MG Chemicals 834HTC - High Thermal Conductivity Epoxy
- Chemical Family
- Epoxy & Epoxy Derivatives
High Thermal Conductivity Epoxy, Encapsulating & Potting Compound 834HTC is a 2-part, black, rigid, flameretardant thermal epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This epoxy resin is designed for applications where thermal management and selfextinguishing are critical. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
Product Families
- Encapsulants
Other characteristics
- Cure Method
- Air Dry
- Product Type
2K (2 component) Sealant, Epoxy Sealant, Potting Compound; 2K (2 component) Sealant; Epoxy Sealant; Potting Compound
- Compatible Substrates & Surfaces
- Ceramic, Composites, Glass, Metal, Plastics
- Markets
- Electrical & Electronics
- Certified
- UL 746A (File# E334302)
- Shelf LIfe
- 5 Years
- Cure
Air Dry; Allow to cure at room temperature for 24 hours, or cure in an oven at one of these time/temperature options:
- Technology
- Ready-to-Use Products
- Packaging Type
- Cans
- Labeling Claims
- Solvent-free
- Benefits and Features
Flame-retardant—UL 94V-0 approved; Low CTE; Low exotherm; High compressive and tensile strength; Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics; Excellent electrical insulating characteristics; Low shrinkage and high dimensional stability; Non-halogenated flame-retardant fillers; Solvent-free
- Chemical Inventories
- AICS (Australia)
- DSL (Canada)
- EINECS (EU)
- IECSC (China)
- KECI (Korea)
- NCI (Vietnam)
- NZIoC (New Zealand)
- PICCS (Phillipines)
- Certifications and Compliance
- RoHS Compliant
- Ready to Use Product Features
- Anti-Static
- Chemical Resistant
- Dimensional Stability
- Electrically Insulating
- Excellent Dielectric Properties
- Excellent Humidity Resistance
- Excellent Salt Spray Resistance
- Excellent Substrate Adhesion
- Compatible Substrates and Surfaces
- Ceramic
- Composites
- Glass
- Metal
- Plastics
Technical data
Table 1 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio | 10:1 | Weight |
| Mix Ratio | 5:1 | Volume |
| Working Time | 1.5 | h |
Table 2 of 3
16 rows| Characteristic | Value | Unit |
|---|---|---|
| Breakdown Voltage | 37500 | V |
| Compressive Strength | 123 | N/mm2 |
| CTE (After Tg) | 116 | ppm/˚C |
| CTE (Prior Tg) | 34 | ppm/˚C |
| Dielectric Constant (at 1 MHz) | 3.9 | — |
| Dielectric Strength | 395 | V/mil |
| Dissipation Factor (at 1 MHz) | 0.02 | — |
| Glass Transition Temperature (Tg) | 117 | ˚C |
| Hardness D | 91 | — |
| Intermittent Temperature | -55 to 165 | ˚C |
| Lap Shear (Aluminum) | 4.7 | N/mm2 |
| Lap Shear (Stainless Steel) | 6.7 | N/mm2 |
Table 3 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Mixed Density | 1.7 | g/mL |
| Viscosity (at 25 ˚C) ⁽ᵃ⁾ | 56 | Pa·s |
| Viscosity (at 25 ˚C) ⁽ᵇ⁾ | 2.4 | Pa·s |
