To catalogue

EcoPaXX® Q-DWX10

Chemical Family
Polyamides

EcoPaXX® Q-DWX10 is a long aliphatic polyamide with excellent mechanical and flow performance, specifically designed for food contact and drinking water applications. It offers exceptional chemical resistance, low moisture absorption, a very high melting point, and a high crystallization rate. The material can be processed using injection molding technology. It has good surface properties and meets the requirements for drinking water contact quality as well as food contact quality.

Other characteristics

Brand
EcoPaXX
Polymer Name
Polyamide 410 (PA 410)
Fillers Included
Glass Fiber
Processing Methods
Injection Molding, Injection Molding
Reinforcement Material
Glass Fibers
Markets
  • Automotive & Transportation
  • Building & Construction
  • Consumer Goods
  • Electrical & Electronics
  • Industrial
Flame Rating
UL 94 HB
Technology
  • Composite Materials
  • Plastics
Packaging Type
  • Bags
  • Boxes
  • Silos
  • Super Sacks
Labeling Claims
  • Bio-based
  • Food Contact Acceptable
  • Lead-free
  • Sustainable
Quality Standards
UL Yellow Card (E47960)

Technical data

Table 1 of 6

18 rows
CharacteristicValueUnitMethod
Tensile Modulus16500 / 16000MPaISO 527-1/-2
Tensile Modulus (120°C)4900 / -MPaISO 527-1/-2
Tensile Modulus (140°C)4500 / *MPaISO 527-1/-2
Tensile Modulus (160°C)4000 / *MPaISO 527-1/-2
Stress at Break240 / 210MPaISO 527-1/-2
Stress at Break (120°C)75 / -MPaISO 527-1/-2
Stress at Break (140°C)60 / *MPaISO 527-1/-2
Stress at Break (160°C)50 / *MPaISO 527-1/-2
Strain at Break3 / 3.3%ISO 527-1/-2
Strain at Break (at 120°C)12 / -%ISO 527-1/-2
Strain at Break (at 140°C)11 / *%ISO 527-1/-2
Strain at Break (at 160°C)10 / *%ISO 527-1/-2

Table 2 of 6

8 rows
CharacteristicValueUnitMethod
Melting Temperature (10°C/min)250 / *°CISO 11357-1/-3
Glass Transition Temperature (at 10°C/min)88 / *°CISO 11357-1/-2
Temperature of Deflection Under Load (1.80 MPa)200 / *°CISO 75-1/-2
Temperature of Deflection Under Load (0.45 MPa)235 / *°CISO 75-1/-2
Coefficient of Linear Thermal Expansion (parallel)0.2 / *E-4/°CISO 11359-1/-2
Coefficient of Linear Thermal Expansion (normal)1 / *E-4/°CISO 11359-1/-2
Burning Behaviour (at 1.5 mm Nominal Thickness)UL HB / *classIEC 60695-11-10
Burning Behaviour (at 3.0 mm Nominal Thickness)UL HB / *classIEC 60695-11-10

Table 3 of 6

1 row
CharacteristicValueUnitMethod
Electric Strength27 / -kV/mmIEC 60243-1

Table 4 of 6

3 rows
CharacteristicValueUnitMethod
Water Absorption3 / *%Sim. to ISO 62
Humidity Absorption1.2 / *%Sim. to ISO 62
Density1560 / -kg/m³ISO 1183

Table 5 of 6

4 rows
CharacteristicValueUnitMethod
Molding Shrinkage (parallel)0.15 / *%ISO 294-4
Molding Shrinkage (normal)0.5 / *%ISO 294-4
Spiral Flow Length 1.0 mm 800 bar75 / *mm—
Spiral Flow Length 1.0 mm 1000 bar90 / *mm—

Химическая стойкость

377 rows
CharacteristicValueUnit
OtherAcetaldehyde (40% by mass) at 23°Cresistant
OtherAcetamide (50% by mass) at 23°Climited resistant, tests necessary to verify
OtherAcetamide (50% by mass) at >140°Cnot resistant
OtherAcetic acid (10% by mass) at 100°Climited resistant, tests necessary to verify
OtherAcetic acid (10% by mass) at 23°Cresistant
OtherAcetic acid (95% by mass) at 23°Climited resistant, tests necessary to verify
KetonesAcetone at 23°Cresistant
OtherAcetophenone at 23°Cresistant
OtherAcetyl chloride at 23°Climited resistant, tests necessary to verify
OtherAcetylene at 23°Cresistant
OtherAcrylic acid at 23°Climited resistant, tests necessary to verify
OtherAliphatic amines at 23°Cresistant

The Omnichem website uses cookies. By continuing to use the site, you consent to their use in accordance with our Privacy Policy and to the collection of analytics.