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ForTii® K12

ForTii® K12 is a breakthrough high-temperature polyamide that offers halogen-free and halogen-containing flame retardant grades, making it suitable for demanding applications in industries such as electronics, lighting, automotive, white goods, industrial, and aerospace. It combines high mechanical strength with good flowability, making it suitable for designs requiring dimensional stability and impact resistance. It is well-suited for applications such as sensor housings or camera brackets. The processing technology for this product is injection molding, and it offers the special features of being 40% glass-reinforced and electro-friendly.

Product families

Applications

Electrical & Electronics — Parts & Components
  • Connectors

Product Families

Plastics — Engineering & Specialty Polymers
  • Polyamides

Other characteristics

Brand
ForTii®
Polymer Name
Polyphthalamide (PPA)
Fillers Included
Glass Fiber
Flexural Modulus
13500.0 - 13500.0 MPa
Processing Methods
Injection Molding
Markets
Electrical & Electronics
Flame Rating
UL 94 HB
Technology
Plastics
Packaging Type
  • Bags
  • Boxes
  • Silos
  • Super Sacks
Quality Standards
UL Yellow Card (E47960)
Material Features
  • Electro-Friendly
  • Heat Resistance
  • UL Flame Rated
Certifications and Compliance
  • ISO 14001
  • OHSAS
  • REACH (Europe)
  • UL 94
Plastics and Elastomers End Uses
Connectors
Plastics and Elastomers Functions
Resin
Reflow Connectors Application Data

Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering); ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering; Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)

Technical data

Table 1 of 6

7 rows
CharacteristicValueUnitMethod
Tensile Modulus13500 / -MPaISO 527-1/-2
Stress at Break210 / -MPaISO 527-1/-2
Strain at Break2 / -%ISO 527-1/-2
Flexural Modulus13500 / -MPaISO 178
Flexural Strength330 / -MPaISO 178
Charpy Impact Strength (at +23°C)65 / -kJ/m²ISO 179/1eU
Charpy Notched Impact Strength (at +23°C)11 / -kJ/m²ISO 179/1eA

Table 2 of 6

7 rows
CharacteristicValueUnitMethod
Melting Temperature (10°C/min)325 / *°CISO 11357-1/-3
Glass Transition Temperature (at 10°C/min)125 / *°CISO 11357-1/-2
Temperature of Deflection Under Load (1.80 MPa)305 / *°CISO 75-1/-2
Temperature of Deflection Under Load (0.45 MPa)320 / *°CISO 75-1/-2
Coefficient of Linear Thermal Expansion (parallel)0.3 / *E-4/°CASTM D696
Coefficient of Linear Thermal Expansion (normal)0.4 / *E-4/°CASTM D696
Burning Behaviour (at 3 / * mm Nominal Thickness)UL HB / *classIEC 60695-11-10

Table 3 of 6

8 rows
CharacteristicValueUnitMethod
Relative Permittivity (100Hz)5 / 5—IEC 62631-2-1
Relative Permittivity (1 MHz)4.5 / 4.5—IEC 62631-2-1
Dissipation Factor (100 Hz)120 / 120E-4IEC 62631-2-1
Dissipation Factor (1 MHz)250 / 250E-4IEC 62631-2-1
Volume Resistivity>1E13 / >1E13Ohm*mIEC 62631-3-1
Surface Resistivity- / >1E15OhmIEC 62631-3-2
Electric Strength33 / 33kV/mmIEC 60243-1
Comparative Tracking Index600 / -VIEC 60112

Table 4 of 6

3 rows
CharacteristicValueUnitMethod
Water Absorption4.4 / *%Sim. to ISO 62
Humidity Absorption1.7 / *%Sim. to ISO 62
Density1530 / -kg/m³ISO 1183

Table 5 of 6

3 rows
CharacteristicValueUnitMethod
Molding Shrinkage (parallel)0.35 / *%ISO 294-4
Molding Shrinkage (normal)1 / *%ISO 294-4
Spiral Flow Length 1.0 mm 1000 bar100 / *mm—

Химическая стойкость

384 rows
CharacteristicValueUnit
OtherAcetaldehyde (40% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetamide (50% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetamide (50% by mass) at >140°Cnot resistant
OtherAcetic acid (10% by mass) at 100°Cnot resistant
OtherAcetic acid (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetic acid (95% by mass) at 23°Cnot resistant
OtherAcetic anhydridelimited resistant, tests necessary to verify
KetonesAcetone at 23°Cresistant
OtherAcetonitrileresistant
OtherAcetophenone at 23°Cresistant
OtherAcetyl chloride at 23°Cnot resistant
OtherAcetylene at 23°Cresistant

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