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ForTii® Ace JTX8
ForTii® Ace JTX8 is a breakthrough high-temperature polyamide with halogen-free and halogen-containing flame retardant grades. It is designed for demanding applications in the electronics, lighting, automotive, white goods, industrial, and aerospace industries. ForTii® Ace JTX8 is the only polyamide grade that secures the JEDEC MSL 1 rating at all thicknesses in all product designs. It has the highest glass transition temperature (Tg) available in polyamides (160 °C), satisfying various industry requirements such as chemical resistance and high-temperature thermal aging. It offers extremely robust processing performance and allows 100% regrinding while retaining high mechanical properties. ForTii® Ace JTX8 is processed using injection molding technology and features improved resistance to blistering.
Product families
Applications
Automotive & Transportation — Automotive
- Electrical & Electronic Systems
- Exterior & Body
- Interior
Electrical & Electronics — Devices & Assemblies
- Automotive Electronics
- Industrial Automation
Electrical & Electronics — Parts & Components
- Connectors
Product Families
Plastics — Engineering & Specialty Polymers
- Polyamides
Composite Materials — Polymers & Resins
- Thermoplastic Resins
Other characteristics
- Brand
- ForTii®
- Polymer Name
- Polyphthalamide (PPA)
- Fillers Included
- Glass Fiber
- Processing Methods
- Injection Molding, Injection Molding
- Reinforcement Material
- Glass Fibers
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Flame Rating
- UL 94 HB
- Technology
- Composite Materials
- Plastics
- Packaging Type
- Bags
- Boxes
- Silos
- Super Sacks
- Quality Standards
- UL Yellow Card (E47960)
- Material Features
- Chemical Resistant
- Electro-Friendly
- Good Color Stability
- Good Strength
- High Durability
- High Stiffness
- Light Weight
- Low Blistering
- Reinforcement Form
- Tape
- Unidirectional Fabric
- Certifications and Compliance
- ISO 14001
- OHSAS
- REACH (Europe)
- UL 94
- Composite Materials Functions
- Resins Binders & Matrix Materials
- Composites Processing Methods
- Injection Molding
- Plastics and Elastomers End Uses
- Connectors
- Door Panel
- Flooring
- Robotics
- Wheel Housing Parts
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 6
48 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus | 11000 / 11000 | MPa | ISO 527-1/-2 |
| Tensile Modulus (-40°C) | 11700 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (40°C) | 10500 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (80°C) | 10300 / 9500 | MPa | ISO 527-1/-2 |
| Tensile Modulus (100°C) | 10200 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (120°C) | 9500 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (160°C) | 6000 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (200°C) | 4000 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness, 1mm) - Dry | 11000 | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness) - cond. | 10500 | MPa | ISO 527-1/-2 |
| Stress at Break | 210 / 190 | MPa | ISO 527-1/-2 |
| Stress at Break (-40°C) | 240 / - | MPa | ISO 527-1/-2 |
Table 2 of 6
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (10°C/min) | 340 / * | °C | ISO 11357-1/-3 |
| Glass Transition Temperature (at 10°C/min) | 150 / * | °C | ISO 11357-1/-2 |
| Glass Transition Temperature from DMTA (tan d) | 160 / * | °C | ASTM D5026/D7028 |
| Temperature of Deflection Under Load (1.80 MPa) | 320 / * | °C | ISO 75-1/-2 |
| Temperature of Deflection Under Load (0.45 MPa) | 335 / * | °C | ISO 75-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.18 / * | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (normal) | 0.6 / * | E-4/°C | ISO 11359-1/-2 |
| Burning Behaviour (at 3 / * mm Nominal Thickness) | UL HB / * | class | IEC 60695-11-10 |
| Thermal Index (2500 hrs) | 188 / * | °C | IEC 60216/ISO 527-1/-2 |
| Thermal Index (5000 hrs) | 174 / * | °C | IEC 60216/ISO 527-1/-2 |
| Thermal Index (10000 hrs) | 161 / * | °C | IEC 60216/ISO 527-1/-2 |
| Thermal Index (20000 hrs) | 149 / * | °C | IEC 60216/ISO 527-1/-2 |
Table 3 of 6
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Relative Permittivity (1GHz) | 3.92 / 3.88 | — | IEC 60250 |
| Relative Permittivity (5GHz) | 3.85 / - | — | IEC 60250 |
| Relative Permittivity (10GHz) | 3.83 / - | — | IEC 60250 |
| Dissipation Factor (1GHz) | 170 / 170 | E-4 | IEC 60250 |
| Dissipation Factor (5GHz) | 140 / - | E-4 | IEC 60250 |
| Dissipation Factor (10GHz) | 120 / - | E-4 | IEC 60250 |
| Volume Resistivity | >1E13 / >1E13 | Ohm*m | IEC 62631-3-1 |
| Surface Resistivity | - / >1E15 | Ohm | IEC 62631-3-2 |
| Electric Strength | 45 / 40 | kV/mm | IEC 60243-1 |
| Comparative Tracking Index | 600 / - | V | IEC 60112 |
Table 4 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Water Absorption | 4.8 / * | % | Sim. to ISO 62 |
| Water Absorption in Water (at 23°C after 24h) | 0.2 / * | % | ISO 62 |
| Humidity Absorption | 2 / * | % | Sim. to ISO 62 |
| Density | 1460 / - | kg/m³ | ISO 1183 |
Table 5 of 6
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Molding Shrinkage (parallel) | 0.43 / * | % | ISO 294-4 |
| Molding Shrinkage (normal) | 1.2 / * | % | ISO 294-4 |
| Spiral Flow Length 1.0 mm 1000 bar | 60 / * | mm | — |
Химическая стойкость
378 rows| Characteristic | Value | Unit |
|---|---|---|
| Other | Acetaldehyde (40% by mass) at 23°C | resistant |
| Other | Acetamide (50% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at >140°C | not resistant |
| Other | Acetic acid (10% by mass) at 100°C | not resistant |
| Other | Acetic acid (10% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetic acid (95% by mass) at 23°C | not resistant |
| Other | Acetic anhydride | limited resistant, tests necessary to verify |
| Ketones | Acetone at 23°C | resistant |
| Other | Acetonitrile | resistant |
| Other | Acetophenone at 23°C | resistant |
| Other | Acetyl chloride at 23°C | not resistant |
| Other | Acetylene at 23°C | resistant |
