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LNP™ STAT-KON™ Compound DX02728C
- Chemical Family
- Polycarbonate (PC)
SABIC's Specialties Business LNP™ STAT-KON™ DX02728C compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive.
Product families
Applications
Applications
- Consumer Goods — Appliances & Electronics
Industrial — Chemical & Industrial Manufacturing
- Equipment & Parts
Electrical & Electronics — Devices & Assemblies
- Consumer Electronics
- Displays
- Industrial Automation
Electrical & Electronics — Parts & Components
- Connectors
- Semiconductor Manufacturing
- Switches & Relays
Product Families
Plastics — Engineering & Specialty Polymers
- High Performance Thermoplastics
- Polycarbonates
Other characteristics
- Brand
- LNP™ STAT-KON™ Compound
- Polymer Name
- Polycarbonate (PC)
- Fillers Included
- Carbon Fiber
- Flexural Modulus
- 5920.0 - 5920.0 MPa
- Additives Included
- Heat Stabilizer, Mold Release Agent
- Heat Stabilizer
- Mold Release Agent
- Processing Methods
- Injection Molding
- Note
⁷ Параметры литья под давлением упоминаются только в качестве общих рекомендаций. Они могут не применяться или требовать корректировки в конкретных ситуациях, таких как малые объемы впрыска, литье крупногабаритных деталей, литье тонкостенных изделий и газовая инжекция.. ¹¹ Информация, указанная в технических паспортах, должна использоваться только для целей выбора материала и не должна применяться в качестве спецификации или использоваться для проектирования деталей или пресс-форм.
- Markets
- Consumer Goods
- Electrical & Electronics
- Industrial
- Technology
- Plastics
- Material Features
- Electrically Conductive
- Good Mold Release
- Heat Stabilized
- High Stiffness
- High Strength
- Light Weight
- Low Liquid Particle Count
- Low Outgassing
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Cell Phones
- Computer Components
- Displays
- Electrical Components
- Electrical/Electronic Applications
- Industrial Applications
- Semiconductor Applications
- Tablets
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break) ¹¹ | 99 | MPa | ASTM D638 |
| Tensile Strain (Break) ¹¹ | 6.5 | % | ASTM D638 |
| Flexural Stress ¹¹ | 165 | MPa | ASTM D790 |
| Flexural Modulus ¹¹ | 5920 | MPa | ASTM D790 |
Table 2 of 5
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.24 | g/cm³ | ASTM D792 |
Table 3 of 5
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 143 | °C | ASTM D648 |
Table 4 of 5
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Notched, at 23°C) ¹¹ | 64 | J/m | ASTM D256 |
| Instrumented Dart Impact Energy (Peak, at 23°C) ¹¹ | 14 | J | ASTM D3763 |
Table 5 of 5
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 120 | °C |
| Drying Time ⁷ | 4 | Hrs |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 305 - 325 | °C |
| Front - Zone 3 Temperature ⁷ | 320 - 330 | °C |
| Middle - Zone 2 Temperature ⁷ | 310 - 320 | °C |
| Rear - Zone 1 Temperature ⁷ | 295 - 305 | °C |
| Mold Temperature ⁷ | 80 - 110 | °C |
| Back Pressure ⁷ | 0.2 - 0.3 | MPa |
| Screw Speed ⁷ | 30 - 60 | rpm |
