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MG Chemicals 8329TFM - Thermal Adhesive, Flowable

8329TFM is a thermally conductive two-part epoxy adhesive. It is dark gray, smooth, thixotropic, and bonds well to a wide variety of substrates. This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems. For a faster working life, use 8329TFF. For a longer working life, use 8329TFS.

Properties

Physical Form
Paste

Product families

Ready-to-Use Products — Adhesives & Sealants
  • Conductive Adhesives

Other characteristics

Cure Method
Air Dry, Heat Cure
Product Type
  • 2K (2 component) Adhesive, Conductive Adhesive
  • 2K (2 component) Adhesive
  • Conductive Adhesive
Application Area

Heat Sink, Office Automation Equipments, Printed Electronics, Semiconductors; Heat Sink; Office Automation Equipments; Printed Electronics; Semiconductors

Application Method
Injection
Compatible Substrates & Surfaces
Metal, Plastics
Color
Grey
Markets
  • Consumer Goods
  • Electrical & Electronics
  • Industrial
Storage

Store between 22 to 27 °C [72 to 81 °F] in a dry area, away from sunlight. Some of the components are sensitive to air, always recap firmly when not in use to maximize shelf life.

Shelf LIfe
3 Years
Cure
  • Air Dry
  • Heat Cure
Technology
Ready-to-Use Products
Reference fit

a) To allow comparison between products, the dielectric strength was recalculated with the Tautscher equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8" (3.175 mm).. b) Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10-6 = unit/unit/°C × 10-6

Key Attributes

Thermal conductivity: 1.1 W/(m·K); 1:1 mix ratio; Working life: 45 minutes; Cure time: 24 hours at room temperature or 2 hours at 65 °C (149 °F); Provides strong electrical insulation; High tensile strength; Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons; RoHS 3 compliant

Packaging Type
Cartridges

Technical data

Table 1 of 6

10 rows
CharacteristicValueUnitMethod
ColorBlack——
Density (at 26 °C, 79 °F)2.18g/mLASTM D 1475
Lap Shear Strength (Stainless Steel)9.0 (1 300)N/mm2 (lb/in2)ASTM D 1002
Lap Shear Strength (Aluminum)6.6 (950)N/mm2 (lb/in2)ASTM D 1002
Lap Shear Strength (Copper)8.0 (1200)N/mm2 (lb/in2)ASTM D 1002
Lap Shear Strength (Brass)7.8 (1 100)N/mm2 (lb/in2)ASTM D 1002
Lap Shear Strength (Polycarbonate)0.8 (110)N/mm2 (lb/in2)ASTM D 1002
Lap Shear Strength (ABS)2.1 (300)N/mm2 (lb/in2)ASTM D 1002
ViscosityThixotropic——
Density2.19g/mL—

Table 2 of 6

5 rows
CharacteristicValueUnitMethod
Thermal Conductivity (at 25 °C, 77 °F)1.1W/(m·K)ASTM E 1461 92
Thermal Conductivity (at 50 °C, 222 °F)1.1W/(m·K)ASTM E 1461 92
Thermal Conductivity (at 100 °C, 212 °F)1W/(m·K)ASTM E 1461 92
Thermal Diffusivity (at 25 °C, 77 °F)0.5mm2/sASTM E 1461 92
Specific heat capacity @25 °C [77 °F]1.1J/(g·K)ASTM E 1461 92

Table 3 of 6

2 rows
CharacteristicValueUnit
Mix Ratio1:1Volume
Mix Ratio1:0.96Weight

Table 4 of 6

4 rows
CharacteristicValueUnitMethod
Breakdown Voltage (at 3.175 mm, 1/8")19500 (19.5)V (kV)Reference fit
Dielectric strength (at 3.175 mm, 1/8")160 (6.1)kv/mm (v/mil)Reference fit
Volume Resistivity8.9 x 10¹²Ω·cmASTM D 257
Volume Conductivity1.1 x 10⁻¹³S/cmASTM D 257

Table 5 of 6

8 rows
CharacteristicValueUnitMethod
Hardness Shore D72—Shore D Durometer
Tensile Strength4.5 (650)N/mm2 (lb/in2)ASTM D 638
Compressive Strength44 (6400)N/mm2ASTM D 695
Breakdown Voltage16500 (16.5)V (kV)ASTM D 149
Dielectric Strength180 (7.3)kv/mm (v/mil)ASTM D 149
Glass Transition Temperature (Tg)39 (103)°C (°F)ASTM E 3418
CTE Prior Tg67 (153)ppm/˚C (ppm/°F)ASTM E 831
CTE After Tg125 (257)ppm/˚C (ppm/°F)ASTM E 831

Table 6 of 6

1 row
CharacteristicValueUnit
Solids Content100%

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