MG Chemicals 832HT - High Temperature Epoxy
- Chemical Family
- Epoxy & Epoxy Derivatives
High Temperature Epoxy, Encapsulating & Potting Compound 832HT is a general purpose, rigid, black, 2-part high temperature epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is useful when extreme physical strength and chemical resistance are required. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
Product Families
- Encapsulants
Other characteristics
- Product Type
2K (2 component) Sealant, Epoxy Sealant, Potting Compound; 2K (2 component) Sealant; Epoxy Sealant; Potting Compound
- Compatible Substrates & Surfaces
- Ceramic, Composites, Glass, Metal, Plastics
- Markets
- Electrical & Electronics
- Shelf LIfe
- 5 Years
- Technology
- Ready-to-Use Products
- Packaging Type
- Bottles
- Cans
- Labeling Claims
- Solvent-free
- Cure
Allow to cure at room temperature for 24 hours, or cure in an oven at one of these time/temperature options:
- Benefits and Features
1.6A:1B volume mix ratio; Extremely high compressive and tensile strength; Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics; Excellent electrical insulating characteristics; Very broad service temperature range of -40 to 225 °C; Extreme resistance to water and humidity; Solvent-free
- Chemical Inventories
- AICS (Australia)
- DSL (Canada)
- EINECS (EU)
- IECSC (China)
- KECI (Korea)
- NCI (Vietnam)
- NZIoC (New Zealand)
- PICCS (Phillipines)
- Certifications and Compliance
- RoHS Compliant
- Ready to Use Product Features
- Anti-Static
- Chemical Resistant
- Electrically Insulating
- Excellent Dielectric Properties
- Excellent Humidity Resistance
- Excellent Salt Spray Resistance
- Excellent Substrate Adhesion
- Fungus Resistant
- Compatible Substrates and Surfaces
- Ceramic
- Composites
- Glass
- Metal
- Plastics
Technical data
Table 1 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio | 2:1 | Weight |
| Mix Ratio | 1.6:1 | Volume |
| Working Time | 1 | h |
Table 2 of 3
16 rows| Characteristic | Value | Unit |
|---|---|---|
| Breakdown Voltage | min. 50,000 | V |
| Compressive Strength | 132 | N/mm2 |
| CTE (After Tg) | 152 | ppm/˚C |
| CTE (Prior Tg) | 86 | ppm/˚C |
| Dielectric Constant (at 1 MHz) | 2.8 | — |
| Dielectric Strength | 470 | V/mil |
| Dissipation Factor (at 1 MHz) | 0.01 | — |
| Glass Transition Temperature (Tg) | 89 | °C |
| Hardness D | 87 | — |
| Intermittent Temperature | 250 | ˚C |
| Lap Shear (Aluminum) | 7.4 | N/mm2 |
| Lap Shear (Stainless Steel) | 15 | N/mm2 |
Table 3 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Mixed Density | 1.1 | g/mL |
| Viscosity (at 25 ˚C) ⁽ᵃ⁾ | 46 | Pa·s |
| Viscosity (at 25 ˚C) ⁽ᵇ⁾ | 6.6 | Pa·s |
