MG Chemicals 832TC - Thermally Conductive Epoxy
- Chemical Family
- Epoxy & Epoxy Derivatives
Thermally Conductive Epoxy, Encapsulating & Potting Compound 832TC is a 2-part, black epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is designed for applications where thermal management is a concern. Its high thermal conductivity helps protect circuits by reducing the risk of heat buildup. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
Product Families
- Encapsulants
Other characteristics
- Product Type
2K (2 component) Sealant, Epoxy Sealant, Potting Compound; 2K (2 component) Sealant; Epoxy Sealant; Potting Compound
- Compatible Substrates & Surfaces
- Ceramic, Composites, Glass, Metal, Plastics
- Markets
- Electrical & Electronics
- Shelf LIfe
- 5 Years
- Technology
- Ready-to-Use Products
- Key Attributes
Low exotherm; Convenient 1A:1B volume mix ratio; High compressive and tensile strength; Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics; Excellent electrical insulating characteristics; Extreme resistance to water and humidity; Solvent-free
- Packaging Type
- Bottles
- Cans
- Pails
- Labeling Claims
- Solvent-free
- Cure
Allow to cure at room temperature for 24 hours, or cure in an oven at one of these time/temperature options:
- Chemical Inventories
- AICS (Australia)
- DSL (Canada)
- EINECS (EU)
- IECSC (China)
- KECI (Korea)
- NCI (Vietnam)
- NZIoC (New Zealand)
- TCSI (Taiwan)
- Ready to Use Product Features
- Anti-Static
- Electrically Insulating
- Excellent Humidity Resistance
- Excellent Salt Spray Resistance
- Excellent Substrate Adhesion
- Fungus Resistant
- Good Compressive Strength
- High Tensile Strength
- Compatible Substrates and Surfaces
- Ceramic
- Composites
- Glass
- Metal
- Plastics
Technical data
Table 1 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio | 1:1 | Volume |
| Mix Ratio | 1.1:1 | Weight |
| Working Time | 2 | h |
Table 2 of 3
14 rows| Characteristic | Value | Unit |
|---|---|---|
| Breakdown Voltage | 48300 | V |
| Compressive Strength | 87 | N/mm2 |
| CTE (After Tg) | 114 | ppm/˚C |
| CTE (Prior Tg) | 142 | ppm/˚C |
| Dielectric Strength | 386 | V/mil |
| Glass Transition Temperature (Tg) | 50 | °C |
| Hardness D | 81 | — |
| Intermittent Temperature | 200 | ˚C |
| Lap Shear (Aluminum) | 16 | N/mm2 |
| Lap Shear (Stainless Steel) | 13 | N/mm2 |
| Resistivity | 8.2 x 10¹² | Ω·cm |
| Service Temperature Range | -30 to 175 | ˚C |
Table 3 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Mixed Density | 1.67 | g/mL |
| Viscosity (at 25 ˚C) ⁽ᵃ⁾ | 33 | Pa·s |
| Viscosity (at 25 ˚C) ⁽ᵇ⁾ | 12 | Pa·s |
