MG Chemicals 834FX - Flame Retardant Epoxy
- Chemical Family
- Epoxy & Epoxy Derivatives
Black Flexible Epoxy, Encapsulating & Potting Compound 834FX is a 2-part, flame-retardant, thermally conductive, fexible epoxy resin that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where minimizing the physical stress on components is critical. It is good in low temperature and arctic environments, and in applications that involve temperature cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and cost-effectiveness of epoxy.
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
Product Families
- Encapsulants
Other characteristics
- Cure Method
- Air Dry
- Product Type
2K (2 component) Sealant, Epoxy Sealant, Potting Compound; 2K (2 component) Sealant; Epoxy Sealant; Potting Compound
- Compatible Substrates & Surfaces
- Ceramic, Composites, Glass, Metal, Plastics
- Markets
- Electrical & Electronics
- Shelf LIfe
- 5 Years
- Cure
Air Dry; Allow to cure at room temperature for 24 hours, or cure in an oven at one of these time/temperature options:
- Flame Rating
- UL 94 V0
- Technology
- Ready-to-Use Products
- Key Attributes
Flexible and low modulus; Flame-retardant—meets UL 94V-0; Convenient 1A:1B volume mix ratio; Low exotherm; Good adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics; Excellent electrical insulating characteristics; Non-halogenated flame-retardant fillers; Solvent-free
- Labeling Claims
- Solvent-free
- Chemical Inventories
- AICS (Australia)
- DSL (Canada)
- IECSC (China)
- KECI (Korea)
- NCI (Vietnam)
- NZIoC (New Zealand)
- PICCS (Phillipines)
- TCSI (Taiwan)
- Certifications and Compliance
- RoHS Compliant
- UL 94
- Ready to Use Product Features
- Anti-Static
- Chemical Resistant
- Durable
- Electrically Insulating
- Excellent Dielectric Properties
- Excellent Humidity Resistance
- Excellent Salt Spray Resistance
- Excellent Substrate Adhesion
- Compatible Substrates and Surfaces
- Ceramic
- Composites
- Glass
- Metal
- Plastics
Technical data
Table 1 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio | 1:1 | Volume |
| Mix Ratio | 1:1 | Weight |
| Working Time | 2.5 | h |
Table 2 of 3
14 rows| Characteristic | Value | Unit |
|---|---|---|
| Breakdown Voltage | 48300 | V |
| Compressive Strength | 87 | N/mm2 |
| CTE (After Tg) | 114 | ppm/˚C |
| CTE (Prior Tg) | 142 | ppm/˚C |
| Dielectric Strength | 386 | V/mil |
| Glass Transition Temperature (Tg) | 50 | °C |
| Hardness D | 81 | — |
| Intermittent Temperature | 200 | ˚C |
| Lap Shear (Aluminum) | 16 | N/mm2 |
| Lap Shear (Stainless Steel) | 13 | N/mm2 |
| Resistivity | 8.2 x 10¹² | Ω·cm |
| Service Temperature Range | -30 to 175 | ˚C |
Table 3 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Mixed Density | 1.6 | g/mL |
| Viscosity (at 25 ˚C) ⁽ᵃ⁾ | 8 | Pa·s |
| Viscosity (at 25 ˚C) ⁽ᵇ⁾ | 16 | Pa·s |
