KRYLEX® KHC18226
- Chemical Family
- Polyurethanes (PU)
KRYLEX® KHC18226 is a one component reactive polyurethane hot melt. It is solid at room temperature. It is a thermal reactive poly-battery assembly adhesive. After being applied warm the product will cool to allow immediate handling. Upon further exposure to ambient humidity KRYLEX® KHC18226 will achieve high strength bonds and excellent environmental resistance.
Product families
Applications
- Adhesives & Sealants — Other Adhesives & Sealants Applications
- Batteries
Product Families
- Hot Melt Adhesives
Other characteristics
- Brand
- KRYLEX
- Product Type
- 1K (1 component) Adhesive, Hot Melt Adhesive
- 1K (1 component) Adhesive
- Hot Melt Adhesive
- Compatible Substrates & Surfaces
- Plastics
- Markets
- Adhesives & Sealants
- Electrical & Electronics
- Storage
Optimal storage conditions are between 15℃ to 30℃ and stored in original sealed foil bag. Storage outside this temperature range can adversely affect product properties and may reduce the stated shelf life.
- Features
High green strength.; Suitable for bonding plastic and metal membranes. Especially for ABS.PC.; Low application temperatures (170°C-195°C).; Suitable for bonding thermistor for polymer battery.; Excellent heat resistance and solvent resistance.; Excellent high temperature and low temperature resistance.
- Technology
- Ready-to-Use Products
- Use Instructions
For best results, ensure parts are clean, dry and free from oil and grease, although good bonds can still be achieved on 'as received' or slightly oily parts. The temperature of substrate should not be lower than 20℃. Low temperature will shorten the open time and cause the bonding failure. If needed, pre-heating of the substrate is recommended. Dispense bead of product onto substrate. Mate opposite substrate within recommended open time. Allow for handling strength to be achieved.
- Ready to Use Product Features
- Excellent Solvent Resistance
- Good Green Strength
- High Strength
- High Temperature Resistance
- Low Temperature Performance
- Low Temperature Resistant
- Very Good Heat Resistance
- Compatible Substrates and Surfaces
- Plastics
Technical data
Table 1 of 1
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Solid Content | 100.0 | % |
| Specific Gravity (25°C) | 1.1 | — |
| Viscosity (Brookfield HBTD 10rpm at 160°C) | 16000±3000 | cp |
| Viscosity (Brookfield HBTD 10rpm at 180°C) | 8000±2000 | cp |
| Open Time (1mm line) | min. 20 | seconds |
| Application Temperature | 170-195 | °C |
| Coefficient of Thermal Expansion | 169.8 | μm/ (mK) |
| Coefficient of Thermal Conductivity | 0.7-1.0 | W/ (mK) |
| Initial Adhesion Force (20s at 180° Peel Strength) | min. 3N / 18 | mm |
| Tensile Shear Strength | min. 3N (Line L:18mm, W:3mm) | — |
| Tensile Shear Strength | min. 6N (Link L:18mm, W:3mm) | — |
| Elongation at break | min. 50N / 18 | mm |
