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MG Chemicals SilCool TIA241GF – Liquid Silicone Thermal Pad
- Chemical Family
- Silicon-based Compounds
SilCool TIA241GF – Liquid Silicone Thermal Pad TIA241GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling. This thermal gap filler can be used as a liquid alternative for prefabricated solid thermal pads. If lower viscosity is required, use TIA225GF
Properties
- Physical Form
- Paste
Product families
Applications
Applications
- Consumer Goods — Appliances & Electronics
Electrical & Electronics — Packaging & Assembly
- Adhesives & Sealants
Product Families
Ready-to-Use Products — Adhesives & Sealants
- Conductive Adhesives
Other characteristics
- Product Type
2K (2 component) Adhesive, Thermally Conductive Sealant; 2K (2 component) Adhesive; Thermally Conductive Sealant
- Markets
- Consumer Goods
- Electrical & Electronics
- Technology
- Ready-to-Use Products
- Packaging Type
- Cartridges
- Pails
- Quality Standards
- IPC-CC-830B
- Certifications and Compliance
- California Proposition 65
- ISO 9001
- REACH (Europe)
- RoHS Compliant
- UL 94
- Ready to Use Product Features
- Conductive
- Fast Drying
- Flame Retardant
- Good Gap Filling Capabilities
- Good Sagging Resistance
- Good Smoothness
- Low Temperature Curing
- Thermally Conductive
