • Mineral
Flexural Modulus
23200.0 - 23200.0 MPa
Processing Methods
Injection Molding
Markets
Automotive & Transportation
Flame Rating
UL 94 V0
Technology
Plastics
Packaging Type
  • Bags
  • Boxes
  • Silos
  • Super Sacks
Quality Standards
UL Yellow Card (E467723)
Material Features
  • Chemical Resistant
  • Good Thermal Conductivity
  • Heat Resistance
  • Thermally Conductive
  • UL Flame Rated
Certifications and Compliance
  • ISO 14001
  • OHSAS
  • REACH (Europe)
  • UL 94
Plastics and Elastomers Functions
Resin

Technical data

Table 1 of 5

31 rows
CharacteristicValueUnitMethod
Tensile Modulus22000MPaISO 527-1/-2
Tensile Modulus (-40°C)23000MPaISO 527-1/-2
Tensile Modulus (120°C)12200MPaISO 527-1/-2
Tensile Modulus (160°C)9900MPaISO 527-1/-2
Tensile Modulus (180°C)9150MPaISO 527-1/-2
Stress at Break120MPaISO 527-1/-2
Stress at Break (-40°C)138MPaISO 527-1/-2
Stress at Break (120°C)78.5MPaISO 527-1/-2
Stress at Break (160°C)63MPaISO 527-1/-2
Stress at Break (180°C)55MPaISO 527-1/-2
Strain at Break0.7%ISO 527-1/-2
Strain at Break (at -40°C)0.75%ISO 527-1/-2

Table 2 of 5

16 rows
CharacteristicValueUnitMethod
Melting Temperature (10°C/min)280°CISO 11357-1/-3
Glass Transition Temperature (at 10°C/min)90°CISO 11357-1/-2
Temperature of Deflection Under Load (1.80 MPa)265°CISO 75-1/-2
Coefficient of Linear Thermal Expansion (parallel)0.11E-4/°CISO 11359-1/-2
Coefficient of Linear Thermal Expansion (normal)0.3E-4/°CISO 11359-1/-2
Coefficient of Linear Thermal Expansion (parallel, above Tg)0.12E-4/°CISO 11359-1/-2
Coefficient of Linear Thermal Expansion (normal, above Tg)0.72E-4/°CISO 11359-1/-2
Thermal Conductivity in Plane2.2W/(m K)ASTM E1461
Thermal Conductivity Through Plane1.2W/(m K)ASTM E1461
Burning Behaviour (at 3.0 mm Nominal Thickness)UL V-0classIEC 60695-11-10
Relative Temperature Index (Electrical, 0.4 mm)130°CUL746B
Relative Temperature Index (Electrical, 3 mm)130°CUL746B

Table 3 of 5

3 rows
CharacteristicValueUnitMethod
Volume Resistivity>1E13Ohm*mIEC 62631-3-1
Surface Resistivity>1E15OhmIEC 62631-3-2
Comparative Tracking Index225VIEC 60112

Table 4 of 5

2 rows
CharacteristicValueUnitMethod
Water Absorption in Water (at 23°C after 24h)0.04%ISO 62
Density1850kg/m³ISO 1183

Table 5 of 5

2 rows
CharacteristicValueUnitMethod
Molding Shrinkage (parallel)0.2%ISO 294-4
Molding Shrinkage (normal)0.5%ISO 294-4

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