MG Chemicals 832HD - Black 1:1 Epoxy
- Chemical Family
- Epoxy & Epoxy Derivatives
Black 1:1 Epoxy, Encapsulating & Potting Compound 832HD is a black, rigid, 2-part epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, 832HD can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
Product Families
- Encapsulants
Other characteristics
- Product Type
2K (2 component) Sealant, Epoxy Sealant, Potting Compound; 2K (2 component) Sealant; Epoxy Sealant; Potting Compound
- Compatible Substrates & Surfaces
- Ceramic, Composites, Glass, Metal, Plastics
- Markets
- Electrical & Electronics
- Shelf LIfe
- 5 Years
- Technology
- Ready-to-Use Products
- Packaging Type
- Cans
- Cartridges
- Pails
- Cure
Allow to cure at room temperature for 24 hours, or cure in an oven at one of these time/temperature options:
- Benefits and Features
Low mixed viscosity of 4 100 cP; Extremely high compressive and tensile strength; Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics; Excellent electrical insulating characteristics; Extreme resistance to water and humidity; Solvent-free
- Chemical Inventories
- AICS (Australia)
- DSL (Canada)
- EINECS (EU)
- IECSC (China)
- KECI (Korea)
- NCI (Vietnam)
- NZIoC (New Zealand)
- PICCS (Phillipines)
- Dispensing Accessories
Consult the table below for accessory selection. See the Dispensing Accessories Application Guide for usage instructions.
- Ready to Use Product Features
- Abrasion Resistant
- Anti-Static
- Chemical Resistant
- Excellent Humidity Resistance
- Excellent Salt Spray Resistance
- Fungus Resistant
- Low Viscosity
- Thermal Shock Resistant
- Compatible Substrates and Surfaces
- Ceramic
- Composites
- Glass
- Metal
- Plastics
Technical data
Table 1 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio | 1:1 | Volume |
| Mix Ratio | 1.22:1 | Weight |
| Working Time | 45 | minute |
Table 2 of 3
16 rows| Characteristic | Value | Unit |
|---|---|---|
| Breakdown Voltage | 41700 | V |
| Compressive Strength | 75 | N/mm2 |
| CTE (After Tg) | 207 | ppm/˚C |
| CTE (Prior Tg) | 73 | ppm/˚C |
| Dielectric Constant (at 1 MHz) | 2.5 | — |
| Dielectric Strength | 400 | V/mil |
| Dissipation Factor (at 1 MHz) | 0.04 | — |
| Glass Transition Temperature (Tg) | 41 | °C |
| Hardness D | 80 | — |
| Intermittent Temperature | -50 to 175 | ˚C |
| Lap Shear (Aluminum) | 14 | N/mm2 |
| Lap Shear (Stainless Steel) | 21 | N/mm2 |
Table 3 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Mixed Density | 1.04 | g/mL |
| Viscosity (at 25 ˚C) ⁽ᵃ⁾ | 5.9 | Pa·s |
| Viscosity (at 25 ˚C) ⁽ᵇ⁾ | 2.3 | Pa·s |
