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LNP™ STAT-KON™ Compound DJ000ICX4
- Chemical Family
- Polycarbonate (PC)
LNP™ STAT-KON™ Compound DJ000ICX4 is a static dissipative compound based on polycarbonate (pc) and carbon nanotube. This grade is electrically conductive and features improved processing capabilities. It offers high flow, heat stabilization, dimensional stability, and impact resistance, with low ionics, outgassing, and liquid particle count. Designed for injection molding, it is suitable for applications in mobile phones, computers, tablets, electrical devices and displays, electrical components and infrastructure, semiconductors, and electronic material handling.
Product families
Applications
Applications
- Consumer Goods — Appliances & Electronics
Electrical & Electronics — Devices & Assemblies
- Consumer Electronics
- Displays
Electrical & Electronics — Parts & Components
- Other Parts & Components
- Semiconductor Manufacturing
Product Families
Plastics — Engineering & Specialty Polymers
- Polycarbonates
Plastics — Polymer Additives
- Surface Modifiers
Other characteristics
- Brand
- LNP™ STAT-KON™ Compound
- Polymer Name
- Polycarbonate (PC)
- Fillers Included
- Carbon Nanotube
- Flexural Modulus
- 2450.0 - 2450.0 MPa
- Processing Methods
- Injection Molding
- Note
¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design. ² Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.
- Markets
- Consumer Goods
- Electrical & Electronics
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Anti-Static
- Dimensional Stability
- Electrically Conductive
- Good Processability
- Heat Stabilized
- High Flow
- Impact Resistance
- Low Liquid Particle Count
- Plastics and Elastomers End Uses
- Computer Components
- Electrical Components
- Electrical Devices
- Electronic Displays
- Electronic Material Handling
- Semiconductor Applications
- Tablets
- Plastics and Elastomers Functions
- Anti-Static Agent
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 6
19 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus (at 1 mm/min) ¹ | 2400.0 | MPa | ISO 527 |
| Tensile Stress (Yield, 50 mm/min) ¹ | 58.0 | MPa | ISO 527 |
| Tensile Stress (Break, 50 mm/min) ¹ | 50.0 | MPa | ISO 527 |
| Tensile Strain (Yield, 50 mm/min) ¹ | 4.9 | % | ISO 527 |
| Tensile Nominal Strain (Break, 50 mm/min) ¹ | 8.2 | % | ISO 527 |
| Flexural Stress (Break, 2 mm/min) ¹ | 86.0 | MPa | ISO 178 |
| Flexural Stress (at 3.5% strain, 2 mm/min) ¹ | 73.0 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹ | 2450.0 | MPa | ISO 178 |
| Flexural Strength (2 mm/min) ¹ | 91.0 | MPa | ISO 178 |
| Tensile Modulus (at 50 mm/min) ¹ | 2400.0 | MPa | ASTM D638 |
| Tensile Stress (Yield, Type I, 50 mm/min) ¹ | 60.0 | MPa | ASTM D638 |
| Tensile Stress (Break, Type I, 50 mm/min) ¹ | 50.0 | MPa | ASTM D638 |
Table 2 of 6
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹ | 1.2 | g/cm³ | ISO 1183 |
| Specific Gravity ¹ | 1.2 | — | ASTM D792 |
| Melt Volume Rate (at 300°C/5.0 kg) ¹ | 48.0 | cm³/10 min | ISO 1133 |
| Mold Shrinkage (flow) ¹ | 0.6 - 0.9 | % | SABIC method |
| Mold Shrinkage (xflow) ¹ | 0.7 - 1.0 | % | SABIC method |
Table 3 of 6
17 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Vicat Softening Temperature (at Rate A/50) ¹ | 147.0 | °C | ISO 306 |
| Vicat Softening Temperature (at Rate A/50) ¹ | 147.0 | °C | ASTM D1525 |
| Vicat Softening Temperature (at Rate A/120) ¹ | 148.0 | °C | ISO 306 |
| Vicat Softening Temperature (at Rate A/120) ¹ | 148.0 | °C | ASTM D1525 |
| Vicat Softening Temperature (at Rate B/50) ¹ | 139.0 | °C | ISO 306 |
| Vicat Softening Temperature (at Rate B/50) ¹ | 139.0 | °C | ASTM D1525 |
| Vicat Softening Temperature (at Rate B/120) ¹ | 140.0 | °C | ISO 306 |
| Vicat Softening Temperature (at Rate B/120) ¹ | 140.0 | °C | ASTM D1525 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹ | 7.0e-05 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹ | 5.5e-05 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹ | 6.2e-05 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹ | 8.0e-05 | 1/°C | ISO 11359-2 |
Table 4 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Surface Resistivity ¹ | 1E+03 - 1E+06 | Ω | ASTM D257 |
| Surface Resistivity ¹ | 1E+04 - 1E+07 | Ω | IEC 60093 |
| Volume Resistivity ¹ | 1E+04 - 1E+07 | Ω.cm | ASTM D4496 |
| Volume Resistivity ¹ | 1E+01 - 1E+03 | Ω.cm | SABIC method |
Table 5 of 6
26 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Notched 80*10*3 +23°C) ¹ | 29.0 | kJ/m² | ISO 180/1A |
| Izod Impact (Notched 80*10*3 -30°C) ¹ | 3.8 | kJ/m² | ISO 180/1A |
| Izod Impact (Unnotched 80*10*3 +23°C) ¹ | 70.0 | kJ/m² | ISO 180/1U |
| Izod Impact (Unnotched 80*10*3 -30°C )¹ | 44.0 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched 80*10*4 +23°C) ¹ | 17.0 | kJ/m² | ISO 180/1A |
| Izod Impact (Notched 80*10*4 -30°C) ¹ | 2.2 | kJ/m² | ISO 180/1A |
| Izod Impact (Unnotched 80*10*4 +23°C) ¹ | 125.0 | kJ/m² | ISO 180/1U |
| Izod Impact (Unnotched 80*10*4 -30°C) ¹ | 57.0 | kJ/m² | ISO 180/1U |
| Charpy Impact (at 23°C, V-notch Edgew 80*10*4 sp=62mm) ¹ | 26.0 | kJ/m² | ISO 179/1eA |
| Charpy Impact (at -30°C, V-notch Edgew 80*10*4 sp=62mm) ¹ | 9.7 | kJ/m² | ISO 179/1eA |
| Charpy Impact (at 23°C, Unnotch Edgew 80*10*4 sp=62mm) ¹ | 99.0 | kJ/m² | ISO 179/1eU |
| Charpy Impact (at -30°C, Unnotch Edgew 80*10*4 sp=62mm) ¹ | 68.0 | kJ/m² | ISO 179/1eU |
Table 6 of 6
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ² | 110 - 120 | °C |
| Drying Time ² | 2 - 4 | Hrs |
| Drying Time (Cumulative) ² | 8.0 | Hrs |
| Maximum Moisture Content ² | 0.2 | % |
| Melt Temperature ² | 300 - 330 | °C |
| Rear - Zone 1 Temperature ² | 280 - 310 | °C |
| Middle - Zone 2 Temperature ² | 290 - 320 | °C |
| Front - Zone 3 Temperature ² | 300 - 330 | °C |
| Nozzle Temperature ² | 300 - 330 | °C |
| Mold Temperature ² | 80 - 120 | °C |
| Back Pressure ² | 0.3 - 0.7 | MPa |
| Screw speed (Circumferential speed) ² | 0.15 - 0.25 | m/s |
