OPTODYNE UV-3100
- Chemical Family
- Fluoropolymers
OPTODYNE UV-3100, classified as a radiation-curable adhesive, is specifically formulated for optical applications. Employing the radiation cure method, this product ensures effective bonding with features such as good adhesion and excellent processability. In its fluid and light yellow transparent liquid appearance, OPTODYNE UV-3100 stands as a versatile and reliable solution for optical bonding needs, providing both strong adhesion and ease of processing.
Properties
- Physical Form
- Fluid
- Liquid
Product families
- Other Adhesives & Sealants
Other characteristics
- Brand
- OPTODYNE
- Cure Method
- Radiation Cure
- Product Type
- Adhesive, Radiation Curable Adhesive
- Adhesive
- Radiation Curable Adhesive
- Application Area
- Optical Applications
- Note
Curing conditions: 5 J/cm2 or 10 J/cm2 UV light was irradiated with a high pressure mercury lamp Fracture mode with bonding strength change is due to glass breakage; * The above values are representative and not guaranteed.; * Optodyne UV-1100, UV-2100, UV-3100 contains about 2% antimony compound.
- Appearance
- Light yellow transparent
- Cure
- Radiation Cure
- Technology
- Ready-to-Use Products
- Packaging Type
- Tubes
- HIGHLIGHTS
Transparent ultraviolet (UV) curing type optical adhesive based on fluorinated epoxy and fluorinated acrylate resin.; It is used to connect optical fibers requiring optically optimal refractive index matching as well as adhesion fixing function.; Highly reliable adhesive with excellent adhesion and workability.
- Packing Specification
- 5g (tube)
- 50g (tube)
- Ready to Use Product Features
- Good Adhesion
- Good Processability
- Safety Information
Be sure to read the notes on SDS and labels before use.. This product is intended for general industry use and therefore its adequacy and safety as a raw material for medical purposes cannot be guaranteed.
Technical data
Table 1 of 1
28 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Bonding Strength Change (Heat cycle resistance, Pyrex glass, -40~85℃, 90% RH, 6 hour/1cycle, after 100 cycles) | 9.1 | Mpa | — |
| Bonding Strength Change (Heat cycle resistance, Pyrex glass, -40~85℃, 90% RH, 6 hour/1cycle, Initial) | 12.3 | Mpa | — |
| Bonding Strength Change (Heat cycle resistance, Pyrex glass, -40~85℃,90% RH,6 hour/1cycle, after 300 cycles) | 8.7 | Mpa | — |
| Bonding Strength Change (Heat cycle resistance, Pyrex glass, -40~85℃,90% RH,6 hour/1cycle, after 500 cycles) | 10.4 | Mpa | — |
| Bonding Strength Change (Moisture resistance, Pyrex glass, 85℃/ 85 RH, after 2 weeks) | 12 | Mpa | — |
| Bonding Strength Change (Moisture resistance, Pyrex glass, 85℃/85 RH, after 4 weeks) | 13.7 | Mpa | — |
| Bonding Strength Change (Moisture resistance, Pyrex glass, 85℃/85 RH, after 6 weeks) | 11.1 | Mpa | — |
| Bonding Strength Change (Moisture resistance, Pyrex glass, 85℃/85 RH, Initial) | 12.3 | Mpa | — |
| Coefficient of Thermal Expansion (Post Curing) | 9.0×10⁻⁵ | ℃⁻¹ | — |
| Curing Contraction Rate (Post Curing) | approx. 3 - 4 | % | — |
| Flash Point (Before Curing) | 127 | ℃ | — |
| Glass Transition Temperature (Post Curing) | 130 | ℃ | — |
