ForTii® F11
ForTii® F11 is a breakthrough high-temperature polyamide that offers halogen-free and halogen-containing flame retardant grades, making it suitable for demanding applications in industries such as electronics, lighting, automotive, white goods, industrial, and aerospace. It provides an excellent balance of flow, toughness, and stiffness, enabling the production of thin walls or complex geometries in electronics and electrical applications. The material is VDE (Verband der Elektrotechnik) approved for all colors, has a high RTI electrical rating of 140 °C at 0.75 mm, and a CTI rating of 800 V, ensuring thermal and electrical performance. It is phosphorous-free and VDE-certified. The processing technology for this product is injection molding.
Product families
- Polyamides
Other characteristics
- Brand
- ForTii®
- Polymer Name
- Polyphthalamide (PPA)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 11000.0 - 11000.0 MPa
- Processing Methods
- Injection Molding
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Flame Rating
- UL 94 V0
- Technology
- Plastics
- Packaging Type
- Bags
- Boxes
- Silos
- Super Sacks
- Labeling Claims
- Environmentally Friendly
- Halogen-free
- Phosphorus-free
- Quality Standards
- UL Yellow Card (E172082)
- UL Yellow Card (E47960)
- Material Features
- Electro-Friendly
- Heat Resistance
- Thermal Shock Resistant
- UL Flame Rated
- Certifications and Compliance
- ISO 14001
- OHSAS
- REACH (Europe)
- UL 94
- Contactors Application Data
Akulon® PA6 and ForTii® PA4T allow for reliable solutions due to good electrical and thermal endurance. Akulon® PA6 and ForTii® PA4T allow for more design freedom and/or potential system cost reductions due to part integration and thinner wall design and lower profiles possibilities, reduced cycle time with lower production losses
- Sensor Application Data
ForTii® PA4T and Stanyl® PA46 allow for reliable solutions due to their high melting point of 325 and 295 °C resulting in no deformation at very high sensor tip temperatures and to their resistance to erosion from contamination in the exhaust stream. ForTii® PA4T and Stanyl® PA4 allow for cost effective solutions versus PEEK, LCP or other PPA
- Fuse Holder Application Data
ForTii® allows the Fuse holder to withstand high temperatures and the material has a high impact resistance; Productivity improvement; Laser printing; Snap fitting; DIN rail mounting
- Speed Sensor Application Data
Stanyl® PA46, ForTii® PA4T, Akulon® PA66, Akulon® PA6, Arnite® PBT allow for reliable solutions due to high temperature resistance, high toughness levels and good electrical insulation properties; Stanyl® PA46 allows for cost effective solutions due to a better flowability and processability than PPS and PPA enabling therefore thin wall designs; ForTii® PA4T allows for reliable solutions exposed to very high peak temperatures due to its melting point of 325 C
Technical data
Table 1 of 7
43 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus | 11500 / 12000 | MPa | ISO 527-1/-2 |
| Tensile Modulus (-40°C) | 12000 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (40°C) | 11300 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (80°C) | 10800 / 7600 | MPa | ISO 527-1/-2 |
| Tensile Modulus (100°C) | 10000 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (120°C) | 8000 / - | MPa | ISO 527-1/-2 |
| Tensile Modulus (140°C) | 5700 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (160°C) | 5000 / * | MPa | ISO 527-1/-2 |
| Tensile Modulus (Low Thickness, 1mm) | 10700 / - | MPa | ISO 527-1/-2 |
| Stress at Break | 150 / 140 | MPa | ISO 527-1/-2 |
| Stress at Break (-40°C) | 175 / - | MPa | ISO 527-1/-2 |
| Stress at Break (40°C) | 145 / - | MPa | ISO 527-1/-2 |
Table 2 of 7
28 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (10°C/min) | 325 / * | °C | ISO 11357-1/-3 |
| Glass Transition Temperature (at 10°C/min) | 125 / * | °C | ISO 11357-1/-2 |
| Temperature of Deflection Under Load (1.80 MPa) | 305 / * | °C | ISO 75-1/-2 |
| Temperature of Deflection Under Load (0.45 MPa) | 323 / * | °C | ISO 75-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.2 / * | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (parallel) | 0.3 / * | E-4/°C | ASTM D696 |
| Coefficient of Linear Thermal Expansion (normal) | 0.65 / * | E-4/°C | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (normal) | 0.35 / * | E-4/°C | ASTM D696 |
| Thermal Conductivity in Plane | 0.4 / * | W/(m K) | ASTM E1461 |
| Burning Behaviour (at 1.5 mm Nominal Thickness) | UL V-0 / * | class | IEC 60695-11-10 |
| Burning Behaviour (at 3.0 mm Nominal Thickness) | UL V-0 / * | class | IEC 60695-11-10 |
| Burning Behaviour (at 0.2 mm Thickness h) | UL V-0 / * | class | IEC 60695-11-10 |
Table 3 of 7
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Relative Permittivity (100Hz) | 4.2 / 4.2 | — | IEC 62631-2-1 |
| Relative Permittivity (1 MHz) | 3.9 / 3.9 | — | IEC 62631-2-1 |
| Relative Permittivity (1GHz) | 3.8 / 3.9 | — | IEC 60250 |
| Relative Permittivity (10GHz) | 3.8 / 3.9 | — | IEC 60250 |
| Dissipation Factor (100 Hz) | 64 / 64 | E-4 | IEC 62631-2-1 |
| Dissipation Factor (1 MHz) | 176 / 176 | E-4 | IEC 62631-2-1 |
| Dissipation Factor (1GHz) | 130 / 130 | E-4 | IEC 60250 |
| Dissipation Factor (10GHz) | 110 / 130 | E-4 | IEC 60250 |
| Volume Resistivity | >1E13 / >1E13 | Ohm*m | IEC 62631-3-1 |
| Surface Resistivity | - / >1E15 | Ohm | IEC 62631-3-2 |
| Electric Strength | 33 / 33 | kV/mm | IEC 60243-1 |
| Comparative Tracking Index | 600 / - | V | IEC 60112 |
Table 4 of 7
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Viscosity Number | 86 / * | cm³/g | ISO 307, 1157, 1628 |
Table 5 of 7
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Water Absorption | 4.1 / * | % | Sim. to ISO 62 |
| Water Absorption in Water (at 23°C after 24h) | 0.3 / * | % | ISO 62 |
| Humidity Absorption | 1.6 / * | % | Sim. to ISO 62 |
| Density | 1460 / - | kg/m³ | ISO 1183 |
Table 6 of 7
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Molding Shrinkage (parallel) | 0.35 / * | % | ISO 294-4 |
| Molding Shrinkage (normal) | 1.2 / * | % | ISO 294-4 |
| Spiral Flow Length 1.0 mm 800 bar | 110 / * | mm | — |
| Spiral Flow Length 1.0 mm 900 bar | 120 / * | mm | — |
| Spiral Flow Length 1.0 mm 1000 bar | 130 / * | mm | — |
Химическая стойкость
384 rows| Characteristic | Value | Unit |
|---|---|---|
| Other | Acetaldehyde (40% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetamide (50% by mass) at >140°C | not resistant |
| Other | Acetic acid (10% by mass) at 100°C | not resistant |
| Other | Acetic acid (10% by mass) at 23°C | limited resistant, tests necessary to verify |
| Other | Acetic acid (95% by mass) at 23°C | not resistant |
| Other | Acetic anhydride | limited resistant, tests necessary to verify |
| Ketones | Acetone at 23°C | resistant |
| Other | Acetonitrile | resistant |
| Other | Acetophenone at 23°C | resistant |
| Other | Acetyl chloride at 23°C | not resistant |
| Other | Acetylene at 23°C | resistant |
