MG Chemicals 832C - Translucent Epoxy
- Chemical Family
- Epoxy & Epoxy Derivatives
Translucent Epoxy, Encapsulating & Potting Compound 832C is a rigid, amber clear epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, it can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
Product Families
- Encapsulants
Other characteristics
- Product Type
- Epoxy Sealant, Potting Compound
- Epoxy Sealant
- Potting Compound
- Compatible Substrates & Surfaces
- Ceramic, Composites, Glass, Metal, Plastics
- Markets
- Electrical & Electronics
- Shelf LIfe
- 5 Years
- Technology
- Ready-to-Use Products
- Packaging Type
- Bottles
- Cans
- Pails
- Labeling Claims
- Solvent-free
- Cure
Allow to cure at room temperature for 24 hours, or cure in an oven at one of these time/temperature options:
- Benefits and Features
Color allows for visual inspection; Low mixed viscosity of 2 700 cP; Extremely high compressive and tensile strength; Excellent adhesion to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics; Excellent electrical insulating characteristics; Extreme resistance to water and humidity; Solvent-free
- Chemical Inventories
- AICS (Australia)
- DSL (Canada)
- EINECS (EU)
- ENCS (Japan)
- IECSC (China)
- INSQ (Mexico)
- KECI (Korea)
- NCI (Vietnam)
- Dispensing Accessories
Consult the table below for accessory selection. See the Dispensing Accessories Application Guide for usage instructions.
- Ready to Use Product Features
- Abrasion Resistant
- Chemical Resistant
- Excellent Humidity Resistance
- Excellent Salt Spray Resistance
- Excellent Substrate Adhesion
- Fungus Resistant
- Good Compressive Strength
- High Tensile Strength
- Compatible Substrates and Surfaces
- Ceramic
- Composites
- Glass
- Metal
- Plastics
Technical data
Table 1 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio | 2:1 | Volume |
| Mix Ratio | 2.3:1 | Weight |
| Working Time | 1 | h |
Table 2 of 3
16 rows| Characteristic | Value | Unit |
|---|---|---|
| Breakdown Voltage | 60400 | V |
| Compressive Strength | 164 | N/mm2 |
| CTE (After Tg) | 161 | ppm/˚C |
| CTE (Prior Tg) | 150 | ppm/˚C |
| Dielectric Constant (at 1 MHz) | 2.8 | — |
| Dielectric Strength | 480 | V/mil |
| Dissipation Factor (at 1 MHz) | 0.02 | — |
| Glass Transition Temperature (Tg) | 53 | °C |
| Hardness D | 84 | — |
| Intermittent Temperature | 175 | ˚C |
| Lap Shear (Aluminum) | 18 | N/mm2 |
| Lap Shear (Stainless Steel) | 17 | N/mm2 |
Table 3 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Mixed Density | 1.07 | g/mL |
| Viscosity (at 25 ˚C) ⁽ᵃ⁾ | 1.9 | Pa·s |
| Viscosity (at 25 ˚C) ⁽ᵇ⁾ | 6.6 | Pa·s |
