MG Chemicals 8331 - Silver Conductive Epoxy Adhesive
8331 is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8331 has been formulated to be economical. For a higher fill that maximizes conductivity, use 8330. For a longer working time, use 8331S.
Properties
- Physical Form
- Paste
Identification
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Adhesives & Sealants
- Printed Circuit Boards (PCBs)
Product Families
- Conductive Adhesives
Other characteristics
- Cure Method
- Air Dry, Heat Cure
- Product Type
2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive
- Application Area
- Printed Electronics
- Application Method
- Injection
- Compatible Substrates & Surfaces
- Glass, Metal, Plastics
- Markets
- Consumer Goods
- Electrical & Electronics
- Shelf LIfe
- 3 Years
- Cure
Air Dry; Heat Cure; The product will not cure at room temperature. Cure the adhesive in an oven at one of these time/temperature options:; 15 min at 65 ˚C; 7 min at 125 ˚C
- Technology
- Ready-to-Use Products
- Key Attributes
- Creates strong permanent electrical connections
- Cures at room temperature
- Excellent adhesion to many substrates
- Room temperature storage
- Long shelf life
- Packaging Type
- Cans
- Jars
- Application Methods
- Injection
- Chemical Inventories
- DSL (Canada)
- TSCA (USA)
- Certifications and Compliance
ISO 9001; RoHS Compliant; Waste Electrical & Electronic Equipment Directive (WEEE)
- Ready to Use Product Features
- Bondability
- Electrically Conductive
- Electromagnetic Shielding (EMI)
- Excellent Humidity Resistance
- Excellent Substrate Adhesion
- Good Sagging Resistance
- Good Smoothness
- Good Solvent Resistance
- Compatible Substrates and Surfaces
- Glass
- Metal
- Plastics
Technical data
Table 1 of 4
1 row| Characteristic | Value | Unit |
|---|---|---|
| Thermal Conductivity (at 25 ˚C) | 1.4 | W/(m·K) |
Table 2 of 4
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio | 1:1 | Volume |
| Mix Ratio | 1.2:1 | Weight |
| Service Cure | 5 | Hours |
| Viscosity (at 25 ˚C)ᴮ | 15000 | Pa·s |
| Viscosity (at 25 ˚C)ᴬ | 1000 | Pa·s |
| Working Time | 10 | Minutes |
Table 3 of 4
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Compressive Strength | 39 | N/mm2 |
| CTE After Tg | 169 | ppm/˚C |
| CTE Prior Tg | 54 | ppm/˚C |
| Glass Transition Temperature (Tg) | 50 | ˚C |
| Hardness Shore D | 73 | — |
| Lap Shear (Aluminum) | 5.5 | N/mm2 |
| Lap Shear (Stainless steel) | 3.8 | N/mm2 |
| Outgassing (at 125 ˚C for 24 h) | 6.3 | % |
| Resistivity | 1.0 x 10⁻³ | Ω·cm |
| Service Temperature Range | -55 to 150 | ˚C |
| Tensile Strength | 13 | N/mm2 |
| Water Absorption | 0.04 | % |
Table 4 of 4
1 row| Characteristic | Value | Unit |
|---|---|---|
| Mixed Density | 2.29 | g/mL |
