MG Chemicals 832FX - Black Flexible Epoxy
- Chemical Family
- Epoxy & Epoxy Derivatives
Black Flexible Epoxy, Encapsulating & Potting Compound 832FX is a black, 2-part, flexible epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where minimizing the physical stress on components is critical. It performs well in low temperature and arctic environments, as well as applications that involve temperature cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and cost-effectiveness of epoxy.
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
Product Families
- Encapsulants
Other characteristics
- Product Type
2K (2 component) Sealant, Epoxy Sealant, Potting Compound; 2K (2 component) Sealant; Epoxy Sealant; Potting Compound
- Compatible Substrates & Surfaces
- Ceramic, Composites, Glass, Metal, Plastics
- Mixing
Mixing >500 g at a time decreases working life and can lead to a flash cure. Limit the size of hand-mixed batches. For large production volumes, contact MG Chemicals Technical Support for assistance.
- Markets
- Electrical & Electronics
- Shelf LIfe
- 5 Years
- Technology
- Ready-to-Use Products
- Packaging Type
- Bottles
- Cans
- Pails
- Labeling Claims
- Solvent-free
- Cure
Allow to cure at room temperature for 24 hours, or cure in an oven at one of these time/temperature options:
- Benefits and Features
Very low mixed viscosity of 700 cP; Good adhesion to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics; Excellent electrical insulating characteristics; Extreme resistance to water and humidity (allows for submersion where needed); Solvent-free
- Chemical Inventories
- AICS (Australia)
- DSL (Canada)
- EINECS (EU)
- ENCS (Japan)
- IECSC (China)
- INSQ (Mexico)
- KECI (Korea)
- NCI (Vietnam)
- Ready to Use Product Features
- Abrasion Resistant
- Durable
- Electrically Insulating
- Excellent Humidity Resistance
- Excellent Substrate Adhesion
- Water Resistant
- Wide Temperature Operating Range
- Compatible Substrates and Surfaces
- Ceramic
- Composites
- Glass
- Metal
- Plastics
Technical data
Table 1 of 2
19 rows| Characteristic | Value | Unit |
|---|---|---|
| Breakdown Voltage | 36300 | V |
| CTE (Prior Tg) | 114 | ppm/˚C |
| CTE (After Tg) | 218 | ppm/˚C |
| Dielectric Constant (at 1 MHz) | 3.1 | — |
| Dielectric Strength | 370 | V/mil |
| Dissipation Factor (at 1 MHz) | 0.05 | — |
| Glass Transition Temperature (Tg) | 8.8 | ˚C |
| Hardness A | 88 | — |
| Intermittent Temperature | -50 to 150 | ˚C |
| Lap Shear (aluminum) | 3.4 | N/mm2 |
| Lap Shear (Stainless Steel) | 2.5 | N/mm2 |
| Mix Ratio | 1:1 | Volume |
Table 2 of 2
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio | 1.22:1 | Weight |
| Viscosity (at 25 ˚C) ⁽ᵇ⁾ | 0.17 | Pa·s |
