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MG Chemicals 8330S - Electrically Conductive Adhesive
8330S Silver Conductive Epoxy Adhesive: Slow Cure / Extreme Conductivity
Properties
- Physical Form
- Paste
Identification
Product families
Applications
Applications
- Consumer Goods — Appliances & Electronics
Electrical & Electronics — Packaging & Assembly
- Adhesives & Sealants
Electrical & Electronics — Parts & Components
- Printed Circuit Boards (PCBs)
Product Families
Ready-to-Use Products — Adhesives & Sealants
- Conductive Adhesives
Other characteristics
- Cure Method
- Air Dry, Heat Cure
- Product Type
- 2K (2 component) Adhesive, Conductive Adhesive
- 2K (2 component) Adhesive
- Conductive Adhesive
- Application Area
- Printed Electronics
- Application Method
- Injection
- Compatible Substrates & Surfaces
- Glass, Metal, Plastics
- Markets
- Consumer Goods
- Electrical & Electronics
- Shelf LIfe
- 3 Years
- Cure
Air Dry; Heat Cure; The product will not cure at room temperature. Cure the adhesive in an oven at one of these time/temperature options:; 2 h at 65 ˚C; 1 h at 80 ˚C; 30 min at 100 ˚C
- Technology
- Ready-to-Use Products
- Key Attributes
- Creates strong permanent electrical connections
- Extended working time
- Low cure temperature of 65 °C
- Room temperature storage
- Long shelf life
- NASA low outgassing approved
- Packaging Type
- Cans
- Jars
- Labeling Claims
- SVHC Chemicals-free
- Application Methods
- Injection
- Chemical Inventories
- DSL (Canada)
- TSCA (USA)
- Storage and Handling
Store between 16 and 27 ˚C in a dry area, away from sunlight (see SDS). To maximize shelf life, recap product firmly when not in use.
- Certifications and Compliance
ISO 9001; RoHS Compliant; SVHC Compliant; Waste Electrical & Electronic Equipment Directive (WEEE)
- Ready to Use Product Features
- Bondability
- Electrically Conductive
- Electromagnetic Shielding (EMI)
- Excellent Humidity Resistance
- Excellent Substrate Adhesion
- Good Sagging Resistance
- Good Smoothness
- Good Solvent Resistance
- Compatible Substrates and Surfaces
- Glass
- Metal
- Plastics
Technical data
Table 1 of 4
1 row| Characteristic | Value | Unit |
|---|---|---|
| Thermal Conductivity (at 25 ˚C) | 2.4 | W/(m·K) |
Table 2 of 4
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio | 1:1 | Volume |
| Mix Ratio | 1.1:1 | Weight |
| Viscosity (at 25 ˚C)ᴬ | 8600 | Pa·s |
| Viscosity (at 25 ˚C)ᴮ | 3 000 | Pa·s |
| Working Time | 4 | Hours |
Table 3 of 4
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Compressive Strength | 36 | N/mm2 |
| CTE After Tg | 208 | ppm/˚C |
| CTE Prior Tg | 97 | ppm/˚C |
| Glass Transition Temperature (Tg) | 34 | ˚C |
| Hardness Shore D | 73 | — |
| Lap Shear (Aluminum) | 1.2 | N/mm2 |
| Lap Shear (Stainless steel) | 1.7 | N/mm2 |
| Outgassing (at 125 ˚C for 24 h) | 0.4 | % |
| Resistivity | 5.3 x 10⁻⁴ | Ω·cm |
| Service Temperature Range | -40 to 150 | ˚C |
| Tensile Strength | 9 | N/mm2 |
| Water Absorption | 0.3 | % |
Table 4 of 4
1 row| Characteristic | Value | Unit |
|---|---|---|
| Mixed Density | 3.06 | g/mL |
