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ForTii® LDS51B
ForTii® LDS51B is a breakthrough high-temperature polyamide that offers halogen-free and halogen-containing flame retardant grades, making it suitable for demanding applications in industries such as electronics, lighting, automotive, white goods, industrial, and aerospace. It is a truly reflow-compatible and halogen-free flame retardancy grade. The material exhibits superior plating performance and is compatible with a broad range of laser settings, enabling high-resolution and fine-line capability. The processing technology for this product is injection molding, and it offers the special feature of being phosphorous-free.
Product families
Applications
Automotive & Transportation — Automotive
- Automotive Lighting
Product Families
Plastics — Engineering & Specialty Polymers
- Polyamides
Other characteristics
- Brand
- ForTii®
- Polymer Name
- Polyphthalamide (PPA)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 11300.0 - 11300.0 MPa
- Processing Methods
- Injection Molding
- Markets
- Automotive & Transportation
- Flame Rating
- UL 94 V0
- Technology
- Plastics
- Packaging Type
- Bags
- Boxes
- Silos
- Super Sacks
- Labeling Claims
- Halogen-free
- Phosphorus-free
- Quality Standards
- UL Yellow Card (E47960)
- Material Features
- Heat Resistance
- Certifications and Compliance
- ISO 14001
- OHSAS
- REACH (Europe)
- UL 94
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 6
27 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus | 11500 / 11800 | MPa | ISO 527-1/-2 |
| Tensile Modulus (120°C) | 6000 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (160°C) | 3100 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness, 1mm) - Dry | 11500 | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness) - cond. | 10800 | MPa | ISO 527-1/-2 |
| Stress at Break | 110 / 100 | MPa | ISO 527-1/-2 |
| Stress at Break (120°C) | 57 / - | MPa | ISO 527-1/-2 |
| Stress at Break (160°C) | 37 / * | MPa | ISO 527-1/-2 |
| Stress at Break, at low thickness | 110 / 100 | MPa | ISO 527-1/-2 |
| Stress at Break (Thickness tested) | 1 / - | mm | ISO 527-1/-2 |
| Strain at Break | 1.6 / 1.6 | % | ISO 527-1/-2 |
| Strain at Break (at 120°C) | 3 / - | % | ISO 527-1/-2 |
Table 2 of 6
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (10°C/min) | 325 / * | °C | ISO 11357-1/-3 |
| Glass Transition Temperature (at 10°C/min) | 125 / * | °C | ISO 11357-1/-2 |
| Temperature of Deflection Under Load (1.80 MPa) | 290 / * | °C | ISO 75-1/-2 |
| Temperature of Deflection Under Load (0.45 MPa) | 310 / * | °C | ISO 75-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.3 / * | E-4/°C | ASTM D696 |
| Coefficient of Linear Thermal Expansion (normal) | 0.4 / * | E-4/°C | ASTM D696 |
Table 3 of 6
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Relative Permittivity (1GHz) | 4.13 / 4.23 | — | IEC 60250 |
| Relative Permittivity (5GHz) | 4.06 / 4.12 | — | IEC 60250 |
| Dissipation Factor (1GHz) | 210 / 217 | E-4 | IEC 60250 |
| Dissipation Factor (5GHz) | 165 / 182 | E-4 | IEC 60250 |
| Volume Resistivity | >1E13 / >1E13 | Ohm*m | IEC 62631-3-1 |
| Surface Resistivity | - / >1E15 | Ohm | IEC 62631-3-2 |
| Comparative Tracking Index | 400 / - | V | IEC 60112 |
Table 4 of 6
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Water Absorption | 3.3 / * | % | Sim. to ISO 62 |
| Humidity Absorption | 1.3 / * | % | Sim. to ISO 62 |
| Density | 1580 / - | kg/m³ | ISO 1183 |
Table 5 of 6
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Molding Shrinkage (parallel) | 0.3 / * | % | ISO 294-4 |
| Molding Shrinkage (normal) | 1 / * | % | ISO 294-4 |
Химическая стойкость
384 rows| Characteristic | Value | Unit |
|---|---|---|
| Other | Acetaldehyde (40% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at >140°C | not resistant |
| Other | Acetic acid (10% by mass) at 100°C | not resistant |
| Other | Acetic acid (10% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetic acid (95% by mass) at 23°C | not resistant |
| Other | Acetic anhydride | limited resistant, tests necessary to verify |
| Ketones | Acetone at 23°C | resistant |
| Other | Acetonitrile | resistant |
| Other | Acetophenone at 23°C | resistant |
| Other | Acetyl chloride at 23°C | not resistant |
| Other | Acetylene at 23°C | resistant |
