MG Chemicals 8331D - Silver Conductive Epoxy Adhesive
8331D is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8331D has been formulated to be economical. For a higher fill that maximizes conductivity, use 8330D. For a longer working time, time, use 8331S.
Properties
- Physical Form
- Paste
Identification
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Adhesives & Sealants
- Printed Circuit Boards (PCBs)
Product Families
- Conductive Adhesives
Other characteristics
- Cure Method
- Air Dry, Heat Cure
- Product Type
2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive
- Application Area
- Printed Electronics
- Application Method
- Injection
- Compatible Substrates & Surfaces
- Glass, Metal, Plastics
- Markets
- Consumer Goods
- Electrical & Electronics
- Shelf LIfe
- 3 Years
- Cure
Air Dry; Heat Cure; The product will not cure at room temperature. Cure the adhesive in an oven at one of these time/temperature options:; 10 min at 65 ˚C; 5 min at 80 ˚C
- Technology
- Ready-to-Use Products
- Key Attributes
- Creates strong permanent electrical connections
- Cures at room temperature
- SVHC free
- Excellent adhesion to many substrates
- Room temperature storage
- Long shelf life
- Packaging Type
- Jars
- Labeling Claims
- SVHC Chemicals-free
- Application Methods
- Injection
- Chemical Inventories
- DSL (Canada)
- TSCA (USA)
- Certifications and Compliance
ISO 9001; RoHS Compliant; SVHC Compliant; Waste Electrical & Electronic Equipment Directive (WEEE)
- Ready to Use Product Features
- Bondability
- Cost Effective
- Electrically Conductive
- Electromagnetic Shielding (EMI)
- Excellent Humidity Resistance
- Excellent Substrate Adhesion
- Fast Cure
- Good Sagging Resistance
- Compatible Substrates and Surfaces
- Glass
- Metal
- Plastics
Technical data
Table 1 of 4
1 row| Characteristic | Value | Unit |
|---|---|---|
| Thermal Conductivity (at 25 ˚C) | 1.5 | W/(m·K) |
Table 2 of 4
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio | 1:1 | Volume |
| Mix Ratio | 1.1:1 | Weight |
| Service Cure | 65 | Minutes |
| Viscosity (at 25 ˚C) | 130 | Pa·s |
| Working Time | 20 | Minutes |
Table 3 of 4
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Compressive Strength | 69 | N/mm2 |
| CTE After Tg | 234 | ppm/˚C |
| CTE Prior Tg | 58 | ppm/˚C |
| Glass Transition Temperature (Tg) | 35 | ˚C |
| Hardness Shore D | 78 | — |
| Lap Shear (Aluminum) | 5.1 | N/mm2 |
| Lap Shear (Stainless steel) | 5.6 | N/mm2 |
| Resistivity | 1.0 x 10⁻³ | Ω·cm |
| Service Temperature Range | -50 to 150 | ˚C |
| Tensile Strength | 13 | N/mm2 |
Table 4 of 4
1 row| Characteristic | Value | Unit |
|---|---|---|
| Mixed Density | 2.4 | g/mL |
