ForTii® K11
ForTii® K11 is a breakthrough high-temperature polyamide that offers halogen-free and halogen-containing flame retardant grades, making it suitable for demanding applications in industries such as electronics, lighting, automotive, white goods, industrial, and aerospace. It combines excellent mechanical properties with low warpage, making it ideal for miniature applications such as audio jacks and camera holders. The processing technology for this product is injection molding, and it offers the special features of being 30% glass-reinforced and electro-friendly.
Product families
Applications
- Electrical & Electronic Systems
- Automotive Electronics
- Industrial Automation
- Connectors
- Sensors & Actuators
Product Families
- Polyamides
Other characteristics
- Brand
- ForTii®
- Polymer Name
- Polyphthalamide (PPA)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 10500.0 - 10500.0 MPa
- Processing Methods
- Injection Molding
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Flame Rating
- UL 94 HB
- Technology
- Plastics
- Packaging Type
- Bags
- Boxes
- Silos
- Super Sacks
- Quality Standards
- UL Yellow Card (E47960)
- Material Features
- Electro-Friendly
- Good Flow
- Good Strength
- Heat Resistance
- High Durability
- High Flow
- UL Flame Rated
- Certifications and Compliance
- ISO 14001
- OHSAS
- REACH (Europe)
- UL 94
- Speed Sensor Application Data
Stanyl® PA46, ForTii® PA4T, Akulon® PA66, Akulon® PA6, Arnite® PBT allow for reliable solutions due to high temperature resistance, high toughness levels and good electrical insulation properties; Stanyl® PA46 allows for cost effective solutions due to a better flowability and processability than PPS and PPA enabling therefore thin wall designs; ForTii® PA4T allows for reliable solutions exposed to very high peak temperatures due to its melting point of 325 C
- Plastics and Elastomers End Uses
- Connectors
- Position Sensor
- Robotics
- Speed Sensor
- Temperature Sensor
- Plastics and Elastomers Functions
- Resin
- Positition Sensor Application Data
Stanyl® PA46, ForTii® PA4T, Akulon® PA66, Akulon® PA6, Arnite® PBT allow for reliable solutions due to high temperature resistance, high toughness levels and good electrical insulation properties; Stanyl® PA46 allows for cost effective solutions due to a better flowability and processability than PPS and PPA enabling therefore thin wall designs; ForTii® PA4T allows for reliable solutions exposed to very high peak temperatures due to its melting point of 325 C
- Temperature Sensor Application Data
Stanyl® PA46, ForTii® PA4T, Akulon® PA66, Akulon® PA6, Arnite® PBT allow for reliable solutions due to high temperature resistance, high toughness levels and good electrical insulation properties; Stanyl® PA46 allows for cost effective solutions due to a better flowability and processability than PPS and PPA enabling therefore thin wall designs; ForTii® PA4T allows for reliable solutions exposed to very high peak temperatures due to its melting point of 325 C
- Audio Jack Connectors Application Data
Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to its outstanding mechanical strength outperforming competitive materials for jacks by up to four times, therefore enabling 20.000-plus insertion/extraction cycles. Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions to due good processability and high flowability enabling thin walled designs
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 7
34 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus | 11300 / 11500 | MPa | ISO 527-1/-2 |
| Tensile Modulus (120°C) | 8000 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (160°C) | 4500 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (200°C) | 4000 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness, 1mm) - Dry | 10800 | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness) - cond. | 11000 | MPa | ISO 527-1/-2 |
| Stress at Break | 190 / 170 | MPa | ISO 527-1/-2 |
| Stress at Break (120°C) | 125 / - | MPa | ISO 527-1/-2 |
| Stress at Break (160°C) | 85 / * | MPa | ISO 527-1/-2 |
| Stress at Break (200°C) | 70 / * | MPa | ISO 527-1/-2 |
| Stress at Break, at low thickness | 200 / 190 | MPa | ISO 527-1/-2 |
| Stress at Break (Thickness tested) | 1 / - | mm | ISO 527-1/-2 |
Table 2 of 7
11 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (10°C/min) | 325 / * | °C | ISO 11357-1/-3 |
| Glass Transition Temperature (at 10°C/min) | 125 / * | °C | ISO 11357-1/-2 |
| Temperature of Deflection Under Load (1.80 MPa) | 305 / * | °C | ISO 75-1/-2 |
| Temperature of Deflection Under Load (0.45 MPa) | 320 / * | °C | ISO 75-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.3 / * | E-4/°C | ASTM D696 |
| Coefficient of Linear Thermal Expansion (normal) | 0.5 / * | E-4/°C | ASTM D696 |
| Burning Behaviour (at 3 / * mm Nominal Thickness) | UL HB / * | class | IEC 60695-11-10 |
| Thermal Index (2500 hrs) | 185 / * | °C | IEC 60216/ISO 527-1/-2 |
| Thermal Index (5000 hrs) | 174 / * | °C | IEC 60216/ISO 527-1/-2 |
| Thermal Index (10000 hrs) | 162 / * | °C | IEC 60216/ISO 527-1/-2 |
| Thermal Index (20000 hrs) | 150 / * | °C | IEC 60216/ISO 527-1/-2 |
Table 3 of 7
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Relative Permittivity (100Hz) | 5 / 5 | — | IEC 62631-2-1 |
| Relative Permittivity (1 MHz) | 4.5 / 4.5 | — | IEC 62631-2-1 |
| Relative Permittivity (1GHz) | 3.9 / 4 | — | IEC 60250 |
| Relative Permittivity (10GHz) | 3.8 / 3.9 | — | IEC 60250 |
| Dissipation Factor (100 Hz) | 150 / 150 | E-4 | IEC 62631-2-1 |
| Dissipation Factor (1 MHz) | 280 / 280 | E-4 | IEC 62631-2-1 |
| Dissipation Factor (1GHz) | 140 / 150 | E-4 | IEC 60250 |
| Dissipation Factor (10GHz) | 120 / 150 | E-4 | IEC 60250 |
| Volume Resistivity | >1E13 / >1E13 | Ohm*m | IEC 62631-3-1 |
| Surface Resistivity | - / >1E15 | Ohm | IEC 62631-3-2 |
| Electric Strength | 33 / 33 | kV/mm | IEC 60243-1 |
| Comparative Tracking Index | 600 / 600 | V | IEC 60112 |
Table 4 of 7
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Viscosity Number | 98 / * | cm³/g | ISO 307, 1157, 1628 |
Table 5 of 7
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Water Absorption | 5.1 / * | % | Sim. to ISO 62 |
| Humidity Absorption | 2 / * | % | Sim. to ISO 62 |
| Density | 1430 / - | kg/m³ | ISO 1183 |
Table 6 of 7
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Molding Shrinkage (parallel) | 0.4 / * | % | ISO 294-4 |
| Molding Shrinkage (normal) | 1.3 / * | % | ISO 294-4 |
| Spiral Flow Length 1.0 mm 1000 bar | 110 / * | mm | — |
Химическая стойкость
384 rows| Characteristic | Value | Unit |
|---|---|---|
| Other | Acetaldehyde (40% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at >140°C | not resistant |
| Other | Acetic acid (10% by mass) at 100°C | not resistant |
| Other | Acetic acid (10% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetic acid (95% by mass) at 23°C | not resistant |
| Other | Acetic anhydride | limited resistant, tests necessary to verify |
| Ketones | Acetone at 23°C | resistant |
| Other | Acetonitrile | resistant |
| Other | Acetophenone at 23°C | resistant |
| Other | Acetyl chloride at 23°C | not resistant |
| Other | Acetylene at 23°C | resistant |
