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MELOPAS® MP 183

Chemical Family
Phenols & Phenolics

MELOPAS® MP 183 is a Cellulose-reinforced molding compounds based on melamine resin & melamine

Properties

Physical Form
  • Granules
  • Solid

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
Electrical & Electronics — Devices & Assemblies
  • Consumer Electronics
Electrical & Electronics — Parts & Components
  • Other Parts & Components

Product Families

Plastics — Thermoset Resins
  • Other Thermoset Resins

Other characteristics

Brand
MELOPAS
Density
1900.0 - 2100.0 kg/m³
End Uses
Appliances, Electrical Components
Polymer Name
Phenol Modified Melamine
Tensile Strength
50.0 - 80.0 MPa
Processing Methods
Compression Molding, Injection Molding
Markets
  • Consumer Goods
  • Electrical & Electronics
Supply Form
Low dust granulate in moisture resistant bags
Flame Rating
UL 94 V0
Technology
Plastics
Packaging Type
Bags
Fillers Included
Cellulose
Material Features
  • Dimensional Stability
  • Excellent Mechanical Strength
  • Excellent Surface Hardness
  • Good Electrical Properties
  • Good UV Stability
  • Improved Wear
  • Very Good Heat Resistance
Product Characteristic

Cellulose reinforced phenol-modified Melamine molding compound Improved dimensional stability and electrical properties compared to MP 181, excellent surface hardness, good mechanical strength and heat resistance, good wear and UV-stability Molded parts in electrical engineering This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (WEEE) and 2006/122 (PFOS) Identification according to ISO 14529-1MP (LD20 + MD30) - (LD30 + MD20)DIN 7708: MP 183

Certifications and Compliance

PFOS - 2006/122/EC; RoHS Compliant; UL 94; Waste Electrical & Electronic Equipment Directive (WEEE)

Plastics and Elastomers End Uses
  • Appliances
  • Electrical Components
Plastics and Elastomers Functions
Resin
Handling Conditions

Keep cool and dry.Minimum shelf life at 20 ± 5 °C:6 months after date of delivery

Plastics and Elastomers Processing Methods
  • Compression Molding
  • Injection Molding

Technical data

Table 1 of 4

7 rows
CharacteristicValueUnitMethod
Compressive strength200 - 250MPaISO 604
E-Modulus (flexural test)8 - 9GPaISO 178
E-Modulus (tensile test)5 - 8GPaISO 527
Flexural strength90 - 120MPaISO 178
Impact strength (Charpy)7 - 10kJ/m²ISO 179 / 1eU
Impact strength (Charpy), notched1,3 - 2,0kJ/m²ISO 179 / 1eA
Tensile strength50 - 80MPaISO 527

Table 2 of 4

9 rows
CharacteristicValueUnitMethod
FlammabilityV-0 / 1,5Stufe/mmUL 94
Glow wire flammability test / GWFI960 / 1—IEC60695-2-12
Glow wire ignitability test / GWIT900 / 1—IEC60695 2-13
Heat deflection temp. HDT A - 1,80 MPa155 - 180°CISO 75
Heat deflection temp. HDT C - 8,00 MPa110 - 130°CISO 75
Maximum application temperature (<50 h)160°CIEC 60216/T1
Maximum application temperature (20 000 h)135°CIEC 60216/T1
Thermal conductivity0,4 - 0,5W / m * KASTM E 1461
Coeff. of linear thermal expansion (longitudinal,50-100°C)15 - 3510-6 / KISO 11359-2

Table 3 of 4

5 rows
CharacteristicValueUnitMethod
Moulding shrinkage (longitudinal)0,7 - 1,1%ISO 2577
Post shrinkage (168 h / 110 °C)1,0 - 1,5%ISO 2577
Specific gravity1.60 - 1.70g/cm³ISO 1183
Water absorption (24 h / 23 °C)max. 100 / max. 1,7mg / %ISO 62
Apparent Density0.55 - 0.75g/cm³ISO 60

Table 4 of 4

7 rows
CharacteristicValueUnitMethod
Dielectric strength20 - 25kV / mmIEC 60243-1
Surface Resistance10^10 - 10^11OhmsIEC 60093
Dissipation factor (100 Hz/1 MHz)0,3-0,5 / 0,03-0,05—IEC 60250
Relative permittivity (100 Hz/1 MHz)11 - 16 / 7 - 9—IEC 60250
Tracking resistance (CTI)600VIEC 60112
Volume resistivity10^11 - 10^12Ω cmIEC 60093
Arc resistance5StufeASTM D 495

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