OPTODYNE UV-2100
- Chemical Family
- Fluoropolymers
OPTODYNE UV-2100, categorized as a radiation-curable adhesive, is designed for optical applications. Utilizing the radiation cure method, this product excels with its good adhesion and excellent processability. In its fluid form, OPTODYNE UV-2100 presents a light yellow transparent appearance, offering a reliable and versatile solution for optical bonding needs, ensuring effective adhesion and easy processing.
Properties
- Physical Form
- Fluid
- Liquid
Product families
- Other Adhesives & Sealants
Other characteristics
- Brand
- OPTODYNE
- Cure Method
- Radiation Cure
- Product Type
- Adhesive, Radiation Curable Adhesive
- Adhesive
- Radiation Curable Adhesive
- Application Area
- Optical Applications
- Note
Curing conditions: 5 J/cm2 or 10 J/cm2 UV light was irradiated with a high pressure mercury lamp Fracture mode with bonding strength change is due to glass breakage; * The above values are representative and not guaranteed.; * Optodyne UV-1100, UV-2100, UV-3100 contains about 2% antimony compound.
- Appearance
- Light yellow transparent
- Cure
- Radiation Cure
- Technology
- Ready-to-Use Products
- Packaging Type
- Tubes
- HIGHLIGHTS
Transparent ultraviolet (UV) curing type optical adhesive based on fluorinated epoxy and fluorinated acrylate resin.; It is used to connect optical fibers requiring optically optimal refractive index matching as well as adhesion fixing function.; Highly reliable adhesive with excellent adhesion and workability.
- Packing Specification
- 5g (tube)
- 50g (tube)
- Ready to Use Product Features
- Good Adhesion
- Good Processability
- Safety Information
Be sure to read the notes on SDS and labels before use.. This product is intended for general industry use and therefore its adequacy and safety as a raw material for medical purposes cannot be guaranteed.
Technical data
Table 1 of 1
28 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Bonding Strength Change (Heat cycle resistance, Pyrex glass, -40~85℃, 90% RH, 6 hour/1cycle, after 100 cycles) | 12.6 | Mpa | — |
| Bonding Strength Change (Heat cycle resistance, Pyrex glass, -40~85℃, 90% RH, 6 hour/1cycle, Initial) | 8.6 | Mpa | — |
| Bonding Strength Change (Heat cycle resistance, Pyrex glass, -40~85℃,90% RH,6 hour/1cycle, after 300 cycles) | 7.5 | Mpa | — |
| Bonding Strength Change (Heat cycle resistance, Pyrex glass, -40~85℃,90% RH,6 hour/1cycle, after 500 cycles) | 11.9 | Mpa | — |
| Bonding Strength Change (Moisture resistance, Pyrex glass, 85℃/ 85 RH, after 2 weeks) | 9.3 | Mpa | — |
| Bonding Strength Change (Moisture resistance, Pyrex glass, 85℃/85 RH, after 4 weeks) | 7.2 | Mpa | — |
| Bonding Strength Change (Moisture resistance, Pyrex glass, 85℃/85 RH, after 6 weeks) | 13.6 | Mpa | — |
| Bonding Strength Change (Moisture resistance, Pyrex glass, 85℃/85 RH, Initial) | 8.6 | Mpa | — |
| Coefficient of Thermal Expansion (Post Curing) | 10.7×10⁻⁵ | ℃⁻¹ | — |
| Curing Contraction Rate (Post Curing) | approx. 4 - 5 | % | — |
| Flash Point (Before Curing) | 128 | ℃ | — |
| Glass Transition Temperature (Post Curing) | 129 | ℃ | — |
